Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body

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H01L2224/05548

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05548Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor redistribution structure with integrated test pad and...
- Patent number 12,288,759
- Issue date Apr 29, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
- Patent number 12,288,761
- Issue date Apr 29, 2025
- SK Hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including recognition marks
- Patent number 12,278,193
- Issue date Apr 15, 2025
- SK hynix Inc.
- Hyun Chul Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, apparatus, and chip
- Patent number 12,278,200
- Issue date Apr 15, 2025
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 12,211,705
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,205,937
- Issue date Jan 21, 2025
- LG Electronics Inc.
- Taehoon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method and apparatus for improved wafer coating
- Patent number 12,199,054
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Feng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level dicing method and semiconductor device
- Patent number 12,176,248
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,874
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip structure with conductive structure
- Patent number 12,057,419
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device including crack detection line ele...
- Patent number 12,016,217
- Issue date Jun 18, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Linhong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor with through-substrate interconnect
- Patent number 11,978,656
- Issue date May 7, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method for manufacturing the same, and display...
- Patent number 11,901,375
- Issue date Feb 13, 2024
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Yongbo Ju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a resin that seals a rewiring
- Patent number 11,894,325
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Manato Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,887,950
- Issue date Jan 30, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takuya Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,869,775
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,854,826
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,823,912
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,817,405
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Sumin Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079379
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20250069954
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
- Publication number 20250038044
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yingcheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE
- Publication number 20250006779
- Publication date Jan 2, 2025
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...
- Publication number 20240395747
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...
- Publication number 20240395674
- Publication date Nov 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20240395742
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240355728
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347487
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE LAYER
- Publication number 20240347488
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...
- Publication number 20240282729
- Publication date Aug 22, 2024
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240282736
- Publication date Aug 22, 2024
- Japan Display Inc.
- Yoichi KAMIJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT
- Publication number 20240282620
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240213192
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- KYONGSOON CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20240213200
- Publication date Jun 27, 2024
- Rohm Co., Ltd.
- Reona TAKEOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20240178180
- Publication date May 30, 2024
- TOKYO ELECTRON LIMITED
- Sitaram ARKALGUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER
- Publication number 20240153893
- Publication date May 9, 2024
- Qorvo US, Inc.
- Michael Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND...
- Publication number 20240145404
- Publication date May 2, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
- Publication number 20240120211
- Publication date Apr 11, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240090239
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Kiichi TACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
- Publication number 20240072002
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Raj K. Bansal
- H01 - BASIC ELECTRIC ELEMENTS

Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor redistribution structure with integrated test pad and...

Semiconductor device including re-distribution pads disposed at dif...

Semiconductor devices including recognition marks

Semiconductor element, apparatus, and chip

Integrated structure with bifunctional routing and assembly compris...

Stiffener package and method of fabricating stiffener package

Display device

Method and apparatus for improved wafer coating

Fine pitch copper pillar package and method

Wafer level dicing method and semiconductor device

Stacked semiconductor devices and methods of forming same

Single-shot encapsulation

Semiconductor device

Fan-out interconnect integration processes and structures

Method for forming chip structure with conductive structure

Display panel and display device including crack detection line ele...

Semiconductor with through-substrate interconnect

Silicon photonic interposer with two metal redistribution layers

Stacked integrated circuits with redistribution lines

Method for fabricating a chip package

Array substrate and method for manufacturing the same, and display...

Conductive traces in semiconductor devices and methods of forming same

Semiconductor device having a resin that seals a rewiring

Solid-state imaging device and electronic apparatus

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor packages

Metal oxide layered structure and methods of forming the same

Semiconductor device and method of manufacturing the same

Stacked semiconductor devices and methods of forming same

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUITS WITH CAPACITORS

MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES

CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...

SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CHIP STRUCTURE WITH CONDUCTIVE LAYER

PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING SAME

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...

CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND...

STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE

DOCUMENT STRUCTURE FORMATION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS