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H01L2224/80935
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80935
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device including a structure for higher integration
Patent number
12,199,123
Issue date
Jan 14, 2025
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Yoshiya Hagimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Member for solid-state image pickup device and method for manufactu...
Patent number
12,142,629
Issue date
Nov 12, 2024
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Member for solid-state image pickup device and method for manufactu...
Patent number
11,843,023
Issue date
Dec 12, 2023
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive barrier direct hybrid bonding
Patent number
11,830,838
Issue date
Nov 28, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
Patent number
11,742,374
Issue date
Aug 29, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Yoshiya Hagimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
11,569,123
Issue date
Jan 31, 2023
Sony Corporation
Yoshihisa Kagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical mechanical polishing for hybrid bonding
Patent number
11,552,041
Issue date
Jan 10, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Member for solid-state image pickup device and method for manufactu...
Patent number
11,545,519
Issue date
Jan 3, 2023
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of assembly by direct bonding between two elements, each ele...
Patent number
11,305,372
Issue date
Apr 19, 2022
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Lea Di Cioccio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conductive barrier direct hybrid bonding
Patent number
11,264,345
Issue date
Mar 1, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding and connecting substrates
Patent number
11,107,855
Issue date
Aug 31, 2021
Sony Corporation
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
10,985,102
Issue date
Apr 20, 2021
Sony Corporation
Yoshihisa Kagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor apparatus and method for preparing the same
Patent number
10,923,455
Issue date
Feb 16, 2021
Nanya Technology Corporation
Po-Chun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical mechanical polishing for hybrid bonding
Patent number
10,840,205
Issue date
Nov 17, 2020
INVENSAS BONDING TECHNOLOGIES, INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for preparing a semiconductor apparatus
Patent number
10,825,794
Issue date
Nov 3, 2020
Nanya Technology Corporation
Po-Chun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with multiple substrates electrically connecte...
Patent number
10,707,258
Issue date
Jul 7, 2020
Sony Corporation
Nobutoshi Fujii
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Member for solid-state image pickup device and method for manufactu...
Patent number
10,651,231
Issue date
May 12, 2020
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Increased contact alignment tolerance for direct bonding
Patent number
10,607,937
Issue date
Mar 31, 2020
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
Publication number
20250063832
Publication date
Feb 20, 2025
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH IC SUBSTRATE AND ELECTRONIC COMPONENT CONNECTED WITH D...
Publication number
20250062261
Publication date
Feb 20, 2025
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Johannes STAHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
Publication number
20240379607
Publication date
Nov 14, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
Publication number
20240243085
Publication date
Jul 18, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
Publication number
20240088196
Publication date
Mar 14, 2024
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
Publication number
20230361145
Publication date
Nov 9, 2023
Sony Semiconductor Solutions Corporation
YOSHIYA HAGIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
Publication number
20230268308
Publication date
Aug 24, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
Publication number
20230075728
Publication date
Mar 9, 2023
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
Publication number
20220254746
Publication date
Aug 11, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. ENQUIST
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
Publication number
20210391369
Publication date
Dec 16, 2021
Sony Semiconductor Solutions Corporation
YOSHIYA HAGIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
Publication number
20210366958
Publication date
Nov 25, 2021
SONY GROUP CORPORATION
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
Publication number
20210066233
Publication date
Mar 4, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Gaius Gillman FOUNTAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
Publication number
20200243584
Publication date
Jul 30, 2020
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS