Bonding tips therefor

Industry

CPC
B23K20/025

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat

Current Industry

B23K20/025Bonding tips therefor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 11,765,837
- Issue date Sep 19, 2023
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for temperature modification and reduction of...
- Patent number 11,515,171
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Xiaopeng Qu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding head and a bonding apparatus having the same
- Patent number 11,456,273
- Issue date Sep 27, 2022
- Samsung Electronics Co., Ltd.
- Jaecheol Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding and indexing apparatus
- Patent number 11,362,058
- Issue date Jun 14, 2022
- Nexperia B.V.
- Ralph Huybers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 11,191,169
- Issue date Nov 30, 2021
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression apparatus and method of manufacturing electronic...
- Patent number 11,139,626
- Issue date Oct 5, 2021
- TDK Corporation
- Koki Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer uniting method
- Patent number 10,916,466
- Issue date Feb 9, 2021
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 10,813,230
- Issue date Oct 20, 2020
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heater chip, joining apparatus and joining method
- Patent number 10,799,977
- Issue date Oct 13, 2020
- KOBO PDA CO., LTD.
- Shinichi Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 10,448,517
- Issue date Oct 15, 2019
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lattice reinforced armor array
- Patent number 9,658,033
- Issue date May 23, 2017
- Armorworks Enterprises LLC
- William J. Perciballi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip bonding tool tip
- Patent number 7,389,905
- Issue date Jun 24, 2008
- Steven F. Reiber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic armor and method of making by encapsulation in a hot presse...
- Patent number 7,077,306
- Issue date Jul 18, 2006
- Cercom, Inc.
- Richard John Palicka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tool with resistance
- Patent number 7,032,802
- Issue date Apr 25, 2006
- Steven F. Reiber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dissipative ceramic bonding tool tip
- Patent number 6,935,548
- Issue date Aug 30, 2005
- Steven-Frederick Reiber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool for thermo-compression-bonding chips, and chip packaging devic...
- Patent number 6,821,381
- Issue date Nov 23, 2004
- Toray Engineering Co., Ltd.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dissipative ceramic bonding tool tip
- Patent number 6,651,864
- Issue date Nov 25, 2003
- Steven Frederick Reiber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method and mounting apparatus for electronic part
- Patent number 6,543,668
- Issue date Apr 8, 2003
- Taiyo Yuden Co., Ltd.
- Tomonori Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dissipative ceramic bonding tip
- Patent number 6,354,479
- Issue date Mar 12, 2002
- SJM Technologies
- Steven Frederick Reiber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond head having dual axes of motion
- Patent number 6,102,275
- Issue date Aug 15, 2000
- Palomar Technologies, Inc.
- William H. Hill
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire cutting and feeding device for use in wire bonding apparatus
- Patent number 6,089,439
- Issue date Jul 18, 2000
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure head with pivot rod gimbal horn with zero adjust
- Patent number 6,006,978
- Issue date Dec 28, 1999
- David W. Swanson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure head with dual horns
- Patent number 5,996,434
- Issue date Dec 7, 1999
- David W. Swanson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High strength bonding tool and a process for production of the same
- Patent number 5,934,542
- Issue date Aug 10, 1999
- Sumitomo Electric Industries, Inc.
- Tsutomu Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High efficiency thermal interposer
- Patent number 5,915,462
- Issue date Jun 29, 1999
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor inner lead bonding tool
- Patent number 5,868,301
- Issue date Feb 9, 1999
- Tessera, Inc.
- Thomas H. Distefano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High efficiency thermal interposer
- Patent number 5,669,437
- Issue date Sep 23, 1997
- International Business Machines Corporation
- Bernardo Hernandez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High strength bonding tool and a process for the production of the...
- Patent number 5,653,376
- Issue date Aug 5, 1997
- Sumitomo Electric Industries, Inc.
- Tsutomu Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermode solder blade with electric heater greater than four ohms
- Patent number 5,650,081
- Issue date Jul 22, 1997
- Zevatech, Inc.
- Edison T. Hudson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20240008189
- Publication date Jan 4, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING TOOLS, AND RELATED METHODS OF PROVIDING THE SAME
- Publication number 20230347442
- Publication date Nov 2, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Cristian D. Cionea
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING AND INDEXING METHOD
- Publication number 20220310553
- Publication date Sep 29, 2022
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DIFFUSION JOINING AND DEVICE THEREFOR WITH PRESSURE VARI...
- Publication number 20220097167
- Publication date Mar 31, 2022
- Nils HANEKLAUS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20220095463
- Publication date Mar 24, 2022
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION AND REDUCTION OF...
- Publication number 20210384042
- Publication date Dec 9, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20210014977
- Publication date Jan 14, 2021
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING HEAD AND A BONDING APPARATUS HAVING THE SAME
- Publication number 20200343215
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- JAECHEOL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER UNITING METHOD
- Publication number 20200058537
- Publication date Feb 20, 2020
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING AND INDEXING APPARATUS
- Publication number 20190206829
- Publication date Jul 4, 2019
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC...
- Publication number 20180351315
- Publication date Dec 6, 2018
- TDK Corporation
- Koki SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATER CHIP, JOINING APPARATUS AND JOINING METHOD
- Publication number 20180185953
- Publication date Jul 5, 2018
- KOBO PDA CO., LTD.
- Shinichi HARADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMO COMPRESSION DEVICE FOR PRESSING PRINTED CIRCUIT BOARD ON ELE...
- Publication number 20130264374
- Publication date Oct 10, 2013
- HON HAI Precision Industry CO., LTD.
- CHIH-CHEN LAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heater chip for thermocompression bonding
- Publication number 20070187366
- Publication date Aug 16, 2007
- Tatsuya Ishii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC ARMOR AND METHOD OF MAKING BY ENCAPSULATION IN A HOT PRESSE...
- Publication number 20060105184
- Publication date May 18, 2006
- CERCOM, INC.
- Richard John Palicka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip bonding tool tip
- Publication number 20050109817
- Publication date May 26, 2005
- Steven F. Reiber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding tool with resistance
- Publication number 20050109814
- Publication date May 26, 2005
- Steven F. Reiber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dissipative ceramic bonding tool tip
- Publication number 20040046007
- Publication date Mar 11, 2004
- Steven-Frederick Reiber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dissipative ceramic bonding tool tip
- Publication number 20020096551
- Publication date Jul 25, 2002
- Steven Frederick Reiber
- H01 - BASIC ELECTRIC ELEMENTS

Bonding tips therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for flexible circuit cable attachment

Method and apparatus for flexible circuit cable attachment

Methods and apparatus for temperature modification and reduction of...

Bonding head and a bonding apparatus having the same

Bonding and indexing apparatus

Method and apparatus for flexible circuit cable attachment

Thermocompression apparatus and method of manufacturing electronic...

Wafer uniting method

Method and apparatus for flexible circuit cable attachment

Heater chip, joining apparatus and joining method

Method and apparatus for flexible circuit cable attachment

Lattice reinforced armor array

Flip chip bonding tool tip

Ceramic armor and method of making by encapsulation in a hot presse...

Bonding tool with resistance

Dissipative ceramic bonding tool tip

Tool for thermo-compression-bonding chips, and chip packaging devic...

Dissipative ceramic bonding tool tip

Mounting method and mounting apparatus for electronic part

Dissipative ceramic bonding tip

Bond head having dual axes of motion

Wire cutting and feeding device for use in wire bonding apparatus

Pressure head with pivot rod gimbal horn with zero adjust

Pressure head with dual horns

High strength bonding tool and a process for production of the same

High efficiency thermal interposer

Semiconductor inner lead bonding tool

High efficiency thermal interposer

High strength bonding tool and a process for the production of the...

Thermode solder blade with electric heater greater than four ohms

Patents Applicationslast 30 patents

Method and Apparatus for Flexible Circuit Cable Attachment

WIRE BONDING TOOLS, AND RELATED METHODS OF PROVIDING THE SAME

BONDING AND INDEXING METHOD

METHOD FOR DIFFUSION JOINING AND DEVICE THEREFOR WITH PRESSURE VARI...

Method and Apparatus for Flexible Circuit Cable Attachment

METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION AND REDUCTION OF...

Method and Apparatus for Flexible Circuit Cable Attachment

BONDING HEAD AND A BONDING APPARATUS HAVING THE SAME

WAFER UNITING METHOD

BONDING AND INDEXING APPARATUS

THERMOCOMPRESSION APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC...

HEATER CHIP, JOINING APPARATUS AND JOINING METHOD

THERMO COMPRESSION DEVICE FOR PRESSING PRINTED CIRCUIT BOARD ON ELE...

Heater chip for thermocompression bonding

CERAMIC ARMOR AND METHOD OF MAKING BY ENCAPSULATION IN A HOT PRESSE...

Flip chip bonding tool tip

Bonding tool with resistance

Dissipative ceramic bonding tool tip

Dissipative ceramic bonding tool tip