by forming build-up interconnects at chip-level

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/82by forming build-up interconnects at chip-level

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Patents Grantslast 30 patents

Information Patent Grant
IC device with chip to package interconnects from a copper metal in...
- Patent number 12,261,141
- Issue date Mar 25, 2025
- Texas Instruments Incorporated
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 12,255,166
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro LED
- Patent number 12,255,193
- Issue date Mar 18, 2025
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Jaekyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,249,588
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,243,842
- Issue date Mar 4, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate and circuit module using th...
- Patent number 12,243,841
- Issue date Mar 4, 2025
- TDK Corporation
- Toshiyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display with embedded pixel driver chips
- Patent number 12,243,863
- Issue date Mar 4, 2025
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with improved alignment of light emitting elements,...
- Patent number 12,243,877
- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Se Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits including micropatterns and using partial curing to adhere...
- Patent number 12,237,292
- Issue date Feb 25, 2025
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image display device manufacturing method and image display device
- Patent number 12,224,273
- Issue date Feb 11, 2025
- Nichia Corporation
- Hajime Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 12,224,182
- Issue date Feb 11, 2025
- Lumileds, LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing same
- Patent number 12,218,299
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Chang Il Tae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,218,070
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor wafer, semiconductor die, and...
- Patent number 12,205,919
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,205,854
- Issue date Jan 21, 2025
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly comprising a 3D block and method of making t...
- Patent number 12,205,881
- Issue date Jan 21, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 12,205,931
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing conductive tracks, and electronic module
- Patent number 12,183,710
- Issue date Dec 31, 2024
- Siemens Aktiengesellschaft
- Alexander Hensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of forming the same
- Patent number 12,176,321
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 12,176,327
- Issue date Dec 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 12,159,853
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for low temperature device bonding
- Patent number 12,154,880
- Issue date Nov 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,155,022
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRO-OPTIC BRIDGE CHIPS FOR CHIP-TO-CHIP COMMUNICATION
- Publication number 20250096142
- Publication date Mar 20, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Jae Kyu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR LOW TEMPERATURE DEVICE BONDING
- Publication number 20250087616
- Publication date Mar 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20250087627
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED CORE SUBSTRATE FOR EMBEDDING COMPONENTS
- Publication number 20250079328
- Publication date Mar 6, 2025
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
- Publication number 20250079354
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Steven Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250069899
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jakyoung Gu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20250054894
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20250046771
- Publication date Feb 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20250029947
- Publication date Jan 23, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preparation Method of Chip Package Structure and Package Structure
- Publication number 20250022827
- Publication date Jan 16, 2025
- Guangdong Fozhixin Microelectronics Technology Research Co., Ltd
- Xiangang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250015043
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240413136
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Tsung-Kai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404904
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
- Publication number 20240405005
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MAT...
- Publication number 20240395568
- Publication date Nov 28, 2024
- Resonac Corporation
- Keisuke NISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES
- Publication number 20240379570
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...
- Publication number 20240371783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20240363550
- Publication date Oct 31, 2024
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
- Publication number 20240355698
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS

by forming build-up interconnects at chip-level

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IC device with chip to package interconnects from a copper metal in...

Semiconductor package structure comprising via structure and redist...

Method for transferring micro LED

Semiconductor device and methods of manufacture

Semiconductor device with open cavity and method therefor

Electronic component embedded substrate and circuit module using th...

Display with embedded pixel driver chips

Display device with improved alignment of light emitting elements,...

Circuits including micropatterns and using partial curing to adhere...

Flexible electronic structure including a support element

Chip interconnecting method, interconnect device and method for for...

Image display device manufacturing method and image display device

Fan out structure for light-emitting diode (LED) device and lightin...

Display device and method for manufacturing same

Semiconductor package and method of fabricating the same

Chip assembling on adhesion layer or dielectric layer, extending be...

Method of processing a semiconductor wafer, semiconductor die, and...

Electronic device

Semiconductor assembly comprising a 3D block and method of making t...

High-density interconnects for integrated circuit packages

Method of transferring micro-light emitting diode for LED display

Integrated fan-out package, package-on-package structure, and manuf...

Method for producing conductive tracks, and electronic module

Semiconductor packages and method of forming the same

Method for fabricating electronic package

Semiconductor device with lead between a plurality of encapsulated...

Package structure including IPD and method of forming the same

Seamless interconnect thresholds using dielectric fluid channels

Method and structures for low temperature device bonding

Display device and method for manufacturing display device

Patents Applicationslast 30 patents

ELECTRO-OPTIC BRIDGE CHIPS FOR CHIP-TO-CHIP COMMUNICATION

METHOD AND STRUCTURES FOR LOW TEMPERATURE DEVICE BONDING

SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME

MOLDED CORE SUBSTRATE FOR EMBEDDING COMPONENTS

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

METHOD FOR FABRICATING ELECTRONIC PACKAGE

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

Preparation Method of Chip Package Structure and Package Structure

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

OPTOELECTRONIC SYSTEM

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MAT...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

PACKAGE STRUCTURE

MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...