by building the multilayer layer by layer

Industry

CPC
H05K3/4644

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4644by building the multilayer layer by layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catheter splines with embedded circuit elements
- Patent number 12,150,751
- Issue date Nov 26, 2024
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of superconducting devices that control direct currents...
- Patent number 12,148,974
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Baleegh Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer printed circuit board made of different materials and m...
- Patent number 12,108,544
- Issue date Oct 1, 2024
- TSE CO., LTD.
- Eun Ha Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Millimeter thick magnetic PCB with high relative permeability and d...
- Patent number 12,094,630
- Issue date Sep 17, 2024
- Winchester Technologies, LLC
- Nian-Xiang Sun
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated electronic device with flexible and stretchable substrate
- Patent number 12,096,553
- Issue date Sep 17, 2024
- Carnegie Mellon University
- Gary K. Fedder
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Printed wiring board
- Patent number 12,082,338
- Issue date Sep 3, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method for manufacturing same
- Patent number 12,063,738
- Issue date Aug 13, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof to produce electrical circuits
- Patent number 12,063,748
- Issue date Aug 13, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Power module and manufacturing method thereof
- Patent number 12,058,814
- Issue date Aug 6, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,052,819
- Issue date Jul 30, 2024
- Ibiden Co., Ltd.
- Tomohiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked-layer board, electronic component module, and method of man...
- Patent number 12,052,821
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,035,485
- Issue date Jul 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Guh Hwan Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, light emitting device, and manufacturing method thereof
- Patent number 12,035,481
- Issue date Jul 9, 2024
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and method for manufacturing same
- Patent number 12,028,990
- Issue date Jul 2, 2024
- STEMCO CO., LTD.
- Sung Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for preparing same, and electronic device
- Patent number 12,028,965
- Issue date Jul 2, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qing Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Guided transport path correction
- Patent number 12,028,991
- Issue date Jul 2, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Ceramic electronic component
- Patent number 12,022,622
- Issue date Jun 25, 2024
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 12,022,612
- Issue date Jun 25, 2024
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,010,796
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Catalyzed Metal Foil and Uses Thereof
- Publication number 20240407106
- Publication date Dec 5, 2024
- Averatek Corporation
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20240381529
- Publication date Nov 14, 2024
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240314932
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chen-An TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDED TRANSPORT PATH CORRECTION
- Publication number 20240314941
- Publication date Sep 19, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...
- Publication number 20240304534
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Shu-Wei HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC CIRCUIT FOR ULTRASOUND CATHETERS AND RELATED DE...
- Publication number 20240268790
- Publication date Aug 15, 2024
- St. Jude Medical, Cardiology Division, Inc.
- Arthur G. Blanck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240276643
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240237195
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240237203
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...
- Publication number 20240237232
- Publication date Jul 11, 2024
- HANNSTAR DISPLAY CORPORATION
- Pei-Hao Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240224435
- Publication date Jul 4, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240215164
- Publication date Jun 27, 2024
- Shinko Electric Industries Co., Ltd.
- Kyota YAMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER BOARD INTEGRATED WITH MAGNETIC ELEMENT STRUCTURE AN...
- Publication number 20240215174
- Publication date Jun 27, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- SHIH-PING HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME,...
- Publication number 20240213133
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Hyungjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240206063
- Publication date Jun 20, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TELECOMMUNICATIONS DEVICE
- Publication number 20240204460
- Publication date Jun 20, 2024
- CommScope Technologies LLC
- Bernard Harold Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...
- Publication number 20240196535
- Publication date Jun 13, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Heasung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240196546
- Publication date Jun 13, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING
- Publication number 20240188212
- Publication date Jun 6, 2024
- Intel Corporation
- Mohammad Mamunur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
- Publication number 20240147633
- Publication date May 2, 2024
- DAIWA CO., LTD.
- Eiji YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138059
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240130050
- Publication date Apr 18, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HA...
- Publication number 20240130041
- Publication date Apr 18, 2024
- Dell Products L.P.
- Peng Lip Goh
- G06 - COMPUTING CALCULATING COUNTING

by building the multilayer layer by layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board having embedded component

Copper-clad laminate and method of forming the same

Circuit board structure and manufacturing method thereof

Providing a lower inductance path in a routing substrate for a capa...

Catheter splines with embedded circuit elements

Embedded circuit board and manufacturing method thereof

Fabrication of superconducting devices that control direct currents...

Circuit board and method for producing circuit board

Patterned article including electrically conductive elements

Wiring structure, method for manufacturing same, and semiconductor...

Multi-layer printed circuit board made of different materials and m...

Circuit board structure and manufacturing method thereof

Millimeter thick magnetic PCB with high relative permeability and d...

Integrated electronic device with flexible and stretchable substrate

Printed wiring board

Multilayer substrate and method for manufacturing same

Catalyzed metal foil and uses thereof to produce electrical circuits

Power module and manufacturing method thereof

Devices and methods related to metallization of ceramic substrates...

Printed wiring board and method for manufacturing printed wiring board

Stacked-layer board, electronic component module, and method of man...

Patterned conductive article

Printed circuit board and method for manufacturing the same

Circuit board, light emitting device, and manufacturing method thereof

Multilayer board and method for manufacturing same

Circuit board and method for preparing same, and electronic device

Guided transport path correction

Ceramic electronic component

Circuit board and manufacturing method thereof

Wiring substrate and method for manufacturing wiring substrate

Patents Applicationslast 30 patents

Catalyzed Metal Foil and Uses Thereof

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

GUIDED TRANSPORT PATH CORRECTION

THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...

PATTERNED CONDUCTIVE ARTICLE

FLEXIBLE ELECTRONIC CIRCUIT FOR ULTRASOUND CATHETERS AND RELATED DE...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

WIRING BOARD

PACKAGE CARRIER BOARD INTEGRATED WITH MAGNETIC ELEMENT STRUCTURE AN...

REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME,...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

TELECOMMUNICATIONS DEVICE

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...

PRINTED WIRING BOARD

PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HA...