-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ELECTRONIC DEVICE INCLUDING BATTERY
-
Publication number 20240064912
-
Publication date Feb 22, 2024
-
Samsung Electronics Co., Ltd.
-
Chungik LEE
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-
PRINTED CIRCUIT BOARD
-
Publication number 20240049389
-
Publication date Feb 8, 2024
-
Samsung Electro-Mechanics Co., Ltd.
-
Jin Uk LEE
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
SUBSTRATE STRUCTURE
-
Publication number 20230422411
-
Publication date Dec 28, 2023
-
Subtron Technology Co., Ltd.
-
Chung Ying Lu
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-
PRINTED CIRCUIT BOARD
-
Publication number 20230413437
-
Publication date Dec 21, 2023
-
Samsung Electro-Mechanics Co., Ltd.
-
Kye Hwan LEE
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
WIRING SUBSTRATE
-
Publication number 20230397335
-
Publication date Dec 7, 2023
-
IBIDEN CO., LTD.
-
Toshiki FURUTANI
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
ELECTRONIC COMPONENT
-
Publication number 20230397338
-
Publication date Dec 7, 2023
-
TDK Corporation
-
Atsuhiro TSUYOSHI
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-
-
-
-
WIRING SUBSTRATE
-
Publication number 20230380076
-
Publication date Nov 23, 2023
-
IBIDEN CO., LTD.
-
Masataka KATO
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-
COMPOSITE WIRING BOARD
-
Publication number 20230371186
-
Publication date Nov 16, 2023
-
TOPPAN INC.
-
Masashi SAWADAISHI
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR