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H01L2224/81065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81065being reducing

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Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding semiconductor elements to a substrate, including...
- Patent number 11,776,933
- Issue date Oct 3, 2023
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,515,286
- Issue date Nov 29, 2022
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,476,229
- Issue date Oct 18, 2022
- Kioxia Corporation
- Chikara Miyazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,930,695
- Issue date Feb 23, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,903,200
- Issue date Jan 26, 2021
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,576
- Issue date Dec 1, 2020
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,796,958
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,777,454
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,651,086
- Issue date May 12, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,600,773
- Issue date Mar 24, 2020
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,600,838
- Issue date Mar 24, 2020
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking for integrated circuit manufacturing
- Patent number 10,361,140
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, method for manufacturing the electronic device,...
- Patent number 10,283,434
- Issue date May 7, 2019
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,163,847
- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced volume interconnect for three-dimensional chip stack
- Patent number 9,679,875
- Issue date Jun 13, 2017
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for electrically contacting terminal faces of two...
- Patent number 9,649,711
- Issue date May 16, 2017
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,595,507
- Issue date Mar 14, 2017
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step direct bonding processes and tools for performing the same
- Patent number 9,521,795
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 9,443,820
- Issue date Sep 13, 2016
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...
- Publication number 20240266318
- Publication date Aug 8, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...
- Publication number 20240063169
- Publication date Feb 22, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
- Publication number 20230282607
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Ting Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MONITORING GAS BYPRODUCTS OF A BONDING SYSTEM, AND RELAT...
- Publication number 20230260953
- Publication date Aug 17, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...
- Publication number 20230133526
- Publication date May 4, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
- Publication number 20210265303
- Publication date Aug 26, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225921
- Publication date Jul 22, 2021
- Sony Semiconductor Solutions Corporation
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200294960
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Chikara MIYAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200185373
- Publication date Jun 11, 2020
- Toshiba Memory Corporation
- Yuji KARAKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190326344
- Publication date Oct 24, 2019
- SONY CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20190326190
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20180374751
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180337091
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180315655
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180261574
- Publication date Sep 13, 2018
- Toshiba Memory Corporation
- Yuji KARAKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180076187
- Publication date Mar 15, 2018
- Toshiba Memory Corporation
- Yuji KARAKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20150024555
- Publication date Jan 22, 2015
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140361445
- Publication date Dec 11, 2014
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...
- Publication number 20140363965
- Publication date Dec 11, 2014
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140299986
- Publication date Oct 9, 2014
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140284817
- Publication date Sep 25, 2014
- Kabushiki Kaisha Toshiba
- Takao SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-Step Direct Bonding Processes and Tools for Performing the Same
- Publication number 20140263583
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

being reducing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Semiconductor device and method of manufacturing the same

Methods of bonding semiconductor elements to a substrate, including...

Structures and methods for low temperature bonding using nanoparticles

Methods of bonding of semiconductor elements to substrates, and rel...

Semiconductor device and method of manufacturing thereof

Semiconductor device manufacturing method

Semiconductor device and method of manufacturing the same

Semiconductor device manufacturing method

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Semiconductor device and manufacturing method thereof

3D integration method using SOI substrates and structures produced...

3D integration method using SOI substrates and structures produced...

Chip packages with sintered interconnects formed out of pads

3D integration method using SOI substrates and structures produced...

Semiconductor device manufacturing method

Semiconductor device and method of manufacturing thereof

Structures and methods for low temperature bonding using nanoparticles

Semiconductor chip mounted on a packaging substrate

Wafer stacking for integrated circuit manufacturing

Method for producing semiconductor chip

Electronic device, method for manufacturing the electronic device,...

Method for producing semiconductor package

Reduced volume interconnect for three-dimensional chip stack

Method and device for electrically contacting terminal faces of two...

Semiconductor device and method of manufacturing the same

Two-step direct bonding processes and tools for performing the same

Device and method for bonding substrates

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...

BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...

METHODS OF MONITORING GAS BYPRODUCTS OF A BONDING SYSTEM, AND RELAT...

BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...

Structures And Methods For Low Temperature Bonding Using Nanoparticles

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Structures And Methods For Low Temperature Bonding Using Nanoparticles

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

Novel 3D Integration Method Using SOI Substrates and Structures Pro...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Two-Step Direct Bonding Processes and Tools for Performing the Same