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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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by forming build-up interconnects at chip-level
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last 30 patents
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Integrated system-in-package with radiation shielding
Patent number
11,978,709
Issue date
May 7, 2024
Texas Instruments Incorporated
Vivek Swaminathan Sridharan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Optical lithography system and method of using the same
Patent number
11,960,211
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,942,451
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multi-use package architecture
Patent number
11,929,295
Issue date
Mar 12, 2024
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
Patent number
11,929,330
Issue date
Mar 12, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked integrated circuits with redistribution lines
Patent number
11,923,338
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
Patent number
11,908,783
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Naoki Hayashi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated fan-out package and manufacturing method thereof
Patent number
11,894,336
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Microelectronic device with embedded die substrate on interposer
Patent number
11,894,311
Issue date
Feb 6, 2024
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
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Electrical interconnection of circuit elements on a substrate witho...
Patent number
11,881,466
Issue date
Jan 23, 2024
Orbotech Ltd.
Michael Zenou
H01 - BASIC ELECTRIC ELEMENTS
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Package structure
Patent number
11,874,513
Issue date
Jan 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Lun Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Polymer layer in semiconductor device and method of manufacture
Patent number
11,868,047
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Sih-Hao Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of transferring micro-light emitting diode for LED display
Patent number
11,869,880
Issue date
Jan 9, 2024
Samsung Electronics Co., Ltd.
Kyungwook Hwang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Molded semiconductor package having a negative standoff
Patent number
11,862,541
Issue date
Jan 2, 2024
Infineon Technologies AG
Thomas Stoek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Asymmetric stackup structure for SoC package substrates
Patent number
11,862,597
Issue date
Jan 2, 2024
Apple Inc.
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure and method of manufacturing the same
Patent number
11,855,030
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chiplets 3D SoIC system integration and fabrication methods
Patent number
11,855,020
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure and method of forming the same
Patent number
11,855,057
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for producing an electrically conductive connection on a sub...
Patent number
11,855,037
Issue date
Dec 26, 2023
Karlsruher Institut für Technologie
Uwe Bog
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Memory packages and methods of forming same
Patent number
11,855,046
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor packages and manufacturing methods thereof
Patent number
11,855,333
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Ping Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multi-chip semiconductor package
Patent number
11,848,319
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer scale bonded active photonics interposer
Patent number
11,841,531
Issue date
Dec 12, 2023
The Research Foundation for the State University of New York
Douglas Coolbaugh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,842,970
Issue date
Dec 12, 2023
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device structure and method for manufacturing the same
Patent number
11,837,595
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display device
Patent number
11,830,885
Issue date
Nov 28, 2023
Samsung Display Co., Ltd.
Do Yeong Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Lead between a plurality of encapsulated MOSFETs
Patent number
11,830,792
Issue date
Nov 28, 2023
Rohm Co., Ltd.
Kentaro Nasu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package structure comprising via structure and redist...
Patent number
11,817,413
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Neng-Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electrical interconnect structure using metal bridges to interconne...
Patent number
11,810,895
Issue date
Nov 7, 2023
Honeywell Federal Manufacturing & Technologies, LLC
Barbara Diane Young
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
IPD modules with flexible connection scheme in packaging
Patent number
11,798,925
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...
Publication number
20240145429
Publication date
May 2, 2024
STMicroelectronics S.r.l.
Riccardo VILLA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
Publication number
20240136297
Publication date
Apr 25, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yingqiang YAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
Publication number
20240128635
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Ping Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED M...
Publication number
20240128197
Publication date
Apr 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Olaf ZSCHIESCHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
Publication number
20240105661
Publication date
Mar 28, 2024
Unimicron Technology Corp.
Yu-Shen CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MEMORY PACKAGES AND METHODS OF FORMING SAME
Publication number
20240105682
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co, LTD.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096837
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CHIPLETS 3D SOIC SYSTEM INTEGRATION AND FABRICATION METHODS
Publication number
20240088077
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240088085
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
Publication number
20240072032
Publication date
Feb 29, 2024
QUALCOMM Incorporated
Yanmei SONG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240071999
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tseng Hsing Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...
Publication number
20240063048
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Ching Lo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240055329
Publication date
Feb 15, 2024
ROHM CO., LTD.
Kentaro NASU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240047403
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Neng-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
Publication number
20240030265
Publication date
Jan 25, 2024
Semiconductor Components Industries, LLC
Weng-Jin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE
Publication number
20240021559
Publication date
Jan 18, 2024
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Di ZHAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
Publication number
20240014142
Publication date
Jan 11, 2024
Mike Morianz
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICE
Publication number
20240006249
Publication date
Jan 4, 2024
InnoLux Corporation
Yeong-E CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20240008298
Publication date
Jan 4, 2024
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
Publication number
20240006377
Publication date
Jan 4, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230411230
Publication date
Dec 21, 2023
InnoLux Corporation
Cheng-Chi WANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...
Publication number
20230411263
Publication date
Dec 21, 2023
STATS ChipPAC Pte Ltd.
SooHan PARK
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY
Publication number
20230395575
Publication date
Dec 7, 2023
Samsung Electronics Co., Ltd.
Kyungwook HWANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Polymer Layer in Semiconductor Device and Method of Manufacture
Publication number
20230384672
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Sih-Hao Liao
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
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Patent Application
DISPLAY WITH EMBEDDED PIXEL DRIVER CHIPS
Publication number
20230387097
Publication date
Nov 30, 2023
Apple Inc.
Hsin-Hua Hu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
3DIC Interconnect Apparatus and Method
Publication number
20230378139
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Redistribution Layer (RDL) Layouts for Integrated Circuits
Publication number
20230378116
Publication date
Nov 23, 2023
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
Cheng-Yuan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...
Publication number
20230369292
Publication date
Nov 16, 2023
Huawei Technologies Co., Ltd
Shan GAO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...
Publication number
20230369158
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS