Bump connector integrally formed with a via connection of the semiconductor or solid-state body

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H01L2224/13009

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13009Bump connector integrally formed with a via connection of the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 12,015,002
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating wafers with electrical contacts on a surface parallel t...
- Patent number 12,009,352
- Issue date Jun 11, 2024
- Illumina, Inc.
- Arvin Emadi
- G01 - MEASURING TESTING
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,984,420
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having vias
- Patent number 11,961,812
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,830,851
- Issue date Nov 28, 2023
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,817,427
- Issue date Nov 14, 2023
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally and electrically conductive interconnects
- Patent number 11,637,068
- Issue date Apr 25, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via with low-K dielectric liner
- Patent number 11,600,551
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,594,507
- Issue date Feb 28, 2023
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having vias
- Patent number 11,587,898
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,783
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias using silicon on insulator substrate
- Patent number 11,257,744
- Issue date Feb 22, 2022
- Micron Technology, Inc.
- Toshiyuki Maenosono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,211,363
- Issue date Dec 28, 2021
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,195,819
- Issue date Dec 7, 2021
- LONGITUDE LICENSING LIMITED
- Daisuke Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for electronic devices with polycrystalline subst...
- Patent number 11,121,120
- Issue date Sep 14, 2021
- QROMIS, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package with stacked semiconduc...
- Patent number 11,101,235
- Issue date Aug 24, 2021
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of sensor chip package structure
- Patent number 10,964,839
- Issue date Mar 30, 2021
- PixArt Imaging Inc.
- Chi-Chih Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked image sensor package and stacked image sensor module includ...
- Patent number 10,756,055
- Issue date Aug 25, 2020
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,720,410
- Issue date Jul 21, 2020
- TOSHIBA MEMORY CORPORATION
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via with low-K dielectric liner
- Patent number 10,707,149
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor module and sensor chip thereof
- Patent number 10,672,937
- Issue date Jun 2, 2020
- PixArt Imaging Inc.
- Chi-Chih Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 10,651,155
- Issue date May 12, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device having through silicon vias
- Patent number 10,651,158
- Issue date May 12, 2020
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,622,403
- Issue date Apr 14, 2020
- Hamamatsu Photonics K.K.
- Noburo Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package with stacked semiconduc...
- Patent number 10,622,323
- Issue date Apr 14, 2020
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT
- Publication number 20240355781
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240332235
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE BASED ON PANEL FORM
- Publication number 20240274574
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Peng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266309
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE S...
- Publication number 20240243021
- Publication date Jul 18, 2024
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED LAMINATE PACKAGE WITH 3D INTERCONNECTION STRUCTURE
- Publication number 20240170407
- Publication date May 23, 2024
- pSemi Corporation
- Yuan WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153913
- Publication date May 9, 2024
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yinhua CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE...
- Publication number 20240128158
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- YUTAKA NAKAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096773
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING VIAS
- Publication number 20230207508
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230102285
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230067143
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOCK CIRCUIT IN A PROCESSOR INTEGRATED CIRCUIT
- Publication number 20230013151
- Publication date Jan 19, 2023
- Huawei Technologies Co., Ltd
- Wen YIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FABRICATING WAFERS WITH ELECTRICAL CONTACTS ON A SURFACE PARALLEL T...
- Publication number 20220216191
- Publication date Jul 7, 2022
- Illumina, Inc.
- Arvin EMADI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Silicon Vias and Manufacturing...
- Publication number 20220102318
- Publication date Mar 31, 2022
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210351147
- Publication date Nov 11, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210313299
- Publication date Oct 7, 2021
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305189
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING VIAS
- Publication number 20210143118
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20200411482
- Publication date Dec 31, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Silicon Vias and Manufacturing...
- Publication number 20200273846
- Publication date Aug 27, 2020
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Silicon Vias
- Publication number 20190206842
- Publication date Jul 4, 2019
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190006324
- Publication date Jan 3, 2019
- Toshiba Memory Corporation
- Tatsuo MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20190006323
- Publication date Jan 3, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...
- Publication number 20180261563
- Publication date Sep 13, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20180047696
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Jun YAMADA
- H01 - BASIC ELECTRIC ELEMENTS

Bump connector integrally formed with a via connection of the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal pads between stacked semiconductor dies and associated syst...

Chip structure and method for forming the same

Fabricating wafers with electrical contacts on a surface parallel t...

Advanced device assembly structures and methods

Semiconductor device

Semiconductor packages having vias

Semiconductor package structure

Semiconductor device having through silicon vias and manufacturing...

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Thermally and electrically conductive interconnects

Through-silicon via with low-K dielectric liner

Method for manufacturing semiconductor device

Semiconductor packages having vias

Semiconductor device

Method of forming vias using silicon on insulator substrate

Semiconductor device and a method of manufacturing the same

Semiconductor device having through silicon vias and manufacturing...

Semiconductor device

Method and system for electronic devices with polycrystalline subst...

Fabrication method of semiconductor package with stacked semiconduc...

Manufacturing method of sensor chip package structure

Stacked image sensor package and stacked image sensor module includ...

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

Through-silicon via with low-K dielectric liner

Optical sensor module and sensor chip thereof

Thermal pads between stacked semiconductor dies and associated syst...

Method of forming a semiconductor device having through silicon vias

Semiconductor device manufacturing method

Fabrication method of semiconductor package with stacked semiconduc...

Patents Applicationslast 30 patents

INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP PACKAGING METHOD AND CHIP PACKAGE BASED ON PANEL FORM

SEMICONDUCTOR DEVICE

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE S...

DOUBLE-SIDED LAMINATE PACKAGE WITH 3D INTERCONNECTION STRUCTURE

3D STACKED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE...

SEMICONDUCTOR PACKAGE

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR PACKAGES HAVING VIAS

SEMICONDUCTOR DEVICE

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

CLOCK CIRCUIT IN A PROCESSOR INTEGRATED CIRCUIT

FABRICATING WAFERS WITH ELECTRICAL CONTACTS ON A SURFACE PARALLEL T...

Semiconductor Device Having Through Silicon Vias and Manufacturing...

Advanced Device Assembly Structures And Methods

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES HAVING VIAS

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

Semiconductor Device Having Through Silicon Vias and Manufacturing...

Semiconductor Device Having Through Silicon Vias

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE