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Bump connectors having different sizes
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H01L2224/1703
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/1703
Bump connectors having different sizes
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Patents Grants
last 30 patents
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Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
Patent number
12,300,772
Issue date
May 13, 2025
Epistar Corporation
Min-Hsun Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device
Patent number
12,300,624
Issue date
May 13, 2025
INNOLUX CORPORATION
Jen-Hai Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,300,649
Issue date
May 13, 2025
Samsung Electronics Co., Ltd.
Yong Ho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate and package structure
Patent number
12,300,652
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
12,293,991
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package including electronic structure and electronic bo...
Patent number
12,283,560
Issue date
Apr 22, 2025
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor package including sub-interpose...
Patent number
12,278,222
Issue date
Apr 15, 2025
Samsung Electronics Co., Ltd.
Yanggyoo Jung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Microelectronic structures including bridges
Patent number
12,243,792
Issue date
Mar 4, 2025
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
Patent number
12,243,812
Issue date
Mar 4, 2025
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Scalable large system based on organic interconnect
Patent number
12,237,269
Issue date
Feb 25, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multi-chip package with high density interconnects
Patent number
12,218,069
Issue date
Feb 4, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
12,218,092
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Moonyong Jang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package
Patent number
12,205,914
Issue date
Jan 21, 2025
Samsung Electronics Co., Ltd.
Inhyung Song
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Microelectronic assemblies
Patent number
12,199,063
Issue date
Jan 14, 2025
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Scalable embedded silicon bridge via pillars in lithographically de...
Patent number
12,199,067
Issue date
Jan 14, 2025
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multi-chip packaging
Patent number
12,199,085
Issue date
Jan 14, 2025
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Pre-molded leadframes in semiconductor devices
Patent number
12,191,273
Issue date
Jan 7, 2025
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated voltage regulator (IVR) package including inductor and c...
Patent number
12,191,288
Issue date
Jan 7, 2025
Samsung Electronics Co., Ltd.
Sangnam Jeong
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package having a high reliability
Patent number
12,183,718
Issue date
Dec 31, 2024
Samsung Electronics Co., Ltd.
Ji-Hwan Hwang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Leadframes in semiconductor devices
Patent number
12,183,703
Issue date
Dec 31, 2024
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
Patent number
12,170,253
Issue date
Dec 17, 2024
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of fabricating the same
Patent number
12,159,858
Issue date
Dec 3, 2024
Samsung Electronics Co., Ltd.
Hyunsoo Chung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
12,159,863
Issue date
Dec 3, 2024
Amkor Technology Singapore Holding Pte Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Active bridge enabled co-packaged photonic transceiver
Patent number
12,148,742
Issue date
Nov 19, 2024
Intel Corporation
Thomas Liljeberg
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device assembly with die support structures
Patent number
12,148,727
Issue date
Nov 19, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
Patent number
12,142,568
Issue date
Nov 12, 2024
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package
Patent number
12,142,544
Issue date
Nov 12, 2024
Samsung Electronics Co., Ltd.
Taehwan Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
12,132,002
Issue date
Oct 29, 2024
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Metal bonding structure and manufacturing method thereof
Patent number
12,113,042
Issue date
Oct 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Liang Lu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Publication number
20250167062
Publication date
May 22, 2025
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method for Fabricating a Computing System with an Int...
Publication number
20250167048
Publication date
May 22, 2025
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE
Publication number
20250157898
Publication date
May 15, 2025
STMicroelectronics International N.V.
Venero SANTAMARIA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Scalable Large System Based on Organic Interconnect
Publication number
20250157936
Publication date
May 15, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250149456
Publication date
May 8, 2025
Samsung Electronics Co., Ltd.
Young-Ja KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250133656
Publication date
Apr 24, 2025
LG Innotek Co., Ltd.
Sang Il KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
Publication number
20250125275
Publication date
Apr 17, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250112193
Publication date
Apr 3, 2025
Samsung Electronics Co., Ltd.
INHYUNG SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
Publication number
20250112165
Publication date
Apr 3, 2025
Intel Corporation
Brandon Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
Publication number
20250096211
Publication date
Mar 20, 2025
Samsung Electronics Co., Ltd.
Sangnam JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20250096194
Publication date
Mar 20, 2025
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK
Publication number
20250098066
Publication date
Mar 20, 2025
QUALCOMM Incorporated
Hong Bok WE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...
Publication number
20250096197
Publication date
Mar 20, 2025
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
Publication number
20250079376
Publication date
Mar 6, 2025
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE WITH EMBEDDED INTERCONNECT STRUCTURE
Publication number
20250070034
Publication date
Feb 27, 2025
QUALCOMM Incorporated
Kuiwon KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
Publication number
20250070056
Publication date
Feb 27, 2025
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20250054915
Publication date
Feb 13, 2025
Samsung Electronics Co., Ltd.
HYUNSOO CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
Publication number
20250046776
Publication date
Feb 6, 2025
Semiconductor Manufacturing International (Shanghai) Corporation
Jisong JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20250029902
Publication date
Jan 23, 2025
Realtek Semiconductor Corp.
Nai-Jen Hsuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
Publication number
20250029929
Publication date
Jan 23, 2025
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS
Publication number
20250022858
Publication date
Jan 16, 2025
QUALCOMM Incorporated
Kai LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20250022845
Publication date
Jan 16, 2025
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250015042
Publication date
Jan 9, 2025
Samsung Electronics Co., Ltd.
Jing Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Publication number
20250015004
Publication date
Jan 9, 2025
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
Publication number
20250006570
Publication date
Jan 2, 2025
Intel Corporation
Gang Duan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250006619
Publication date
Jan 2, 2025
Samsung Electronics Co., Ltd.
Chonghee LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
Publication number
20250006665
Publication date
Jan 2, 2025
Intel Corporation
Gang Duan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
Publication number
20240421112
Publication date
Dec 19, 2024
Rohm Co., Ltd.
Yuta KASHITANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL PACKAGING
Publication number
20240411084
Publication date
Dec 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Stefan Rusu
H01 - BASIC ELECTRIC ELEMENTS