Bonding areas having different sizes

Industry

CPC
H01L2224/0603

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0603Bonding areas having different sizes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 12,107,042
- Issue date Oct 1, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,761
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,762
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device, and ele...
- Patent number 12,089,457
- Issue date Sep 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shinichi Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component with conductive terminals of different...
- Patent number 12,074,066
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power converter, and method of manufacturing...
- Patent number 12,074,132
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Yo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,074,158
- Issue date Aug 27, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,068,741
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,063,030
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, circuit board and electronic device comprising polygonal pads
- Patent number 12,057,420
- Issue date Aug 6, 2024
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Jinfu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a pad where a driving chip is mounted
- Patent number 12,055,827
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High speed, efficient SiC power module
- Patent number 12,046,998
- Issue date Jul 23, 2024
- Wolfspeed, Inc.
- Mrinal K. Das
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 12,046,538
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 12,035,471
- Issue date Jul 9, 2024
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Andu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
- Patent number 12,027,489
- Issue date Jul 2, 2024
- Ukyo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including chip pads of different surface areas,...
- Patent number 12,021,515
- Issue date Jun 25, 2024
- SK hynix Inc.
- Ju Il Eom
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Display panel and display device
- Patent number 12,021,049
- Issue date Jun 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device including crack detection line ele...
- Patent number 12,016,217
- Issue date Jun 18, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Linhong Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387422
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...
- Publication number 20240387526
- Publication date Nov 21, 2024
- Infineon Technologies Austria AG
- Gerhard Thomas Nöbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240379600
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
- Publication date Nov 7, 2024
- NANO-X IMAGING LTD.
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240363415
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED
- Publication number 20240361650
- Publication date Oct 31, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device
- Publication number 20240363622
- Publication date Oct 31, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Application
INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
- Publication number 20240363556
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...
- Publication number 20240355858
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...
- Publication number 20240349520
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Moorym CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240339423
- Publication date Oct 10, 2024
- CXMT Corporation
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20240332176
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240312934
- Publication date Sep 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20240304447
- Publication date Sep 12, 2024
- Rohm Co., Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240306303
- Publication date Sep 12, 2024
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240290694
- Publication date Aug 29, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...
- Publication number 20240282729
- Publication date Aug 22, 2024
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas having different sizes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Method for forming semiconductor package and semiconductor package

Bonded assembly containing different size opposing bonding pads and...

Display device and method for fabricating the same

Method for fabricating semiconductor device with redistribution plugs

Localized high density substrate routing

Wrap-around source/drain method of making contacts for backside metals

Wrap-around source/drain method of making contacts for backside metals

Semiconductor device assembly with surface-mount die support struct...

Display device and method for manufacturing display device, and ele...

Semiconductor package and methods of manufacturing a semiconductor...

Integrated circuit component with conductive terminals of different...

Semiconductor device, power converter, and method of manufacturing...

Semiconductor device

Switching device and electronic circuit

Switching device and electronic circuit

Semiconductor device including source pad region and drain pad regi...

Chip, circuit board and electronic device comprising polygonal pads

Display device including a pad where a driving chip is mounted

High speed, efficient SiC power module

Packaging of a semiconductor device with a plurality of leads

Semiconductor device including through via structure

Power module and fabrication method of the same, graphite plate, an...

Light-emitting substrate, method of manufacturing light-emitting su...

Circuit structure

Chip package structure

Systems and methods for fabricating silicon die stacks for electron...

Semiconductor chip including chip pads of different surface areas,...

Display panel and display device

Display panel and display device including crack detection line ele...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...

HIGH SPEED, EFFICIENT SIC POWER MODULE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED

Semiconductor Device

INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

Semiconductor Packages and Methods of Forming the Same

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR POWER DEVICE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

ELECTRONIC DEVICE

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PASSIVE ELEMENT AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...