by dispensing droplets

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H01L2224/11318

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11318by dispensing droplets

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,569,196
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball disposition system, method of disposing a ball on a substrate...
- Patent number 11,488,928
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Sukmin Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 11,488,882
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,133,281
- Issue date Sep 28, 2021
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,741,467
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 10,700,249
- Issue date Jun 30, 2020
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,490,474
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump structure and manufacturing method therefor
- Patent number 10,312,208
- Issue date Jun 4, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xingtao Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 10,283,685
- Issue date May 7, 2019
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, solder joint, and method of manufacturing the sold...
- Patent number 10,173,287
- Issue date Jan 8, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 10,177,108
- Issue date Jan 8, 2019
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of solder and copper interconnect structures and associat...
- Patent number 10,068,863
- Issue date Sep 4, 2018
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,049,998
- Issue date Aug 14, 2018
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and a system for producing a semi-conductor module
- Patent number 9,978,703
- Issue date May 22, 2018
- REGIBUS MAX MICROELECTRONICS LLC
- Andreas Jakob
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond support structure and microelectronic package including w...
- Patent number 9,947,641
- Issue date Apr 17, 2018
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 9,941,140
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,893,026
- Issue date Feb 13, 2018
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery protection package and process of making the same
- Patent number 9,768,146
- Issue date Sep 19, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias and thermocompression bonding using inkjet-pri...
- Patent number 9,717,145
- Issue date Jul 25, 2017
- The Regents of the University of California
- Vivek Subramanian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 9,532,495
- Issue date Dec 27, 2016
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of solder and copper interconnect structures and associat...
- Patent number 9,508,667
- Issue date Nov 29, 2016
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,437,566
- Issue date Sep 6, 2016
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode body, wiring substrate, and semiconductor device
- Patent number 9,425,135
- Issue date Aug 23, 2016
- Olympus Corporation
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,418,916
- Issue date Aug 16, 2016
- Fuji Electric Co., Ltd.
- Yoko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20230402417
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...
- Publication number 20230395549
- Publication date Dec 7, 2023
- Hewlett-Packard Development Company, L.P.
- DAVID WAYNE GEORGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES
- Publication number 20230005870
- Publication date Jan 5, 2023
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...
- Publication number 20220013479
- Publication date Jan 13, 2022
- Changxin Memory Technologies, Inc.
- Ming-Teng HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...
- Publication number 20210249378
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- SUKMIN OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-on-Interposer Assembly with Dam Structure and Method of Manufac...
- Publication number 20190067148
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...
- Publication number 20180315731
- Publication date Nov 1, 2018
- Intel Corporation
- Kosuke Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20180254254
- Publication date Sep 6, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- XINGTAO XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20180204991
- Publication date Jul 19, 2018
- Seoul Viosys Co., Ltd.
- Chang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20170279020
- Publication date Sep 28, 2017
- Seoul Viosys Co., Ltd.
- Chang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Material, Solder Joint, and Method of Manufacturing the Sold...
- Publication number 20170252871
- Publication date Sep 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor Device and Method of Making Wafer Level Chip Scale Pa...
- Publication number 20170236802
- Publication date Aug 17, 2017
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20170162541
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME
- Publication number 20170098626
- Publication date Apr 6, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...
- Publication number 20170033068
- Publication date Feb 2, 2017
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRI...
- Publication number 20160315040
- Publication date Oct 27, 2016
- MK Electron Co., Ltd.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...
- Publication number 20160181217
- Publication date Jun 23, 2016
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...
- Publication number 20160148840
- Publication date May 26, 2016
- The Regents of the University of California
- Vivek Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and a System for Producing a Semi-Conductor Module
- Publication number 20160086904
- Publication date Mar 24, 2016
- INTERPOSERS GMBH
- Andreas JAKOB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20140124910
- Publication date May 8, 2014
- Byung-Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20140049922
- Publication date Feb 20, 2014
- MURATA MANUFACTURING CO., LTD.
- Shinya KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGING
- Publication number 20140004697
- Publication date Jan 2, 2014
- CHIPMOS TECHNOLOGIES INC.
- GENG SHIN SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE
- Publication number 20130256880
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antennas in Wafer Level Package
- Publication number 20130241059
- Publication date Sep 19, 2013
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- G01 - MEASURING TESTING
Information Patent Application
Method and A System for Producing a Semi-Conductor Module
- Publication number 20130059402
- Publication date Mar 7, 2013
- Andreas Jakob
- H01 - BASIC ELECTRIC ELEMENTS

by dispensing droplets

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming conductive layer, and conductive structure and f...

Semiconductor device and method of making wafer level chip scale pa...

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Ball disposition system, method of disposing a ball on a substrate...

Die-on-interposer assembly with dam structure and method of manufac...

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Die-on-interposer assembly with dam structure and method of manufac...

Light emitting device and method of fabricating the same

Expanded head pillar for bump bonds

Die-on-interposer assembly with dam structure and method of manufac...

Copper pillar bump structure and manufacturing method therefor

Light emitting device and method of fabricating the same

Solder material, solder joint, and method of manufacturing the sold...

Method of manufacturing electronic component module and electronic...

Conductive connections, structures with such connections, and metho...

Formation of solder and copper interconnect structures and associat...

Conductive connections, structures with such connections, and metho...

Method and a system for producing a semi-conductor module

Wire bond support structure and microelectronic package including w...

Semiconductor devices and methods of manufacture thereof

Systems, methods and devices for inter-substrate coupling

Conductive connections, structures with such connections, and metho...

Battery protection package and process of making the same

Systems, methods and devices for inter-substrate coupling

Through silicon vias and thermocompression bonding using inkjet-pri...

Method of manufacturing electronic component module and electronic...

Formation of solder and copper interconnect structures and associat...

Conductive connections, structures with such connections, and metho...

Electrode body, wiring substrate, and semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

REPAIR OF SOLDER BUMPS

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING

INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...

3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES

METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...

BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...

EXPANDED HEAD PILLAR FOR BUMP BONDS

Die-on-Interposer Assembly with Dam Structure and Method of Manufac...

INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...

COPPER PILLAR BUMP STRUCTURE AND MANUFACTURING METHOD THEREFOR

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

Solder Material, Solder Joint, and Method of Manufacturing the Sold...

Semiconductor Device and Method of Making Wafer Level Chip Scale Pa...

Semiconductor Devices and Methods of Manufacture Thereof

BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME

FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...

CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRI...

FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...

THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...

Method and a System for Producing a Semi-Conductor Module

FORMATION OF CONDUCTIVE CIRCUIT

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGING

ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE

Integrated Antennas in Wafer Level Package

Method and A System for Producing a Semi-Conductor Module