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CPC
H01L2224/0603

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0603Bonding areas having different sizes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,191,289
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,165,997
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,154,900
- Issue date Nov 26, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 12,107,042
- Issue date Oct 1, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,761
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,762
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device, and ele...
- Patent number 12,089,457
- Issue date Sep 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shinichi Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component with conductive terminals of different...
- Patent number 12,074,066
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power converter, and method of manufacturing...
- Patent number 12,074,132
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Yo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,074,158
- Issue date Aug 27, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,068,741
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,063,030
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, circuit board and electronic device comprising polygonal pads
- Patent number 12,057,420
- Issue date Aug 6, 2024
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Jinfu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a pad where a driving chip is mounted
- Patent number 12,055,827
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High speed, efficient SiC power module
- Patent number 12,046,998
- Issue date Jul 23, 2024
- Wolfspeed, Inc.
- Mrinal K. Das
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 12,046,538
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250022824
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022758
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE
- Publication number 20250006779
- Publication date Jan 2, 2025
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS
- Publication number 20250006681
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429142
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...
- Publication number 20240421053
- Publication date Dec 19, 2024
- Qianli MU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20240421073
- Publication date Dec 19, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS
- Publication number 20240413237
- Publication date Dec 12, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE, AND ELE...
- Publication number 20240407216
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- Shinichi Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395648
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...
- Publication number 20240387526
- Publication date Nov 21, 2024
- Infineon Technologies Austria AG
- Gerhard Thomas Nöbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387422
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240379600
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
- Publication date Nov 7, 2024
- NANO-X IMAGING LTD.
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240363415
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED
- Publication number 20240361650
- Publication date Oct 31, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
- Publication number 20240363556
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20240363622
- Publication date Oct 31, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...
- Publication number 20240355858
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...
- Publication number 20240349520
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Moorym CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240339423
- Publication date Oct 10, 2024
- CXMT Corporation
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas having different sizes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-chip packaging

Semiconductor device

Display device including anisotropic conductive film (ACF)

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and semiconductor package

Semiconductor device assembly with die support structures

Method for forming semiconductor package and semiconductor package

Bonded assembly containing different size opposing bonding pads and...

Display device and method for fabricating the same

Method for fabricating semiconductor device with redistribution plugs

Localized high density substrate routing

Wrap-around source/drain method of making contacts for backside metals

Wrap-around source/drain method of making contacts for backside metals

Semiconductor device assembly with surface-mount die support struct...

Display device and method for manufacturing display device, and ele...

Semiconductor package and methods of manufacturing a semiconductor...

Integrated circuit component with conductive terminals of different...

Semiconductor device, power converter, and method of manufacturing...

Semiconductor device

Switching device and electronic circuit

Switching device and electronic circuit

Semiconductor device including source pad region and drain pad regi...

Chip, circuit board and electronic device comprising polygonal pads

Display device including a pad where a driving chip is mounted

High speed, efficient SiC power module

Packaging of a semiconductor device with a plurality of leads

Semiconductor device including through via structure

Power module and fabrication method of the same, graphite plate, an...

Light-emitting substrate, method of manufacturing light-emitting su...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE, AND ELE...

SEMICONDUCTOR DEVICE

TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

HIGH SPEED, EFFICIENT SIC POWER MODULE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED

INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION

Semiconductor Device

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...