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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/1308
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,243,843
Issue date
Mar 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
12,237,282
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Huan Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure having molding layer
Patent number
12,218,095
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,218,096
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Yeongkwon Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure for heat dissipation
Patent number
12,218,026
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
Patent number
12,207,569
Issue date
Jan 21, 2025
Rigetti & Co, LLC
Jayss Daniel Marshall
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
Patent number
12,206,056
Issue date
Jan 21, 2025
Electronics and Telecommunications Research Institute
Kwang-Seong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
12,191,287
Issue date
Jan 7, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fine pitch copper pillar package and method
Patent number
12,191,241
Issue date
Jan 7, 2025
Amkor Technology Singapore Holding Pte Ltd.
Robert Francis Darveaux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-molded leadframes in semiconductor devices
Patent number
12,191,273
Issue date
Jan 7, 2025
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframes in semiconductor devices
Patent number
12,183,703
Issue date
Dec 31, 2024
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,183,701
Issue date
Dec 31, 2024
Rohm Co., Ltd.
Bungo Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low cost package warpage solution
Patent number
12,183,596
Issue date
Dec 31, 2024
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
Patent number
12,176,902
Issue date
Dec 24, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single-shot encapsulation
Patent number
12,166,001
Issue date
Dec 10, 2024
Semtech Corporation
Kok Khoon Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device having redistribution pattern
Patent number
12,154,881
Issue date
Nov 26, 2024
Samsung Electronics Co., Ltd.
Yunrae Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding structures and methods for forming the same
Patent number
12,148,725
Issue date
Nov 19, 2024
AG MATERIALS TECHNOLOGY CO., LTD.
Tung-Han Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with die support structures
Patent number
12,148,727
Issue date
Nov 19, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tools and systems for processing semiconductor devices, and methods...
Patent number
12,142,594
Issue date
Nov 12, 2024
Taiwan Semiconductor Manufacturing Company
Kuei-Wei Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming semiconductor package and semiconductor package
Patent number
12,125,776
Issue date
Oct 22, 2024
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method for fabricating the same
Patent number
12,125,838
Issue date
Oct 22, 2024
Samsung Display Co., Ltd.
Seung Geun Lee
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Semiconductor device and method of manufacturing semiconductor device
Patent number
12,119,323
Issue date
Oct 15, 2024
Kioxia Corporation
Soichi Homma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a structure
Patent number
12,107,069
Issue date
Oct 1, 2024
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Nohora-Lizeth Caicedo Panqueva
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
Patent number
12,100,679
Issue date
Sep 24, 2024
Dialog Semiconductor (UK) Limited
Habeeb Mohiuddin Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for preparing same
Patent number
12,100,680
Issue date
Sep 24, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Luguang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive members for die attach in flip chip packages
Patent number
12,100,678
Issue date
Sep 24, 2024
Texas Instruments Incorporated
Christopher Daniel Manack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with surface-mount die support struct...
Patent number
12,087,720
Issue date
Sep 10, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump structure having a side recess and semiconductor structure inc...
Patent number
12,087,718
Issue date
Sep 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Horng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Joint structure in semiconductor package and manufacturing method t...
Patent number
12,087,727
Issue date
Sep 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,080,638
Issue date
Sep 3, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250079360
Publication date
Mar 6, 2025
MEDIATEK INC.
Cheng Lin HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC Chip Comprising Backside Power Delivery Network and 3D Stacked N...
Publication number
20250081600
Publication date
Mar 6, 2025
iCometrue Company Ltd.
Jin-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250079369
Publication date
Mar 6, 2025
Rohm Co., Ltd.
Bungo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
Publication number
20250079376
Publication date
Mar 6, 2025
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...
Publication number
20250079371
Publication date
Mar 6, 2025
Micron Technology, Inc.
Christopher Glancey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
Publication number
20250062298
Publication date
Feb 20, 2025
JCET Group Co., Ltd.
Yaojian LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20250054885
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsing-Hsiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250044510
Publication date
Feb 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
G02 - OPTICS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20250046659
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Se Ra Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Advanced Device Assembly Structures And Methods
Publication number
20250033138
Publication date
Jan 30, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250022758
Publication date
Jan 16, 2025
Samsung Electronics Co., Ltd.
Yongho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250006686
Publication date
Jan 2, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Jae Hun Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...
Publication number
20250006661
Publication date
Jan 2, 2025
TEXAS INSTRUMENTS INCORPORATED
Guangxu Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
Publication number
20240429191
Publication date
Dec 26, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
Publication number
20240421045
Publication date
Dec 19, 2024
TEXAS INSTRUMENTS INCORPORATED
Christopher Daniel Manack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
Publication number
20240421112
Publication date
Dec 19, 2024
Rohm Co., Ltd.
Yuta KASHITANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES
Publication number
20240413114
Publication date
Dec 12, 2024
TEXAS INSTRUMENTS INCORPORATED
Christopher Daniel MANACK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240404971
Publication date
Dec 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzuan-Horng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION
Publication number
20240395768
Publication date
Nov 28, 2024
Toyota Research Institute, Inc.
Jiexiong TANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
Publication number
20240395746
Publication date
Nov 28, 2024
SK HYNIX INC.
Jae Jun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
Publication number
20240395754
Publication date
Nov 28, 2024
Sumitomo Electric Industries, Ltd.
Yutaka MORIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
Publication number
20240395767
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuei-Wei Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...
Publication number
20240387429
Publication date
Nov 21, 2024
QUALCOMM Incorporated
Yujen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD
Publication number
20240387444
Publication date
Nov 21, 2024
Panasonic Intellectual Property Management Co., Ltd.
TAKAHIRO KUMAKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20240387335
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Ling Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...
Publication number
20240387386
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company Limited
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MAKING
Publication number
20240387500
Publication date
Nov 21, 2024
Yibu Semiconductor Co., Ltd.
Ming Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
Publication number
20240380401
Publication date
Nov 14, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
G11 - INFORMATION STORAGE
Information
Patent Application
CHIP PACKAGE
Publication number
20240379566
Publication date
Nov 14, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240363518
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing company Ltd.
KUO-CHIANG TING
H01 - BASIC ELECTRIC ELEMENTS