Bump and layer connectors

Industry

CPC
H01L2224/73203

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73203Bump and layer connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 12,046,560
- Issue date Jul 23, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with alternating fan-out lines
- Patent number 12,022,699
- Issue date Jun 25, 2024
- Samsung Display Co., Ltd.
- Tae Jong Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,015,014
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package having warpage control and method of f...
- Patent number 11,978,729
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
- Patent number 11,929,349
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,862,560
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having TSV formed through...
- Patent number 11,854,990
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with conductive bumps having a profile with a w...
- Patent number 11,855,027
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 11,848,265
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electrodes having a columnar portion
- Patent number 11,842,971
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
- Patent number 11,830,866
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,563,157
- Issue date Jan 24, 2023
- Au Optronics Corporation
- Hui-Yang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 11,562,986
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with high integration microelectronic dice...
- Patent number 11,527,507
- Issue date Dec 13, 2022
- Intel Corporation
- Richard Patten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a bridge die
- Patent number 11,495,545
- Issue date Nov 8, 2022
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package device
- Patent number 11,430,760
- Issue date Aug 30, 2022
- Huawei Technologies Co., Ltd.
- Jiajie Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,430,740
- Issue date Aug 30, 2022
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-packages including a bridge die
- Patent number 11,322,446
- Issue date May 3, 2022
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...
- Publication number 20240387498
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL
- Publication number 20240379640
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-PACKAGE INTERCONNECT TO FACILITATE THERMAL CONDUCTION
- Publication number 20240355700
- Publication date Oct 24, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Siraj Akhtar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
- Publication date Oct 3, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Devices with Displays and Conductive Traces
- Publication number 20240332319
- Publication date Oct 3, 2024
- Apple Inc.
- Gihoon Choo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321826
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dongchul YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312959
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Upside-Down DRAM Package Structure
- Publication number 20240315054
- Publication date Sep 19, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258189
- Publication date Aug 1, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258192
- Publication date Aug 1, 2024
- Dynex Semiconductor Limited
- Robin Adam SIMPSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240222256
- Publication date Jul 4, 2024
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20240194574
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURES, MANUFACTURING METHODS THEREOF AND ELECTRON...
- Publication number 20240178190
- Publication date May 30, 2024
- Yangtze Memory Technologies Co., Ltd.
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
- Publication number 20240162111
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE AND METHOD FOR MAN...
- Publication number 20240145359
- Publication date May 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE
- Publication number 20240145358
- Publication date May 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL
- Publication number 20240145448
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240128151
- Publication date Apr 18, 2024
- HON HAI PRECISION INDUSTRY CO., LTD.
- Chun-Yen PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20240105532
- Publication date Mar 28, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Zhigang PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240071996
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE
- Publication number 20240071909
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240038550
- Publication date Feb 1, 2024
- InnoLux Corporation
- Chin-Lung TING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240038709
- Publication date Feb 1, 2024
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014160
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Seong Ho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR STRUCTURE FOR WIDE-BANDGAP SEMICONDUCTOR DEVICES
- Publication number 20240014176
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240006272
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Bump and layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic device with embedded die substrate on interposer

Display device with alternating fan-out lines

Semiconductor package

Advanced device assembly structures and methods

Semiconductor device package having warpage control and method of f...

Process for thin film capacitor integration

Semiconductor device having laterally offset stacked semiconductor...

Microelectronic device with embedded die substrate on interposer

Package structure and method of manufacturing the same

Method for forming a semiconductor device having TSV formed through...

Semiconductor device and method

Integrated circuits with conductive bumps having a profile with a w...

Semiconductor package with improved interposer structure

Semiconductor device with electrodes having a columnar portion

Seal ring structures and methods of forming same

Conductive bump of a semiconductor device and fabricating method th...

Semiconductor package with thermal relaxation block and manufacturi...

Hybrid bonding structures and semiconductor devices including the same

Methods of manufacturing stacked semiconductor die assemblies with...

Semiconductor device and method of forming interposer with opening...

Package substrates with magnetic build-up layers

Light-emitting device

Stacked semiconductor die assemblies with partitioned logic and ass...

Microelectronic packages with high integration microelectronic dice...

Semiconductor package including a bridge die

Chip package device

Microelectronic device with embedded die substrate on interposer

Semiconductor packages and methods of forming same

Seal ring structures and methods of forming same

System-in-packages including a bridge die

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...

Method for Forming a Semiconductor Device Having TSV Formed Through...

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL

DIE-PACKAGE INTERCONNECT TO FACILITATE THERMAL CONDUCTION

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

Electronic Devices with Displays and Conductive Traces

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

Upside-Down DRAM Package Structure

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC APPARATUS

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

CHIP PACKAGE STRUCTURES, MANUFACTURING METHODS THEREOF AND ELECTRON...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS

WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE AND METHOD FOR MAN...

WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL

PACKAGE STRUCTURE

ELECTRONIC DEVICE

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

3D SEMICONDUCTOR STRUCTURE FOR WIDE-BANDGAP SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME