Bump connector larger than the underlying bonding area

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H01L2224/13006

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13006Bump connector larger than the underlying bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 12,015,002
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having stepped conductive pillars
- Patent number 11,955,447
- Issue date Apr 9, 2024
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a support solder ball
- Patent number 11,948,873
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,862,589
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,855,032
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,810,878
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,652,076
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-last methods for forming semiconductor devices
- Patent number 11,631,630
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer
- Patent number 11,616,018
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising semiconductor die and interposer an...
- Patent number 11,527,496
- Issue date Dec 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including substrate with outer insulating layer
- Patent number 11,508,649
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Eungkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 11,495,567
- Issue date Nov 8, 2022
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,476,211
- Issue date Oct 18, 2022
- Nepes Co., Ltd.
- Jun Kyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 11,476,212
- Issue date Oct 18, 2022
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip device
- Patent number 11,417,622
- Issue date Aug 16, 2022
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 11,393,967
- Issue date Jul 19, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,355,467
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with shielding structure for cross-talk reduction
- Patent number 11,302,649
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ya Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 11,217,548
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnect structure and method for pre...
- Patent number 11,177,194
- Issue date Nov 16, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,171,107
- Issue date Nov 9, 2021
- Samsung Electronics Co., Ltd.
- Gyu Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including a supporting substrate
- Patent number 11,152,335
- Issue date Oct 19, 2021
- SK hynix Inc.
- Seung Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer
- Patent number 11,133,253
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,107,783
- Issue date Aug 31, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 11,094,656
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...
- Publication number 20240395747
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240387430
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240332235
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321790
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20240250051
- Publication date Jul 25, 2024
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20240142493
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS SOLDER BUMP STRUCTURE
- Publication number 20240113060
- Publication date Apr 4, 2024
- Societe de commercialisation des produits de la recherche appliquee SOCPRA Sc...
- Abderrahim EL AMRANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...
- Publication number 20240105659
- Publication date Mar 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR
- Publication number 20240105658
- Publication date Mar 28, 2024
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240088054
- Publication date Mar 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Ting LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...
- Publication number 20240047400
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014158
- Publication date Jan 11, 2024
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...
- Publication number 20230268303
- Publication date Aug 24, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20230154878
- Publication date May 18, 2023
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20230088776
- Publication date Mar 23, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20230077469
- Publication date Mar 16, 2023
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230067143
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220392979
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sang Duk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME
- Publication number 20220336427
- Publication date Oct 20, 2022
- Seoul Viosys Co., Ltd.
- Jong Min JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20220285596
- Publication date Sep 8, 2022
- XIAMEN SANAN OPTOELECTRONICS CO., LTD.
- Shiwei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220278088
- Publication date Sep 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
- Publication number 20220262757
- Publication date Aug 18, 2022
- Samsung Electronics Co., LTD
- Taeho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure And Manufacturing Method Thereof
- Publication number 20220115352
- Publication date Apr 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER
- Publication number 20210375759
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Juik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20210375808
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
- Publication number 20210358874
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210288010
- Publication date Sep 16, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS

Bump connector larger than the underlying bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Packaged semiconductor device with electroplated pillars

Chip structure and method for forming the same

Semiconductor chip having stepped conductive pillars

Semiconductor package including a support solder ball

Wafer-level package including under bump metal layer

Semiconductor structure and manufacturing method thereof

Wafer-level package including under bump metal layer

Semiconductor device and method of making wafer level chip scale pa...

Semiconductor devices including thick pad

Pillar-last methods for forming semiconductor devices

Semiconductor devices including a thick metal layer

Semiconductor device comprising semiconductor die and interposer an...

Semiconductor package including substrate with outer insulating layer

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Semiconductor device and method of manufacturing thereof

Semiconductor package and manufacturing method thereof

Semiconductor contact structure having stress buffer layer formed b...

Flip-chip device

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Semiconductor devices including thick pad

Semiconductor device with shielding structure for cross-talk reduction

Semiconductor device and a method of manufacturing the same

Semiconductor device structure and manufacturing method

Semiconductor device with interconnect structure and method for pre...

Semiconductor package

Stack packages including a supporting substrate

Semiconductor devices including a thick metal layer

Wafer-level package including under bump metal layer

Packaged semiconductor device with electroplated pillars

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...

METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

BONDING-TYPE INTERCONNECTION MEMBER

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

SOCKET FOR TESTING SEMICONDUCTOR DEVICE

HETEROGENEOUS SOLDER BUMP STRUCTURE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...

SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR

CARRIER STRUCTURE

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

DISPLAY DEVICE

UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME

LIGHT-EMITTING DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

SEMICONDUCTOR DEVICES INCLUDING THICK PAD

Semiconductor Structure And Manufacturing Method Thereof

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER

PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS

WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF