Bipolar transistors-ion implantation

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CPC
Y10S148/01

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S148/00Metal treatment

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Y10S148/01Bipolar transistors-ion implantation

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Patents Grantslast 30 patents

Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,564,414
- Issue date Feb 7, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,431,368
- Issue date Aug 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,391,143
- Issue date Jul 12, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a bipolar transistor with maskless self-aligned e...
- Patent number 9,356,097
- Issue date May 31, 2016
- GLOBALFOUNDRIES Inc.
- David L. Harame
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,331,149
- Issue date May 3, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for cleaning distilling columns
- Patent number 9,102,604
- Issue date Aug 11, 2015
- Baxter International Inc.
- Leonid A. Rozov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,082,627
- Issue date Jul 14, 2015
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 8,153,505
- Issue date Apr 10, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 8,053,329
- Issue date Nov 8, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,998,844
- Issue date Aug 16, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Hisashi Ohtani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,871,898
- Issue date Jan 18, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,807,549
- Issue date Oct 5, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Diamond substrate formation for electronic assemblies
- Patent number 7,713,839
- Issue date May 11, 2010
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High purity tantalum, products containing the same, and methods of...
- Patent number 7,585,380
- Issue date Sep 8, 2009
- Cabot Corporation
- Christopher A. Michaluk
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,553,744
- Issue date Jun 30, 2009
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a complex structure by assembling stressed stru...
- Patent number 7,550,052
- Issue date Jun 23, 2009
- Commissariat a l'Energie Atomique
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High purity tantalum, products containing the same, and methods of...
- Patent number 7,431,782
- Issue date Oct 7, 2008
- Cabot Corporation
- Christopher A. Michaluk
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of manufacturing external force detection sensor
- Patent number 7,393,714
- Issue date Jul 1, 2008
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,387,944
- Issue date Jun 17, 2008
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,335,572
- Issue date Feb 26, 2008
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 7,126,212
- Issue date Oct 24, 2006
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an external force detection sensor
- Patent number 7,067,344
- Issue date Jun 27, 2006
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 7,056,775
- Issue date Jun 6, 2006
- Semiconductor Energy Laboratory Co., Ltd.
- Hongyong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an external force detection sensor
- Patent number 7,049,165
- Issue date May 23, 2006
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,041,178
- Issue date May 9, 2006
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,037,371
- Issue date May 2, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shin Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 6,998,639
- Issue date Feb 14, 2006
- Semiconductor Energy Laboratory Co., Ltd.
- Hisashi Ohtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 6,984,571
- Issue date Jan 10, 2006
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BIPOLAR TRANSISTOR WITH MASKLESS SELF-ALIGNED EMITTER
- Publication number 20140374802
- Publication date Dec 25, 2014
- International Business Machines Corporation
- David L. Harame
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140206176
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140203407
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Low Temperature Bonding And Bonded Structure
- Publication number 20120097638
- Publication date Apr 26, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20120034766
- Publication date Feb 9, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Hisashi OHTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE
- Publication number 20110067803
- Publication date Mar 24, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20100163169
- Publication date Jul 1, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20090263953
- Publication date Oct 22, 2009
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20090035923
- Publication date Feb 5, 2009
- Semiconductor Energy Laboratory Co., Ltd.
- Hisashi Ohtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20080093747
- Publication date Apr 24, 2008
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20080061418
- Publication date Mar 13, 2008
- Ziptronix
- Paul Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20080063878
- Publication date Mar 13, 2008
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20080053959
- Publication date Mar 6, 2008
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20060292744
- Publication date Dec 28, 2006
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing a complex structure by assembling stressed stru...
- Publication number 20060141742
- Publication date Jun 29, 2006
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20060131583
- Publication date Jun 22, 2006
- Semiconductor Energy Laboratory Co., Ltd.
- Hisashi Ohtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an external force detection sensor
- Publication number 20060110843
- Publication date May 25, 2006
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Diamond substrate formation for electronic assemblies
- Publication number 20060073640
- Publication date Apr 6, 2006
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabricating the same
- Publication number 20050245053
- Publication date Nov 3, 2005
- Semiconductor Energy Laboratory Co., Ltd.
- Hongyong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20050079712
- Publication date Apr 14, 2005
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-on-insulator wafer for RF integrated circuit
- Publication number 20040159908
- Publication date Aug 19, 2004
- Mohammed A. Fathimulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20040152282
- Publication date Aug 5, 2004
- Ziptronix, Inc.
- Qin-Yin Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming electronic dies wherein each die has a layer of s...
- Publication number 20040121561
- Publication date Jun 24, 2004
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an external force detection sensor
- Publication number 20040110318
- Publication date Jun 10, 2004
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon-on-insulator wafer for RF integrated circuit
- Publication number 20040002197
- Publication date Jan 1, 2004
- Honeywell International Inc.
- Mohammed A. Fathimulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for low temperature bonding and bonded structure
- Publication number 20030211705
- Publication date Nov 13, 2003
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High purity tantalum, products containing the same, and methods of...
- Publication number 20030168131
- Publication date Sep 11, 2003
- Christopher A. Michaluk
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CVD apparatus
- Publication number 20030140941
- Publication date Jul 31, 2003
- Semiconductor Energy Laboratory Co., Ltd.
- Takashi Inushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High purity tantalum, products containing the same, and methods of...
- Publication number 20030037847
- Publication date Feb 27, 2003
- Christopher A. Michaluk
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor device for fabricating the same
- Publication number 20030022467
- Publication date Jan 30, 2003
- Semiconductor Energy Laboratory Co., Ltd.
- Hongyong Zang
- H01 - BASIC ELECTRIC ELEMENTS

Bipolar transistors-ion implantation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Method of forming a bipolar transistor with maskless self-aligned e...

Method for low temperature bonding and bonded structure

Methods for cleaning distilling columns

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Method for manufacturing a semiconductor device

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Diamond substrate formation for electronic assemblies

High purity tantalum, products containing the same, and methods of...

Method for low temperature bonding and bonded structure

Method of producing a complex structure by assembling stressed stru...

High purity tantalum, products containing the same, and methods of...

Method of manufacturing external force detection sensor

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Three dimensional device integration method and integrated device

Method of manufacturing an external force detection sensor

Semiconductor device and process for fabricating the same

Method of manufacturing an external force detection sensor

Method for low temperature bonding and bonded structure

Method for fabricating semiconductor device

Method for manufacturing a semiconductor device

Three dimensional device integration method and integrated device

Patents Applicationslast 30 patents

BIPOLAR TRANSISTOR WITH MASKLESS SELF-ALIGNED EMITTER

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Method For Low Temperature Bonding And Bonded Structure

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Method for manufacturing a semiconductor device

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Three dimensional device integration method and integrated device

Method of producing a complex structure by assembling stressed stru...

Method for manufacturing a semiconductor device

Method of manufacturing an external force detection sensor

Diamond substrate formation for electronic assemblies

Semiconductor device and process for fabricating the same

Method for low temperature bonding and bonded structure

Silicon-on-insulator wafer for RF integrated circuit

Method for low temperature bonding and bonded structure

Method of forming electronic dies wherein each die has a layer of s...

Method of manufacturing an external force detection sensor

Silicon-on-insulator wafer for RF integrated circuit

Method for low temperature bonding and bonded structure

High purity tantalum, products containing the same, and methods of...

CVD apparatus

High purity tantalum, products containing the same, and methods of...

Semiconductor device for fabricating the same