Bump and layer connectors

Industry

CPC
H01L2224/73103

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73103Bump and layer connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 12,046,560
- Issue date Jul 23, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and semiconductor die
- Patent number 12,021,057
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer stacking structure and manufacturing method thereof
- Patent number 11,967,558
- Issue date Apr 23, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,430,740
- Issue date Aug 30, 2022
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor isolation
- Patent number 10,753,963
- Issue date Aug 25, 2020
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,714,457
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,600,729
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,515,918
- Issue date Dec 24, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 10,468,367
- Issue date Nov 5, 2019
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-applying supporting materials between bonded package components
- Patent number 10,366,971
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor isolation
- Patent number 10,345,343
- Issue date Jul 9, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,290,611
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,163,840
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic element with bond elements to encapsulation surface
- Patent number 10,008,477
- Issue date Jun 26, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240389363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
- Publication date Oct 3, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240321814
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CARRIER BOARD INTEGRATED WITH INDUCTIVE CIRCUIT STRUCTURE A...
- Publication number 20240222140
- Publication date Jul 4, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230109292
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hwail JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE
- Publication number 20230063539
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220406722
- Publication date Dec 22, 2022
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERPOSER OF GLASS AND SILICON TO REDUCE THERMAL CROSSTALK
- Publication number 20210118756
- Publication date Apr 22, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20210111140
- Publication date Apr 15, 2021
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20200343224
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURRENT SENSOR ISOLATION
- Publication number 20190277889
- Publication date Sep 12, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20190267354
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190221513
- Publication date Jul 18, 2019
- Samsung Electronics Co., Ltd.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CONTACTING SPACER
- Publication number 20190214274
- Publication date Jul 11, 2019
- STMicroelectronics (Grenoble 2) SAS
- David AUCHERE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ISOLATION STRUCTURE
- Publication number 20190157222
- Publication date May 23, 2019
- NXP USA, Inc.
- Nishant LAKHERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20190019774
- Publication date Jan 17, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20180151529
- Publication date May 31, 2018
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170200693
- Publication date Jul 13, 2017
- Hamamatsu Photonics K.K.
- Yoshimaro FUJII
- H01 - BASIC ELECTRIC ELEMENTS

Bump and layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic device with embedded die substrate on interposer

Semiconductor structure and semiconductor die

Advanced device assembly structures and methods

Wafer stacking structure and manufacturing method thereof

Microelectronic device with embedded die substrate on interposer

Seal ring structures and methods of forming same

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Thermocompression bond tips and related apparatus and methods

Package substrates with magnetic build-up layers

Adhesive for semiconductor device, and high productivity method for...

Microelectronic device with embedded die substrate on interposer

Semiconductor packages and methods of forming same

Seal ring structures and methods of forming same

Thermocompression bond tips and related apparatus and methods

Electronic element and electronic device comprising the same

Current sensor isolation

Seal ring structures and methods of forming same

Semiconductor packages and methods of forming same

Method for manufacturing semiconductor device including heating and...

Semiconductor package

Methods of fluxless micro-piercing of solder balls, and resulting d...

Solder in cavity interconnection structures

Seal ring structures and methods of forming same

3D packaging method for semiconductor components

Pre-applying supporting materials between bonded package components

Current sensor isolation

Systems and methods for bonding semiconductor elements

Semiconductor packages and methods of forming same

Methods of fluxless micro-piercing of solder balls, and resulting d...

Microelectronic element with bond elements to encapsulation surface

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

SEMICONDUCTOR STRUCTURE

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

PACKAGE CARRIER BOARD INTEGRATED WITH INDUCTIVE CIRCUIT STRUCTURE A...

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

WAFER STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Packages and Methods of Forming Same

Advanced Device Assembly Structures And Methods

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

HYBRID INTERPOSER OF GLASS AND SILICON TO REDUCE THERMAL CROSSTALK

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

Semiconductor Packages and Methods of Forming Same

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

CURRENT SENSOR ISOLATION

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR PACKAGE

INSULATING CONTACTING SPACER

PACKAGE WITH ISOLATION STRUCTURE

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

ELECTRONIC COMPONENT