by direct electroplating

Industry

CPC
H05K3/188

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/188by direct electroplating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low-roughness surface-treated copper foil with low bending deformat...
- Patent number 12,144,124
- Issue date Nov 12, 2024
- Lotte Energy Materials Corporation
- Chang Yol Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,101,890
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung Ju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Superconducting flex circuit boards having metal structures for imp...
- Patent number 12,082,335
- Issue date Sep 3, 2024
- Google LLC
- John Martinis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board
- Patent number 12,028,988
- Issue date Jul 2, 2024
- Ibiden Co., Ltd.
- Takuya Inishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,016,130
- Issue date Jun 18, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of printed circuit board dielectric molding and electrolytic...
- Patent number 12,004,306
- Issue date Jun 4, 2024
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 11,997,799
- Issue date May 28, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 11,979,983
- Issue date May 7, 2024
- Sumitomo Electric Industries, Ltd.
- Maki Ikebe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for manufacturing electrical components using e...
- Patent number 11,970,783
- Issue date Apr 30, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
- Patent number 11,923,123
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joined body of joining base material and metal layer
- Patent number 11,889,635
- Issue date Jan 30, 2024
- WORLD METAL CO., LTD
- Hidenori Hayashida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method for producing the same
- Patent number 11,871,514
- Issue date Jan 9, 2024
- Sumitomo Electric Industries, Ltd.
- Kenji Takahashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,871,526
- Issue date Jan 9, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,859,302
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- Heng-Ming Nien
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern forming method
- Patent number 11,800,648
- Issue date Oct 24, 2023
- Konica Minolta, Inc.
- Masayuki Ushiku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing insulated circuit board using a mask and parti...
- Patent number 11,761,108
- Issue date Sep 19, 2023
- Dowa Metaltech Co., Ltd.
- Masaaki Higo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for optimized filling hole and manufacturing fine line on pr...
- Patent number 11,729,917
- Issue date Aug 15, 2023
- TRIALLIAN CORPORATION
- Albert Yeh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,723,153
- Issue date Aug 8, 2023
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board
- Patent number 11,678,439
- Issue date Jun 13, 2023
- Macronix International Co., Ltd.
- Pei-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating method to reduce or eliminate voids in solder applied witho...
- Patent number 11,674,235
- Issue date Jun 13, 2023
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring structure, preparation method thereof, and display device
- Patent number 11,650,637
- Issue date May 16, 2023
- BOE Technology Group Co., Ltd.
- Haixu Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Massively-parallel micronozzle array for direct write electrodeposi...
- Patent number 11,639,556
- Issue date May 2, 2023
- Intel Corporation
- Joe Walczyk
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing embedded circuit board, embedded circuit b...
- Patent number 11,632,861
- Issue date Apr 18, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,582,872
- Issue date Feb 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ke-Jian Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage regulator module
- Patent number 11,546,994
- Issue date Jan 3, 2023
- Delta Electronics, Inc.
- Xueliang Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFAC...
- Publication number 20240431035
- Publication date Dec 26, 2024
- HAESUNG DS CO., LTD.
- Myeong Jin HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240414849
- Publication date Dec 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240397622
- Publication date Nov 28, 2024
- IBIDEN CO., LTD.
- Yoshiki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE
- Publication number 20240304462
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240298411
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240284606
- Publication date Aug 22, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251508
- Publication date Jul 25, 2024
- Sumitomo Electric Industries, Ltd.
- Masamichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251510
- Publication date Jul 25, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...
- Publication number 20240240347
- Publication date Jul 18, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...
- Publication number 20240237232
- Publication date Jul 11, 2024
- HANNSTAR DISPLAY CORPORATION
- Pei-Hao Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240196526
- Publication date Jun 13, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240179830
- Publication date May 30, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Woong Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...
- Publication number 20240147627
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro FUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMAT...
- Publication number 20240121902
- Publication date Apr 11, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING ELECTRONI...
- Publication number 20240090133
- Publication date Mar 14, 2024
- Murata Manufacturing Co., Ltd.
- Norikazu KUME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240057253
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Sang Myung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422408
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422406
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Takuya INISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20230337370
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230319987
- Publication date Oct 5, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20230309244
- Publication date Sep 28, 2023
- IBIDEN CO., LTD.
- Atsushi ISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230254979
- Publication date Aug 10, 2023
- IBIDEN CO., LTD.
- Yasuki KIMISHIMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230209721
- Publication date Jun 29, 2023
- Nitto Denko Corporation
- Shotaro NAGAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230209719
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MODIFIER FOR ELECTROLYTIC NICKEL PLATING AND NICKEL ELECTRO...
- Publication number 20230203693
- Publication date Jun 29, 2023
- YMT CO., LTD.
- Sung Wook CHUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230199957
- Publication date Jun 22, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing a Component Carrier and a Component Carrier
- Publication number 20230171897
- Publication date Jun 1, 2023
- AT&S (China) Co. Ltd.
- Ismadi Bin ISMAIL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

by direct electroplating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low-roughness surface-treated copper foil with low bending deformat...

Method of manufacturing printed circuit board

Superconducting flex circuit boards having metal structures for imp...

Printed wiring board

Method of manufacturing printed circuit board

Method of printed circuit board dielectric molding and electrolytic...

Method for manufacturing printed circuit board

Printed wiring board and method of manufacturing the same

Systems and methods for manufacturing electrical components using e...

Multilayer substrate and a manufacturing method of the multilayer s...

Electronic device housings with patterned electrolytic plating layers

Joined body of joining base material and metal layer

Printed circuit board and method of manufacturing the same

Flexible printed circuit board and method for producing the same

Circuit board and method of manufacturing circuit board

Electroplating apparatus and electroplating method

Plated metallization structures

Multilayer coil circuit substrate

Pattern forming method

Method for producing insulated circuit board using a mask and parti...

Method for manufacturing a circuit having a lamination layer using...

Method for optimized filling hole and manufacturing fine line on pr...

Printed circuit board and method of fabricating the same

Circuit board

Plating method to reduce or eliminate voids in solder applied witho...

Wiring structure, preparation method thereof, and display device

Massively-parallel micronozzle array for direct write electrodeposi...

Method for manufacturing embedded circuit board, embedded circuit b...

Circuit board

Voltage regulator module

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFAC...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...

WIRING SUBSTRATE

PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...

LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMAT...

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING ELECTRONI...

CIRCUIT BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

PLATING METHOD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

SURFACE MODIFIER FOR ELECTROLYTIC NICKEL PLATING AND NICKEL ELECTRO...

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR

Method of Manufacturing a Component Carrier and a Component Carrier