Bump and layer connectors

Industry

CPC
H01L2224/73153

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73153Bump and layer connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 11,626,343
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having an N terminal, A P terminal and an outp...
- Patent number 11,417,634
- Issue date Aug 16, 2022
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages and methods of forming the same
- Patent number 11,164,754
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,991,676
- Issue date Apr 27, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded wafer level packaging
- Patent number 10,916,485
- Issue date Feb 9, 2021
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,763,220
- Issue date Sep 1, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,593,651
- Issue date Mar 17, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 10,522,504
- Issue date Dec 31, 2019
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,290,612
- Issue date May 14, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device using the same and manu...
- Patent number 10,242,927
- Issue date Mar 26, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,229,887
- Issue date Mar 12, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 10,056,304
- Issue date Aug 21, 2018
- Deca Technologies Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,799,623
- Issue date Oct 24, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery network (PDN) design for monolithic three-dimensiona...
- Patent number 9,741,691
- Issue date Aug 22, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 9,633,951
- Issue date Apr 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale package for high power devices
- Patent number 9,559,068
- Issue date Jan 31, 2017
- Infineon Technologies Americas Corp.
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process for molded chip scale package (MCSP) with thick backs...
- Patent number 9,520,380
- Issue date Dec 13, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,391,003
- Issue date Jul 12, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor package with conductive clip and related method
- Patent number 9,391,004
- Issue date Jul 12, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor device and the preparation method
- Patent number 9,337,131
- Issue date May 10, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,293,394
- Issue date Mar 22, 2016
- Xintec Inc.
- Bai-Yao Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process for molded chip scale package (MCSP) with thick backs...
- Patent number 9,245,861
- Issue date Jan 26, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded electrical component surface interconnect
- Patent number 9,245,819
- Issue date Jan 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fastening chips with a contact element onto a substrate...
- Patent number 9,245,869
- Issue date Jan 26, 2016
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package with exposed thick bottom metal
- Patent number 9,224,679
- Issue date Dec 29, 2015
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package
- Patent number 9,041,191
- Issue date May 26, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer readable medium encoded with a program for fabricating 3D...
- Patent number 8,962,448
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS
- Publication number 20240321795
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213130
- Publication date Jun 27, 2024
- Murata Manufacturing Co., Ltd.
- Wataru DOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230223378
- Publication date Jul 13, 2023
- NEXPERIA B.V.
- Qingyuan Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...
- Publication number 20230207573
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- JI WOONG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME
- Publication number 20230085734
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20220367318
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20220028818
- Publication date Jan 27, 2022
- Rohm Co., Ltd.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20210225811
- Publication date Jul 22, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF FABRICATING SAME
- Publication number 20210104499
- Publication date Apr 8, 2021
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20200212013
- Publication date Jul 2, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20200135613
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Packages And Methods Of Forming The Same
- Publication number 20200105544
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20190371765
- Publication date Dec 5, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20180366380
- Publication date Dec 20, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
- Publication number 20170256466
- Publication date Sep 7, 2017
- DECA TECHNOLOGIES INC
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20170125371
- Publication date May 4, 2017
- STMicroelectronics S.r.l.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD
- Publication number 20160093560
- Publication date Mar 31, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INTERCONNECT SUBSTRATE
- Publication number 20150123258
- Publication date May 7, 2015
- RENESAS ELECTRONICS CORPORATION
- SHUUICHI KARIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...
- Publication number 20140315350
- Publication date Oct 23, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INTERCONNECT SUBSTRATE
- Publication number 20140300003
- Publication date Oct 9, 2014
- RENESAS ELECTRONICS CORPORATION
- SHUUICHI KARIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140231966
- Publication date Aug 21, 2014
- Xintec Inc.
- Bai-Yao LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package for High Power Devices
- Publication number 20140048923
- Publication date Feb 20, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Electrical Component Surface Interconnect
- Publication number 20130215583
- Publication date Aug 22, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING A...
- Publication number 20130189813
- Publication date Jul 25, 2013
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with Reduced Contact Resistance
- Publication number 20130175690
- Publication date Jul 11, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS

Bump and layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with enhanced thermal dissipation and method f...

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Package substrates with magnetic build-up layers

Semiconductor device with enhanced thermal dissipation and method f...

Semiconductor module having an N terminal, A P terminal and an outp...

Fan-out packages and methods of forming the same

Systems and methods for flash stacking

Molded wafer level packaging

Systems and methods for electromagnetic interference shielding

Systems and methods for flash stacking

Semiconductor device and corresponding method

Systems and methods for flash stacking

Semiconductor package, semiconductor device using the same and manu...

Systems and methods for electromagnetic interference shielding

Automated optical inspection of unit specific patterning

Semiconductor package with conductive clip

Power delivery network (PDN) design for monolithic three-dimensiona...

Semiconductor package including a semiconductor die having redistri...

Wafer scale package for high power devices

Wafer process for molded chip scale package (MCSP) with thick backs...

Semiconductor package with conductive clip

Power semiconductor package with conductive clip and related method

Power semiconductor device and the preparation method

Chip package and method for forming the same

Wafer process for molded chip scale package (MCSP) with thick backs...

Embedded electrical component surface interconnect

Method for fastening chips with a contact element onto a substrate...

Wafer level chip scale package with exposed thick bottom metal

Power semiconductor package

Computer readable medium encoded with a program for fabricating 3D...

Patents Applicationslast 30 patents

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS

COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR FLASH STACKING

SEMICONDUCTOR MODULE AND METHOD OF FABRICATING SAME

SYSTEMS AND METHODS FOR FLASH STACKING

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

Fan-Out Packages And Methods Of Forming The Same

SYSTEMS AND METHODS FOR FLASH STACKING

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD

SEMICONDUCTOR DEVICE AND INTERCONNECT SUBSTRATE

WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...

SEMICONDUCTOR DEVICE AND INTERCONNECT SUBSTRATE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Semiconductor Package for High Power Devices

Embedded Electrical Component Surface Interconnect

COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING A...

Power Semiconductor Device with Reduced Contact Resistance