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H05K2201/09536
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ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00
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H05K2201/09536
Buried plated through-holes
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last 30 patents
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Patent Grant
Three-dimensional (3D) copper in printed circuit boards
Patent number
11,956,898
Issue date
Apr 9, 2024
Apple Inc.
Anne M. Mason
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board structure
Patent number
11,737,206
Issue date
Aug 22, 2023
Unimicron Technology Corp.
Shih-Lian Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
Patent number
11,631,611
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board
Patent number
11,452,214
Issue date
Sep 20, 2022
HELLA GMBH & CO. KGAA
Ralf Stanzmann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
Patent number
11,304,311
Issue date
Apr 12, 2022
Sanmina Corporation
Shinichi Iketani
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Circuit board
Patent number
11,224,123
Issue date
Jan 11, 2022
VITESCO TECHNOLOGIES GERMANY GMBH
Thomas Rumrich
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package with wall-side capacitors
Patent number
11,158,568
Issue date
Oct 26, 2021
Intel Corporation
Jenny Shio Yin Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
Patent number
11,037,819
Issue date
Jun 15, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board
Patent number
10,827,615
Issue date
Nov 3, 2020
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Jong Chan Choi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
Patent number
10,820,427
Issue date
Oct 27, 2020
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer printed circuit board via hole registration and accuracy
Patent number
10,811,210
Issue date
Oct 20, 2020
Sanmina Corporation
Shinichi Iketani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a component embedded package carrier
Patent number
10,798,822
Issue date
Oct 6, 2020
Subtron Technology Co., Ltd.
Jing-Cyuan Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedding into printed circuit board with drilling
Patent number
10,681,819
Issue date
Jun 9, 2020
Infineon Technologies Austria AG
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
Patent number
10,672,647
Issue date
Jun 2, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thin film component sheet, board with built-in electronic component...
Patent number
10,658,200
Issue date
May 19, 2020
TDK Corporation
Hitoshi Saita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structure to dampen barrel resonance of unused portion of printed c...
Patent number
10,595,397
Issue date
Mar 17, 2020
Dell Products, L.P.
Stuart Allen Berke
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Glass substrate including passive-on-glass device and semiconductor...
Patent number
10,523,253
Issue date
Dec 31, 2019
QUALCOMM Incorporated
Changhan Yun
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Multilayer printed circuit board via hole registration and accuracy
Patent number
10,446,356
Issue date
Oct 15, 2019
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit structure
Patent number
10,448,501
Issue date
Oct 15, 2019
Industrial Technology Research Institute
Shih-Hsien Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board, antenna, and wireless charging device
Patent number
10,373,757
Issue date
Aug 6, 2019
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Masahiko Kouchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
Patent number
10,362,687
Issue date
Jul 23, 2019
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fuses with integrated metals
Patent number
10,276,337
Issue date
Apr 30, 2019
Littelfuse, Inc.
Michael Doering
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
Patent number
10,269,619
Issue date
Apr 23, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laser diode chip on printed circuit board
Patent number
10,257,932
Issue date
Apr 9, 2019
Microsoft Technology Licensing, LLC
David Mandelboum
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Multilayer wiring substrate
Patent number
10,237,973
Issue date
Mar 19, 2019
Canon Kabushiki Kaisha
Takashi Tokoro
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed wiring board and method for manufacturing the same
Patent number
10,219,383
Issue date
Feb 26, 2019
Ibiden Co., Ltd.
Katsutoshi Kitagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Construction of printed circuit board having a buried via
Patent number
10,172,244
Issue date
Jan 1, 2019
International Business Machines Corporation
Matteo Cocchini
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
Patent number
10,123,432
Issue date
Nov 6, 2018
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer substrate, component mounted board, and method for produ...
Patent number
10,103,092
Issue date
Oct 16, 2018
Murata Manufacturing Co., Ltd.
Kuniaki Yosui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming vias on printed circuit boards
Patent number
9,999,137
Issue date
Jun 12, 2018
Intrinsiq Materials, Inc.
David Ciufo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
MULTILAYER WIRING BOARD
Publication number
20230422412
Publication date
Dec 28, 2023
TOPPAN INC.
Akihiro HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING
Publication number
20230354522
Publication date
Nov 2, 2023
NIPPON MEKTRON, LTD.
Shunsuke AOYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD STRUCTURE
Publication number
20230262890
Publication date
Aug 17, 2023
Unimicron Technology Corp.
Chih-Chiang Lu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURE
Publication number
20230156909
Publication date
May 18, 2023
Unimicron Technology Corp.
Shih-Lian Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-LAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD FOR M...
Publication number
20220418101
Publication date
Dec 29, 2022
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
CHENG-JIA LI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SINGLE CIRCUIT BOARD ASSEMBLY WITH LOGIC AND POWER COMPONENTS
Publication number
20220394848
Publication date
Dec 8, 2022
STEERING SOLUTIONS IP HOLDING CORPORATION
Ryan D. Yaklin
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
Publication number
20220095455
Publication date
Mar 24, 2022
Apple Inc.
Anne M. Mason
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Hybrid Boards with Embedded Planes
Publication number
20210410273
Publication date
Dec 30, 2021
Intel Corporation
Jackson Chung Peng KONG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM
Publication number
20210161013
Publication date
May 27, 2021
Huawei Technologies Co., Ltd
Zongxun CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
Publication number
20210153360
Publication date
May 20, 2021
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
Publication number
20200043690
Publication date
Feb 6, 2020
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
Publication number
20200015364
Publication date
Jan 9, 2020
Sanmina Corporation
Shinichi Iketani
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20190254175
Publication date
Aug 15, 2019
HELLA GmbH & Co. KGaA
Ralf Stanzmann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING
Publication number
20190124773
Publication date
Apr 25, 2019
Infineon Technologies Americas Corp.
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
Publication number
20190075662
Publication date
Mar 7, 2019
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
Publication number
20180352658
Publication date
Dec 6, 2018
Subtron Technology Co., Ltd.
Jing-Cyuan Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...
Publication number
20180316374
Publication date
Nov 1, 2018
Qualcomm Incorporated
Changhan Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20180270958
Publication date
Sep 20, 2018
IBIDEN CO., LTD.
Katsutoshi KITAGAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure to Dampen Barrel Resonance of Unused Portion of Printed C...
Publication number
20180220527
Publication date
Aug 2, 2018
DELL PRODUCTS, L.P.
Stuart Allen Berke
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
Publication number
20170238420
Publication date
Aug 17, 2017
David Mandelboum
F21 - LIGHTING
Information
Patent Application
STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT...
Publication number
20150319863
Publication date
Nov 5, 2015
Dhananjaya Turpuseema
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EDGE CONTACTS OF CIRCUIT BOARDS, AND RELATED APPARATUS AND METHODS
Publication number
20150282317
Publication date
Oct 1, 2015
Lockheed Martin Corporation
Stephen Gonya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FAULT CONTAINMENT ROUTING
Publication number
20150264801
Publication date
Sep 17, 2015
Honeywell International Inc.
Kenneth Lee Martin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure to Dampen Barrel Resonance of Unused Portion of Printed C...
Publication number
20150216046
Publication date
Jul 30, 2015
DELL PRODUCTS, L.P.
Stuart Allen Berke
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Publication number
20140353006
Publication date
Dec 4, 2014
ZHEN DING TECHNOLOGY CO., LTD.
TAEKOO LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD
Publication number
20140268610
Publication date
Sep 18, 2014
Gregory HALVORSON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...
Publication number
20140264933
Publication date
Sep 18, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
Publication number
20140262455
Publication date
Sep 18, 2014
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Publication number
20140216794
Publication date
Aug 7, 2014
IBIDEN CO., LTD.
Toshiaki HIBINO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
Publication number
20140209366
Publication date
Jul 31, 2014
Shinko Electric Industries Co., Ltd.
Kazuyuki Kubota
H01 - BASIC ELECTRIC ELEMENTS