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B81C2201/0125

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2201/00Manufacture or treatment of micro-structural devices or systems

Current Industry

B81C2201/0125Blanket removal

Industries

Patents Grantslast 30 patents

Information Patent Grant
Laser-assisted material phase-change and expulsion micro-machining...
- Patent number 12,077,432
- Issue date Sep 3, 2024
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adaptive cavity thickness control for micromachined ultrasonic tran...
- Patent number 12,070,773
- Issue date Aug 27, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Composite spring structure to reinforce mechanical robustness of a...
- Patent number 11,993,510
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction bottom cavity surface for micromachined ultrasonic tr...
- Patent number 11,883,845
- Issue date Jan 30, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,873,212
- Issue date Jan 16, 2024
- Xintec Inc.
- Wei-Luen Suen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 11,806,747
- Issue date Nov 7, 2023
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a membrane component and a membrane component
- Patent number 11,708,265
- Issue date Jul 25, 2023
- X-FAB Global Services GmbH
- Steffen Leopold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure for integrated microphone
- Patent number 11,678,133
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package comprising multi-depth trenches
- Patent number 11,667,522
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for sensors on glass
- Patent number 11,608,265
- Issue date Mar 21, 2023
- Infineon Technologies AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Adaptive cavity thickness control for micromachined ultrasonic tran...
- Patent number 11,583,894
- Issue date Feb 21, 2023
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction bottom cavity surface for micromachined ultrasonic tr...
- Patent number 11,571,711
- Issue date Feb 7, 2023
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 11,484,911
- Issue date Nov 1, 2022
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Plurality of filters
- Patent number 11,440,009
- Issue date Sep 13, 2022
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive micromachined ultrasonic transducer (CMUT) devices and m...
- Patent number 11,440,051
- Issue date Sep 13, 2022
- General Electric Company
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Composite spring structure to reinforce mechanical robustness of a...
- Patent number 11,420,866
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structures and design struct...
- Patent number 11,167,980
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS structure and method of forming the same
- Patent number 11,148,936
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated package structure for MEMS element and ASIC chip and met...
- Patent number 11,130,674
- Issue date Sep 28, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a micromechanical sensor
- Patent number 11,111,137
- Issue date Sep 7, 2021
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar electrode arrays and fabrication methods thereof
- Patent number 10,969,359
- Issue date Apr 6, 2021
- National Technology & Engineering Solutions of Sandia, LLC
- Eric John Schindelholz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,961,118
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,899,608
- Issue date Jan 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-depth MEMS package
- Patent number 10,865,102
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a microphone
- Patent number 10,779,100
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming multi-depth MEMS package
- Patent number 10,752,495
- Issue date Aug 25, 2020
- Taiwan Semiconductor Maufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structures and design struct...
- Patent number 10,589,991
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structures and design struct...
- Patent number 10,589,992
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,556,792
- Issue date Feb 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming multi-depth MEMS package
- Patent number 10,556,790
- Issue date Feb 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...
- Publication number 20240416385
- Publication date Dec 19, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...
- Publication number 20240409398
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20240270565
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY H...
- Publication number 20240262682
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Raphael Schuler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TR...
- Publication number 20240100566
- Publication date Mar 28, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR AND FORMATION METHOD THEREFOR
- Publication number 20240027488
- Publication date Jan 25, 2024
- SEMICONDUCTOR MANUFACTURING ELECTRONICS (SHAOXING) CORPORATION
- Zhaolin ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20240024917
- Publication date Jan 25, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Self-Aligned Acoustic Hole Formation in Piezoelectrical MEMS Microp...
- Publication number 20230357000
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TR...
- Publication number 20230149976
- Publication date May 18, 2023
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...
- Publication number 20230149977
- Publication date May 18, 2023
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL INFRARED SENSING DEVICE AND FABRICATION METH...
- Publication number 20230045432
- Publication date Feb 9, 2023
- Industrial Technology Research Institute
- Chin-Jou KUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20230017034
- Publication date Jan 19, 2023
- BFLY Operations, Inc
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20220306454
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Structure for Sensors on Glass
- Publication number 20220009771
- Publication date Jan 13, 2022
- INFINEON TECHNOLOGIES AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20210292157
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210269303
- Publication date Sep 2, 2021
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) DEVICES AND M...
- Publication number 20210260622
- Publication date Aug 26, 2021
- GENERAL ELECTRIC COMPANY
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMBRANE COMPONENT AND A MEMBRANE COMPONENT
- Publication number 20210206629
- Publication date Jul 8, 2021
- X-FAB Global Services GmbH
- Steffen Leopold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Laser-Assisted Material Phase-Change and Expulsion Micro-Machining...
- Publication number 20210139321
- Publication date May 13, 2021
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE
- Publication number 20210078858
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE
- Publication number 20200346923
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20200324319
- Publication date Oct 15, 2020
- Butterfly Network, Inc.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...
- Publication number 20200269279
- Publication date Aug 27, 2020
- Butterfly Network, Inc.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND MET...
- Publication number 20200262700
- Publication date Aug 20, 2020
- J-METRICS TECHNOLOGY Co., Ltd.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING DUAL-CAVITY STRUCTURE, AND DUAL-CAVITY STR...
- Publication number 20200216307
- Publication date Jul 9, 2020
- CSMC TECHNOLOGIES FAB2 CO., LTD.
- Dan Dai
- B60 - VEHICLES IN GENERAL
Information Patent Application
ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TR...
- Publication number 20200156110
- Publication date May 21, 2020
- Butterfly Network, Inc.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF MANUFA...
- Publication number 20200156111
- Publication date May 21, 2020
- VERMON S.A.
- Dominique GROSS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200140266
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-HUEI PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE
- Publication number 20200109046
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Blanket removal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laser-assisted material phase-change and expulsion micro-machining...

Adaptive cavity thickness control for micromachined ultrasonic tran...

Composite spring structure to reinforce mechanical robustness of a...

Anti-stiction bottom cavity surface for micromachined ultrasonic tr...

Chip package and manufacturing method thereof

Bottom electrode via structures for micromachined ultrasonic transd...

Method for manufacturing a membrane component and a membrane component

Structure for integrated microphone

MEMS package comprising multi-depth trenches

Method and structure for sensors on glass

Adaptive cavity thickness control for micromachined ultrasonic tran...

Anti-stiction bottom cavity surface for micromachined ultrasonic tr...

Bottom electrode via structures for micromachined ultrasonic transd...

Plurality of filters

Capacitive micromachined ultrasonic transducer (CMUT) devices and m...

Composite spring structure to reinforce mechanical robustness of a...

Micro-electro-mechanical system (MEMS) structures and design struct...

CMOS-MEMS structure and method of forming the same

Integrated package structure for MEMS element and ASIC chip and met...

Method for manufacturing a micromechanical sensor

Planar electrode arrays and fabrication methods thereof

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Multi-depth MEMS package

Method for manufacturing a microphone

Method for forming multi-depth MEMS package

Micro-electro-mechanical system (MEMS) structures and design struct...

Micro-electro-mechanical system (MEMS) structures and design struct...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Method for forming multi-depth MEMS package

Patents Applicationslast 30 patents

ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY H...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TR...

INERTIAL SENSOR AND FORMATION METHOD THEREFOR

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...

Self-Aligned Acoustic Hole Formation in Piezoelectrical MEMS Microp...

ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TR...

ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...

MICROELECTROMECHANICAL INFRARED SENSING DEVICE AND FABRICATION METH...

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

Method and Structure for Sensors on Glass

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) DEVICES AND M...

METHOD FOR MANUFACTURING A MEMBRANE COMPONENT AND A MEMBRANE COMPONENT

Laser-Assisted Material Phase-Change and Expulsion Micro-Machining...

METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE

METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...

ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...

INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND MET...

METHOD FOR MANUFACTURING DUAL-CAVITY STRUCTURE, AND DUAL-CAVITY STR...

ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TR...

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF MANUFA...

CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME

METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE