Bismuth [Bi] as principal constituent

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CPC
H01L2224/81413

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81413Bismuth [Bi] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, electronic substrate, and method for producing electroni...
- Patent number 11,094,658
- Issue date Aug 17, 2021
- Lenovo (Singapore) Pte. Ltd.
- Tadashi Kosuga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,546,836
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming fine-pitch copper bump structures
- Patent number 9,978,656
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted structure and manufacturing method of mounted structure
- Patent number 9,603,295
- Issue date Mar 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure and method of forming same
- Patent number 9,559,070
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive pillars having recesses or pro...
- Patent number 9,478,513
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure AMD method of forming same
- Patent number 9,305,856
- Issue date Apr 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 9,136,167
- Issue date Sep 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method of manufacturing semiconductor appa...
- Patent number 9,105,625
- Issue date Aug 11, 2015
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a post-passivation i...
- Patent number 9,006,891
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bump formed on substrate to prevent ELK I...
- Patent number 8,884,339
- Issue date Nov 11, 2014
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with non-metal sidewall protection structure
- Patent number 8,841,766
- Issue date Sep 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming conductive pillars havin...
- Patent number 8,741,764
- Issue date Jun 3, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure with barrier layer on post-passivation interconnect
- Patent number 8,716,858
- Issue date May 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure
- Patent number 8,581,400
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bump formed on substrate to prevent...
- Patent number 8,519,536
- Issue date Aug 27, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method of forming bump on substrate to prevent ELK IL...
- Patent number 8,367,467
- Issue date Feb 5, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit module
- Patent number 5,829,125
- Issue date Nov 3, 1998
- Taiyo Yuden Co., Ltd.
- Masayuki Fujimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE, ELECTRONIC SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONI...
- Publication number 20200373268
- Publication date Nov 26, 2020
- LENOVO (SINGAPORE) PTE. LTD.
- Tadashi Kosuga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20180082982
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME
- Publication number 20170120396
- Publication date May 4, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- NAOMICHI OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20140363970
- Publication date Dec 11, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Conductive Pillars Having Recesses or Pro...
- Publication number 20140225256
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE
- Publication number 20140049930
- Publication date Feb 20, 2014
- PANASONIC CORPORATION
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A POST-PASSIVATION I...
- Publication number 20140045326
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump on Substrate to Pre...
- Publication number 20130264705
- Publication date Oct 10, 2013
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PASSIVATION INTERCONNECT STRUCTURE AMD METHOD OF FORMING SAME
- Publication number 20130207258
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Pillars Havin...
- Publication number 20130146872
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING FINE-PITCH COPPER BUMP STRUCTURES
- Publication number 20130127045
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BONDING PROCESS FORMING A SEMICONDUCTOR CHIP IN MULTIPLE STA...
- Publication number 20130105969
- Publication date May 2, 2013
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POST-PASSIVATION INTERCONNECT STRUCTURE
- Publication number 20130093077
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump on Substrate to Pre...
- Publication number 20130087913
- Publication date Apr 11, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...
- Publication number 20130043585
- Publication date Feb 21, 2013
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE WITH BARRIER LAYER ON POST-PASSIVATION INTERCONNECT
- Publication number 20120326298
- Publication date Dec 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump on Substrate to Pre...
- Publication number 20110260316
- Publication date Oct 27, 2011
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110233761
- Publication date Sep 29, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Bismuth [Bi] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of making a pillar structure having a non-metal sidewall pro...

Wafer level integration including design/co-design, structure proce...

Substrate, electronic substrate, and method for producing electroni...

Wafer level integration including design/co-design, structure proce...

Micro-transfer printing with volatile adhesive layer

Mechanisms for forming fine-pitch copper bump structures

Mounted structure and manufacturing method of mounted structure

Post-passivation interconnect structure and method of forming same

Semiconductor device with conductive pillars having recesses or pro...

Post-passivation interconnect structure AMD method of forming same

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor apparatus, method of manufacturing semiconductor appa...

Method of making a semiconductor device having a post-passivation i...

Semiconductor device with bump formed on substrate to prevent ELK I...

Cu pillar bump with non-metal sidewall protection structure

Semiconductor device and method of forming conductive pillars havin...

Bump structure with barrier layer on post-passivation interconnect

Post-passivation interconnect structure

Semiconductor device including bump formed on substrate to prevent...

Integrated circuit device having die bonded to the polymer side of...

Semiconductor method of forming bump on substrate to prevent ELK IL...

Method of manufacturing circuit module

Patents Applicationslast 30 patents

SUBSTRATE, ELECTRONIC SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONI...

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...

Semiconductor Device with Conductive Pillars Having Recesses or Pro...

MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE

METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A POST-PASSIVATION I...

Semiconductor Device and Method of Forming Bump on Substrate to Pre...

POST-PASSIVATION INTERCONNECT STRUCTURE AMD METHOD OF FORMING SAME

Semiconductor Device and Method of Forming Conductive Pillars Havin...

MECHANISMS FOR FORMING FINE-PITCH COPPER BUMP STRUCTURES

SOLDER BONDING PROCESS FORMING A SEMICONDUCTOR CHIP IN MULTIPLE STA...

POST-PASSIVATION INTERCONNECT STRUCTURE

Semiconductor Device and Method of Forming Bump on Substrate to Pre...

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...

BUMP STRUCTURE WITH BARRIER LAYER ON POST-PASSIVATION INTERCONNECT

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...

Semiconductor Device and Method of Forming Bump on Substrate to Pre...

CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE