Bump connectors having different sizes

Industry

CPC
H01L2224/1703

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1703Bump connectors having different sizes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 12,183,718
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,159,858
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,159,863
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding structure and manufacturing method thereof
- Patent number 12,113,042
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,113,048
- Issue date Oct 8, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,100,681
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 12,080,652
- Issue date Sep 3, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component with conductive terminals of different...
- Patent number 12,074,066
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,425
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Eunyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,435
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,015,014
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,002,786
- Issue date Jun 4, 2024
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,990,441
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic package including electronic structure and electronic co...
- Patent number 11,973,047
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 11,923,329
- Issue date Mar 5, 2024
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 11,916,020
- Issue date Feb 27, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
- Publication number 20250006570
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250006619
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Chonghee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
- Publication number 20250006665
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421112
- Publication date Dec 19, 2024
- Rohm Co., Ltd.
- Yuta KASHITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGING
- Publication number 20240411084
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404971
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379611
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240363415
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
- Publication number 20240355750
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355779
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240332221
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Seungyoung AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED IN-PACKAGE MAIN MEMORY
- Publication number 20240332275
- Publication date Oct 3, 2024
- Meta Platforms Technologies, LLC
- Jaesik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321847
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312920
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Keunho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312959
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297139
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240290756
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- YOUNG LYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...
- Publication number 20240282729
- Publication date Aug 22, 2024
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240222330
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Youngjun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240222251
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- JIYOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240213199
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Sungwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CH...
- Publication number 20240194643
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20240178175
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING

Bump connectors having different sizes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Leadframes in semiconductor devices

Semiconductor package having a high reliability

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package and method of fabricating the same

Semiconductor devices and methods of manufacturing semiconductor de...

Active bridge enabled co-packaged photonic transceiver

Semiconductor device assembly with die support structures

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Semiconductor package

Bridge interconnection with layered interconnect structures

Metal bonding structure and manufacturing method thereof

Microelectronic assemblies

Semiconductor package and method of fabricating the same

Microelectronic assemblies with communication networks

Integrated circuit component with conductive terminals of different...

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package

Semiconductor package

Semiconductor package having a through intervia through the molding...

Semiconductor package

High density organic bridge device and method

Semiconductor package and method of fabricating the same

Semiconductor package

Vertical inductor for WLCSP

Semiconductor package and method for manufacturing the same

Electronic package including electronic structure and electronic co...

Structure and method for fabricating a computing system with an int...

Uniform electrochemical plating of metal onto arrays of pillars hav...

Die attached leveling control by metal stopper bumps

Microelectronic assemblies with communication networks

Patents Applicationslast 30 patents

GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

OPTICAL PACKAGING

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS

SEMICONDUCTOR PACKAGE

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

SEMICONDUCTOR PACKAGE

3D INTEGRATED IN-PACKAGE MAIN MEMORY

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

Structure and Method for Fabricating a Computing System with an Int...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CH...

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...