Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body

Industry

CPC
H01L2224/05548

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05548Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip structure with conductive structure
- Patent number 12,057,419
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device including crack detection line ele...
- Patent number 12,016,217
- Issue date Jun 18, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Linhong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor with through-substrate interconnect
- Patent number 11,978,656
- Issue date May 7, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method for manufacturing the same, and display...
- Patent number 11,901,375
- Issue date Feb 13, 2024
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Yongbo Ju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a resin that seals a rewiring
- Patent number 11,894,325
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Manato Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,887,950
- Issue date Jan 30, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takuya Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,869,775
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,854,826
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,823,912
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,817,405
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Sumin Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a dummy section
- Patent number 11,798,847
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,798,860
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finer grain dynamic random access memory
- Patent number 11,791,317
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 11,764,078
- Issue date Sep 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layouts for pads and conductive lines of memory devices, and relate...
- Patent number 11,742,306
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Takashi Ishihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated passive device and fabrication method using a last throu...
- Patent number 11,735,497
- Issue date Aug 22, 2023
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 11,699,678
- Issue date Jul 11, 2023
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,977
- Issue date Jun 13, 2023
- Sony Group Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metalization with through-wafer-via processing to allow us...
- Patent number 11,652,079
- Issue date May 16, 2023
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240355728
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347487
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE LAYER
- Publication number 20240347488
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...
- Publication number 20240282729
- Publication date Aug 22, 2024
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240282736
- Publication date Aug 22, 2024
- Japan Display Inc.
- Yoichi KAMIJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT
- Publication number 20240282620
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240213192
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- KYONGSOON CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20240213200
- Publication date Jun 27, 2024
- Rohm Co., Ltd.
- Reona TAKEOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20240178180
- Publication date May 30, 2024
- TOKYO ELECTRON LIMITED
- Sitaram ARKALGUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER
- Publication number 20240153893
- Publication date May 9, 2024
- Qorvo US, Inc.
- Michael Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND...
- Publication number 20240145404
- Publication date May 2, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
- Publication number 20240120211
- Publication date Apr 11, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240090239
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Kiichi TACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
- Publication number 20240072002
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Raj K. Bansal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS
- Publication number 20240038695
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...
- Publication number 20240038694
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...
- Publication number 20240021552
- Publication date Jan 18, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021550
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021551
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PAD STRUCTURE RESISTANT TO PLASMA DAMAGE...
- Publication number 20240014154
- Publication date Jan 11, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Wu-Te WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20230411317
- Publication date Dec 21, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING
- Publication number 20230395538
- Publication date Dec 7, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...
- Publication number 20230395543
- Publication date Dec 7, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kai TIAN
- H01 - BASIC ELECTRIC ELEMENTS

Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out interconnect integration processes and structures

Method for forming chip structure with conductive structure

Display panel and display device including crack detection line ele...

Semiconductor with through-substrate interconnect

Silicon photonic interposer with two metal redistribution layers

Stacked integrated circuits with redistribution lines

Method for fabricating a chip package

Array substrate and method for manufacturing the same, and display...

Conductive traces in semiconductor devices and methods of forming same

Semiconductor device having a resin that seals a rewiring

Solid-state imaging device and electronic apparatus

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor packages

Metal oxide layered structure and methods of forming the same

Semiconductor device and method of manufacturing the same

Stacked semiconductor devices and methods of forming same

Semiconductor device and method of fabricating the same

Method for manufacturing a semiconductor device having a dummy section

Semiconductor structure and manufacturing method thereof

Finer grain dynamic random access memory

Stiffener package and method of fabricating stiffener package

Layouts for pads and conductive lines of memory devices, and relate...

Integrated passive device and fabrication method using a last throu...

Semiconductor device and method of forming insulating layers around...

Fan-out interconnect integration processes and structures

Semiconductor device and method of making wafer level chip scale pa...

Semiconductor device

Bump-on-trace design for enlarge bump-to-trace distance

Backside metalization with through-wafer-via processing to allow us...

Raised via for terminal connections on different planes

Patents Applicationslast 30 patents

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CHIP STRUCTURE WITH CONDUCTIVE LAYER

PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING SAME

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...

CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND...

STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE

DOCUMENT STRUCTURE FORMATION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS

VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS

THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...

CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH PAD STRUCTURE RESISTANT TO PLASMA DAMAGE...

CHIP PACKAGE

CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...