by liquid chemical etching

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H05K3/002

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/002by liquid chemical etching

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,267,958
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Hiromitsu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming engineered thermal paths of printed circuit boa...
- Patent number 12,262,464
- Issue date Mar 25, 2025
- Matthew D. Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive dry film, and printed wiring board with photosensiti...
- Patent number 12,259,652
- Issue date Mar 25, 2025
- Tamura Corporation
- Ryoya Takashima
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Board edge electrical contact structures
- Patent number 12,250,770
- Issue date Mar 11, 2025
- Nokia Solutions and Networks Oy
- David North
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and cutting method thereof
- Patent number 12,250,776
- Issue date Mar 11, 2025
- Unimicron Technology Corp.
- Jeng-Ting Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for utilizing laser cutting and chemical etchin...
- Patent number 12,212,149
- Issue date Jan 28, 2025
- NuCurrent, Inc.
- Oleg Los
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 12,176,384
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and method for manufacturing the same
- Patent number 12,171,064
- Issue date Dec 17, 2024
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for via-hole processing, via-hole processing device, and via-ho...
- Patent number 12,156,347
- Issue date Nov 26, 2024
- LG Innotek Co., Ltd
- Jong Heum Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for shaping flexible circuits to improve routin...
- Patent number 12,156,342
- Issue date Nov 26, 2024
- Aptiv Technologies AG
- David G. Siegfried
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 12,156,345
- Issue date Nov 26, 2024
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,144,158
- Issue date Nov 12, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Component carrier comprising at least two components
- Patent number 12,041,721
- Issue date Jul 16, 2024
- AT&S(Chongqing) Company Limited
- Dominik Wilding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a multi-layer for a probe card
- Patent number 12,019,111
- Issue date Jun 25, 2024
- Technoprobe S.p.A.
- Roberto Crippa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
2D and 3D inductors fabricating photoactive substrates
- Patent number 11,929,199
- Issue date Mar 12, 2024
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer composition for laser direct structuring
- Patent number 11,912,817
- Issue date Feb 27, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate, wiring board, and copper foil provided with r...
- Patent number 11,895,770
- Issue date Feb 6, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photosensitive insulating paste and electronic component
- Patent number 11,886,114
- Issue date Jan 30, 2024
- Murata Manufacturing Co., Ltd.
- Kenta Kondo
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...
- Publication number 20250113439
- Publication date Apr 3, 2025
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250089171
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250081354
- Publication date Mar 6, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LAMINATED WIRING BOARD
- Publication number 20250081329
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20250071909
- Publication date Feb 27, 2025
- HAESUNG DS CO., LTD.
- Soon-Chul KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods for Shaping Flexible Circuits to Improve Routin...
- Publication number 20250063670
- Publication date Feb 20, 2025
- Aptiv Technologies AG
- David G. Siegfried
- B60 - VEHICLES IN GENERAL
Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...
- Publication number 20250031315
- Publication date Jan 23, 2025
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND ELECTRICAL CONTACT ELEMENT
- Publication number 20250031305
- Publication date Jan 23, 2025
- Rohde& Schwarz GmbH & Co. KG
- Mathias NAGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250016909
- Publication date Jan 9, 2025
- Sumitomo Electric Industries, Ltd.
- Shun IGARASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...
- Publication number 20240407107
- Publication date Dec 5, 2024
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis RATAUTAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF
- Publication number 20240357748
- Publication date Oct 24, 2024
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240284600
- Publication date Aug 22, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MAKING A BATTERY SENSOR
- Publication number 20240274895
- Publication date Aug 15, 2024
- Xin HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...
- Publication number 20240222888
- Publication date Jul 4, 2024
- Huawei Technologies Co., Ltd
- Shuzhao Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY, LIGHT MODULE, AND METHOD FOR CONSTRUCTING AN E...
- Publication number 20240206047
- Publication date Jun 20, 2024
- HELLA GmbH & Co. KGaA
- Sebastian BARTSCHER
- F21 - LIGHTING
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A PACKAGE SUBSTRATE
- Publication number 20240188222
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Composition For Laser Direct Structuring
- Publication number 20240166803
- Publication date May 23, 2024
- Ticona LLC
- Young Shin Kim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD, WIRING CIRCUIT BOARD WIT...
- Publication number 20240164024
- Publication date May 16, 2024
- Nitto Denko Corporation
- Ikuya HASHIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES
- Publication number 20240130093
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
- Publication number 20240121903
- Publication date Apr 11, 2024
- Kyocera Corporation
- Atsuo KAWAGOE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING C...
- Publication number 20240107678
- Publication date Mar 28, 2024
- NGK Electronics Devices, Inc.
- Kota KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER FOLDED 3D ELECTRONICS
- Publication number 20240090126
- Publication date Mar 14, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Nathan S. Lazarus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED MET...
- Publication number 20240074064
- Publication date Feb 29, 2024
- Heraeus Deutschland GmbH & Co. KG
- Richard WACKER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTIN...
- Publication number 20240064908
- Publication date Feb 22, 2024
- Aptiv Technologies Limited
- David G. Siegfried
- B60 - VEHICLES IN GENERAL

by liquid chemical etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component and manufacturing method thereof

Methods for forming engineered thermal paths of printed circuit boa...

Photosensitive dry film, and printed wiring board with photosensiti...

Board edge electrical contact structures

Substrate structure and cutting method thereof

Systems and methods for utilizing laser cutting and chemical etchin...

Circuit board

Methods of parallel transfer of micro-devices using treatment

Component carrier and method of manufacturing a component carrier

Interconnect and method for manufacturing the same

Jig for via-hole processing, via-hole processing device, and via-ho...

Systems and methods for shaping flexible circuits to improve routin...

Overmolded components having sub-flush residuals

Power electronics assemblies having embedded power electronics devices

Wiring structure and method of manufacturing the same, semiconducto...

Hermetic metallized via with improved reliability

Reciprocal PCB manufacturing process

Panel molded electronic assemblies with multi-surface conductive co...

Method for manufacturing microelectrode film

Component carrier comprising at least two components

Manufacturing method of a multi-layer for a probe card

Redistribution plate

Component-embedded substrate

Printed circuit board structure including a closed cavity

Method for manufacturing transparent circuit board

2D and 3D inductors fabricating photoactive substrates

Polymer composition for laser direct structuring

Fine feature formation techniques for printed circuit boards

Copper-clad laminate, wiring board, and copper foil provided with r...

Photosensitive insulating paste and electronic component

Patents Applicationslast 30 patents

CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND LAMINATED WIRING BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD

Systems and Methods for Shaping Flexible Circuits to Improve Routin...

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

METHOD AND ELECTRICAL CONTACT ELEMENT

PRINTED WIRING BOARD

METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...

SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF

WIRING SUBSTRATE

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

METHOD OF MAKING A BATTERY SENSOR

CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

ELECTRONIC ASSEMBLY, LIGHT MODULE, AND METHOD FOR CONSTRUCTING AN E...

TRANSPARENT CIRCUIT BOARD

METHOD OF FORMING A PACKAGE SUBSTRATE

Polymer Composition For Laser Direct Structuring

METHOD FOR PRODUCING WIRING CIRCUIT BOARD, WIRING CIRCUIT BOARD WIT...

POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD

METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING C...

LASER FOLDED 3D ELECTRONICS

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED MET...

SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTIN...