by bonding or embedding conductive wires or strips

Industry

CPC
H05K3/103

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/103by bonding or embedding conductive wires or strips

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode-wiring-equipped cloth material
- Patent number 12,114,981
- Issue date Oct 15, 2024
- Lintec Corporation
- Yoshiaki Hagihara
- D03 - WEAVING
Information Patent Grant
Electronic device
- Patent number 12,082,349
- Issue date Sep 3, 2024
- HONOR DEVICE CO., LTD.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive composition for molded film, molded film, molded article...
- Patent number 12,064,949
- Issue date Aug 20, 2024
- ARTIENCE CO., LTD.
- Kouichi Tosaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board, electronic device, and fabrication method t...
- Patent number 12,016,115
- Issue date Jun 18, 2024
- SHENNAN CIRCUITS CO., LTD.
- Beilei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with anti-corrosion properties, method for manufactur...
- Patent number 11,943,875
- Issue date Mar 26, 2024
- Champ Tech Optical (Foshan) Corporation
- Li-Ping Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, electronic device and electronic module
- Patent number 11,930,586
- Issue date Mar 12, 2024
- Kyocera Corporation
- Toshiyuki Hamachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart cards with metal layer(s) and methods of manufacture
- Patent number 11,907,791
- Issue date Feb 20, 2024
- Amatech Group Lijited
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 11,871,524
- Issue date Jan 9, 2024
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smartcards with multiple coupling frames
- Patent number 11,836,565
- Issue date Dec 5, 2023
- AMATECH GROUP LIMITED
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive trace interconnection tape
- Patent number 11,812,553
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging device for connection with a circuit element
- Patent number 11,800,249
- Issue date Oct 24, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device and electronic module
- Patent number 11,582,858
- Issue date Feb 14, 2023
- Kyocera Corporation
- Toshiyuki Hamachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding device
- Patent number 11,528,807
- Issue date Dec 13, 2022
- Samsung Display Co., Ltd.
- Jungseon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible resonant trap circuit
- Patent number 11,500,048
- Issue date Nov 15, 2022
- Inkspace Imaging, Inc.
- Joseph Russell Corea
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Metal base circuit board and method of manufacturing the metal base...
- Patent number 11,490,513
- Issue date Nov 1, 2022
- NHK Spring Co., Ltd.
- Katsumi Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal-based flexible electronic device and preparation metho...
- Patent number 11,490,524
- Issue date Nov 1, 2022
- Harbin Institute of Technology
- Liang Feng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Smart cards with metal layer(s) and methods of manufacture
- Patent number 11,481,596
- Issue date Oct 25, 2022
- AmaTech Group Limited
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing apparatus for performing additive manufacturing of an...
- Patent number 11,470,724
- Issue date Oct 11, 2022
- FUJI CORPORATION
- Masato Suzuki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for fabricating Z-axis vertical launch
- Patent number 11,470,725
- Issue date Oct 11, 2022
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Flexible board, method for manufacturing the same, and electronic d...
- Patent number 11,439,006
- Issue date Sep 6, 2022
- Murata Manufacturing Co., Ltd.
- Fumiya Isono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 11,424,178
- Issue date Aug 23, 2022
- Mitsubishi Electric Corporation
- Satoshi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronics without PCB
- Patent number 11,399,437
- Issue date Jul 26, 2022
- Nikolay V. Khatuntsev
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Method for producing a printed circuit board using a mould for cond...
- Patent number 11,395,411
- Issue date Jul 19, 2022
- JUMATECH GMBH
- Markus Wölfel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart cards with metal layer(s) and methods of manufacture
- Patent number 11,392,817
- Issue date Jul 19, 2022
- AmaTech Group Limited
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transponder chip module with module antenna(s) and coupling frame(s)
- Patent number 11,386,317
- Issue date Jul 12, 2022
- AmaTech Group Limited
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive pattern
- Patent number 11,360,612
- Issue date Jun 14, 2022
- Dongwoo Fine-Chem Co., Ltd.
- Byung Hoon Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Smartcards with multiple coupling frames
- Patent number 11,354,560
- Issue date Jun 7, 2022
- AmaTech Group Limited
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240334586
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240306306
- Publication date Sep 12, 2024
- Canon Kabushiki Kaisha
- JUN TSUKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire Dispensing Device
- Publication number 20240244758
- Publication date Jul 18, 2024
- SCIPERIO, INC.
- Miles Radliff
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240244762
- Publication date Jul 18, 2024
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME
- Publication number 20240224436
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215159
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang-min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH ANTI-CORROSION PROPERTIES AND ELECTRONIC DEVICE...
- Publication number 20240172370
- Publication date May 23, 2024
- CHAMP TECH OPTICAL (FOSHAN) CORPORATION
- LI-PING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...
- Publication number 20240164009
- Publication date May 16, 2024
- WISOL CO., LTD.
- Jung Min KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240147615
- Publication date May 2, 2024
- Japan Display Inc.
- Takumi SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240147632
- Publication date May 2, 2024
- YAZAKI CORPORATION
- Mitsuaki Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device
- Publication number 20240130048
- Publication date Apr 18, 2024
- Honor Device Co., Ltd.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...
- Publication number 20240130047
- Publication date Apr 18, 2024
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240114628
- Publication date Apr 4, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AN...
- Publication number 20240098901
- Publication date Mar 21, 2024
- Nichia Corporation.
- Shota TAKASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240090140
- Publication date Mar 14, 2024
- FUJIKURA LTD.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND DISK DEVICE
- Publication number 20240040696
- Publication date Feb 1, 2024
- Kabushiki Kaisha Toshiba
- Yoshihiro AMEMIYA
- G11 - INFORMATION STORAGE
Information Patent Application
WIRING BOARD AND DISPLAY DEVICE
- Publication number 20240023248
- Publication date Jan 18, 2024
- KYOCERA CORPORATION
- Nobuyuki HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEV...
- Publication number 20230413453
- Publication date Dec 21, 2023
- STEMCO CO., LTD.
- Sung Jin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICES, RELATED ELECTRONIC SYSTEMS, AND METHODS OF...
- Publication number 20230389284
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Application
OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...
- Publication number 20230380056
- Publication date Nov 23, 2023
- Sumitomo Electric Industries, Ltd.
- Taichi MISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...
- Publication number 20230380057
- Publication date Nov 23, 2023
- Sumitomo Electric Industries, Ltd.
- Taichi MISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230354521
- Publication date Nov 2, 2023
- Innolux Corporation
- Chueh-Yuan Nien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SLURRY, WATERPROOF PRESSING STRUCTURE, CIRCUIT MEMBRANE...
- Publication number 20230309243
- Publication date Sep 28, 2023
- LITE-ON TECHNOLOGY CORPORATION
- Jen-Chieh Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20230247768
- Publication date Aug 3, 2023
- Canon Kabushiki Kaisha
- JUN TSUKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230232540
- Publication date Jul 20, 2023
- Sumitomo Electric Industries, Ltd.
- Shoichiro SAKAI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTOR BONDING METHOD
- Publication number 20230209724
- Publication date Jun 29, 2023
- Seong Ryong AN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by bonding or embedding conductive wires or strips

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing printed circuit board

Patterned article including electrically conductive elements

Electrode-wiring-equipped cloth material

Electronic device

Conductive composition for molded film, molded film, molded article...

Patterned conductive article

Embedded circuit board, electronic device, and fabrication method t...

Circuit board with anti-corrosion properties, method for manufactur...

Wiring substrate, electronic device and electronic module

Smart cards with metal layer(s) and methods of manufacture

Component-incorporated substrate and method for manufacturing same

Smartcards with multiple coupling frames

Conductive trace interconnection tape

Imaging device for connection with a circuit element

Wiring substrate, electronic device and electronic module

Bonding device

Flexible resonant trap circuit

Metal base circuit board and method of manufacturing the metal base...

Liquid metal-based flexible electronic device and preparation metho...

Smart cards with metal layer(s) and methods of manufacture

Manufacturing apparatus for performing additive manufacturing of an...

Method for fabricating Z-axis vertical launch

Flexible board, method for manufacturing the same, and electronic d...

Semiconductor module

Method for manufacturing electronics without PCB

Method for producing a printed circuit board using a mould for cond...

Smart cards with metal layer(s) and methods of manufacture

Transponder chip module with module antenna(s) and coupling frame(s)

Conductive pattern

Smartcards with multiple coupling frames

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

PATTERNED CONDUCTIVE ARTICLE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Wire Dispensing Device

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD WITH ANTI-CORROSION PROPERTIES AND ELECTRONIC DEVICE...

ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...

ELECTRONIC DEVICE

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

WIRING BOARD

Electronic Device

METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AN...

COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND DISK DEVICE

WIRING BOARD AND DISPLAY DEVICE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEV...

MICROELECTRONIC DEVICES, RELATED ELECTRONIC SYSTEMS, AND METHODS OF...

OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...

OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...

ELECTRONIC DEVICE

CONDUCTIVE SLURRY, WATERPROOF PRESSING STRUCTURE, CIRCUIT MEMBRANE...

ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

CONDUCTOR BONDING METHOD