Bonding a wafer on the substrate

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B81C2203/0118

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/0118Bonding a wafer on the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 12,209,015
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package for device
- Patent number 12,209,012
- Issue date Jan 28, 2025
- Teknologian tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 12,122,667
- Issue date Oct 22, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-acoustic wafer-level package and method of manufacture
- Patent number 12,071,339
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Manuel Hofer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed, toughened glass package and method for produci...
- Patent number 11,993,511
- Issue date May 28, 2024
- Schott AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed transparent cavity and package for same
- Patent number 11,975,962
- Issue date May 7, 2024
- Schott AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods including panel bonding acts and electronic devices includi...
- Patent number 11,921,032
- Issue date Mar 5, 2024
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods including panel bonding acts and electronic devices includi...
- Patent number 11,885,736
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical shear weld wafer bonding
- Patent number 11,858,806
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric microelectromechanical resonator device and correspon...
- Patent number 11,855,604
- Issue date Dec 26, 2023
- STMicroelectronics S.r.l.
- Federico Vercesi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS ultrasonic transducers and related apparatus and methods
- Patent number 11,833,542
- Issue date Dec 5, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 11,795,053
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resonance device and method for producing resonance device
- Patent number 11,757,425
- Issue date Sep 12, 2023
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensing implant
- Patent number 11,707,230
- Issue date Jul 25, 2023
- ENDOTRONIX, INC.
- Harry Rowland
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a microelectromechanical structure a...
- Patent number 11,691,870
- Issue date Jul 4, 2023
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 11,685,648
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capping plate for panel scale packaging of MEMS products
- Patent number 11,685,649
- Issue date Jun 27, 2023
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS ultrasonic transducers and related apparatus and methods
- Patent number 11,684,949
- Issue date Jun 27, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a microelectromechanical structure a...
- Patent number 11,667,519
- Issue date Jun 6, 2023
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 11,667,523
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packaging structure and manufacturing method therefor
- Patent number 11,667,518
- Issue date Jun 6, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Xiaoshan Qin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS vibrator and MEMS oscillator
- Patent number 11,655,145
- Issue date May 23, 2023
- Kaneka Corporation
- Junji Sone
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
- Publication number 20240400374
- Publication date Dec 5, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Fabrication Process with Reduced Z-Axis Stiction
- Publication number 20240375937
- Publication date Nov 14, 2024
- NXP USA, Inc.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20240368746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY H...
- Publication number 20240262682
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Raphael Schuler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF
- Publication number 20240239648
- Publication date Jul 18, 2024
- STMicroelectronics S.r.l.
- Silvia NICOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR
- Publication number 20240208804
- Publication date Jun 27, 2024
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CA...
- Publication number 20240199415
- Publication date Jun 20, 2024
- STMicroelectronics International N.V.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE
- Publication number 20240166499
- Publication date May 23, 2024
- Murata Manufacturing Co., Ltd.
- Mikko PARTANEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPON...
- Publication number 20240154599
- Publication date May 9, 2024
- STMicroelectronics S.r.l.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...
- Publication number 20240124299
- Publication date Apr 18, 2024
- STMicroelectronics S.r.l.
- Paolo FERRARI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE
- Publication number 20240116753
- Publication date Apr 11, 2024
- Murata Manufacturing Co., Ltd.
- Antti IIHOLA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116751
- Publication date Apr 11, 2024
- XINTEC INC.
- Chia-Ming CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
- Publication number 20240100565
- Publication date Mar 28, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...
- Publication number 20240002217
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSING IMPLANT
- Publication number 20230380764
- Publication date Nov 30, 2023
- ENDOTRONIX, INC.
- Harry ROWLAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package and Method for Encapsulating an MEMS Structure
- Publication number 20230382722
- Publication date Nov 30, 2023
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Frank SENGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...
- Publication number 20230288695
- Publication date Sep 14, 2023
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Packages and Methods of Manufacture Thereof
- Publication number 20230278857
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE WITH AN ANCHOR
- Publication number 20230234837
- Publication date Jul 27, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Guofeng Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MAKING MEMS MICROPHONE WITH AN ANCHOR
- Publication number 20230239641
- Publication date Jul 27, 2023
- Skyworks Solutions, Inc.
- Guofeng Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENVIRONMENTAL SENSOR AND PREPARATION METHOD THEREFOR
- Publication number 20230192477
- Publication date Jun 22, 2023
- Multidimension Technology Co., Ltd
- Insik JIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...
- Publication number 20230146158
- Publication date May 11, 2023
- Murata Manufacturing Co., Ltd.
- Kaoru KISHIGUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME
- Publication number 20230128755
- Publication date Apr 27, 2023
- SCHOTT AG
- Antti Määttänen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING
- Publication number 20230100911
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS INCLUDING PANEL BONDING ACTS AND ELECTRONIC DEVICES INCLUDI...
- Publication number 20230085825
- Publication date Mar 23, 2023
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COVER FOR AN INFRARED DETECTOR AND A METHOD OF FABRICATING A COVER...
- Publication number 20230084280
- Publication date Mar 16, 2023
- Meridian Innovation Pte Ltd
- Xintong ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE BONDLINE CONTROL STRUCTURE
- Publication number 20230064645
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bonding a wafer on the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS packages and methods of manufacture thereof

Wafer level package for device

Method and system for fabricating a MEMS device

Anti-stiction process for MEMS device

Undercut-free patterned aluminum nitride structure and methods for...

Sensor devices with gas-permeable cover and associated production m...

Micro-acoustic wafer-level package and method of manufacture

Hermetically sealed, toughened glass package and method for produci...

MEMS resonator system

Hermetically sealed transparent cavity and package for same

Systems and methods for providing getters in microelectromechanical...

Methods including panel bonding acts and electronic devices includi...

Methods including panel bonding acts and electronic devices includi...

Vertical shear weld wafer bonding

Piezoelectric microelectromechanical resonator device and correspon...

CMOS ultrasonic transducers and related apparatus and methods

Sensor devices with gas-permeable cover and associated production m...

Method of room temperature covalent bonding

Resonance device and method for producing resonance device

Packaging method and associated packaging structure

Pressure sensing implant

Stacked-die MEMS resonator

Semiconductor device including a microelectromechanical structure a...

MEMS packages and methods of manufacture thereof

Capping plate for panel scale packaging of MEMS products

CMOS ultrasonic transducers and related apparatus and methods

Semiconductor device including a microelectromechanical structure a...

Optical electronics device

MEMS packaging structure and manufacturing method therefor

MEMS vibrator and MEMS oscillator

Patents Applicationslast 30 patents

STACKED-DIE MEMS RESONATOR

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

MEMS Device and Fabrication Process with Reduced Z-Axis Stiction

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY H...

MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF

MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR

EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CA...

METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE

PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPON...

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...

PRESSURE SENSING IMPLANT

MEMS Package and Method for Encapsulating an MEMS Structure

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...

MEMS Packages and Methods of Manufacture Thereof

MEMS MICROPHONE WITH AN ANCHOR

METHOD OF MAKING MEMS MICROPHONE WITH AN ANCHOR

MEMS ENVIRONMENTAL SENSOR AND PREPARATION METHOD THEREFOR

PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...

HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME

PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING

METHODS INCLUDING PANEL BONDING ACTS AND ELECTRONIC DEVICES INCLUDI...

COVER FOR AN INFRARED DETECTOR AND A METHOD OF FABRICATING A COVER...

PROTECTIVE BONDLINE CONTROL STRUCTURE