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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14151being uniform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure
- Patent number 11,502,052
- Issue date Nov 15, 2022
- Novatek Microelectronics Corp.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure
- Patent number 10,734,344
- Issue date Aug 4, 2020
- Novatek Microelectronics Corp.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of an integrated circuit chip and of a plate
- Patent number 9,941,188
- Issue date Apr 10, 2018
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package configurations and methods of making the same
- Patent number 9,799,628
- Issue date Oct 24, 2017
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including asymmetric electrode arrangement
- Patent number 9,585,197
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Chin-sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,449,904
- Issue date Sep 20, 2016
- Renesas Electronics Corporation
- Nobuyuki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,224,705
- Issue date Dec 29, 2015
- Seiko Epson Corporation
- Shigehisa Tajimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,224,713
- Issue date Dec 29, 2015
- Kabushiki Kaisha Toshiba
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including unitary supports
- Patent number 9,087,729
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Sang-Oh Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled collapse chip connection (C4) structure and methods of f...
- Patent number 8,765,593
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,710,654
- Issue date Apr 29, 2014
- Kabushiki Kaisha Toshiba
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for manufacturing the same
- Patent number 8,426,255
- Issue date Apr 23, 2013
- ChipMOS Technologies, Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with plank stack of semiconductor dies
- Patent number 8,390,109
- Issue date Mar 5, 2013
- Oracle America, Inc.
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,378,486
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,008,182
- Issue date Aug 30, 2011
- Seiko Epson Corporation
- Tatsuhiko Asakawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION
- Publication number 20230395486
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220392979
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sang Duk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE OF CHIP
- Publication number 20220336398
- Publication date Oct 20, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20200321300
- Publication date Oct 8, 2020
- NOVATEK MICROELECTRONICS CORP.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20190198473
- Publication date Jun 27, 2019
- NOVATEK MICROELECTRONICS CORP.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180197831
- Publication date Jul 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE
- Publication number 20170133297
- Publication date May 11, 2017
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150179545
- Publication date Jun 25, 2015
- SK Hynix, Inc.
- Rae Hyung JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING UNITARY SUPPORTS
- Publication number 20150041973
- Publication date Feb 12, 2015
- Samsung Electronics Co., Ltd.
- Sang-Oh PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140291836
- Publication date Oct 2, 2014
- SEIKO EPSON CORPORATION
- Shigehisa TAJIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PLURAL SEMICOND...
- Publication number 20140295620
- Publication date Oct 2, 2014
- Youkou ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140206144
- Publication date Jul 24, 2014
- KABUSHIKI KAISHA TOSHIBA
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...
- Publication number 20140042630
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130134583
- Publication date May 30, 2013
- Kabushiki Kaisha Toshiba
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PLURAL SEMICOND...
- Publication number 20130137216
- Publication date May 30, 2013
- Elpida Memory, Inc.
- Youkou ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130065361
- Publication date Mar 14, 2013
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120175698
- Publication date Jul 12, 2012
- Renesas Electronics Corporation
- Nobuyuki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)
- Publication number 20120080789
- Publication date Apr 5, 2012
- Sharp Kabushiki Kaisha
- Motoji Shiota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20110095420
- Publication date Apr 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100201001
- Publication date Aug 12, 2010
- SEIKO EPSON CORPORATION
- Tatsuhiko ASAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-CHIP DEVICE
- Publication number 20100052111
- Publication date Mar 4, 2010
- Kabushiki Kaisha Toshiba
- Yukihiro Urakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CHECKING ELECTRICAL CONTACT POINTS OF SEMICON...
- Publication number 20090173138
- Publication date Jul 9, 2009
- QIMONDA AG
- Holger Hoppe
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080224331
- Publication date Sep 18, 2008
- SEIKO EPSON CORPORATION
- Yuzo NEISHI
- H01 - BASIC ELECTRIC ELEMENTS

being uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for packing optimization of semiconductor devices

Coupling inductors in an IC device using interconnecting elements w...

Chip structure

Method and system for packing optimization of semiconductor devices

Method and system for packing optimization of semiconductor devices

Chip structure

Semiconductor package with heat-dissipating structure and method of...

Assembly of an integrated circuit chip and of a plate

Stacked package configurations and methods of making the same

Semiconductor device including asymmetric electrode arrangement

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor devices including unitary supports

Controlled collapse chip connection (C4) structure and methods of f...

Semiconductor device and manufacturing method thereof

Chip package structure and method for manufacturing the same

Chip package with plank stack of semiconductor dies

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Patents Applicationslast 30 patents

BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION

DISPLAY DEVICE

BUMP STRUCTURE OF CHIP

Method and System for Packing Optimization of Semiconductor Devices

Method and System for Packing Optimization of Semiconductor Devices

CHIP STRUCTURE

CHIP STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES INCLUDING UNITARY SUPPORTS

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PLURAL SEMICOND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PLURAL SEMICOND...

CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)

Semiconductor device and method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

STACKED-CHIP DEVICE

SYSTEM AND METHOD FOR CHECKING ELECTRICAL CONTACT POINTS OF SEMICON...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME