by means of pressure

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CPC
H01L2224/783

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/783by means of pressure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of calibrating an ultrasonic characteristic on a wire bondi...
- Patent number 12,113,043
- Issue date Oct 8, 2024
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus, method for measuring opening amount of clam...
- Patent number 12,087,725
- Issue date Sep 10, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,427
- Issue date Aug 6, 2024
- Shinkawa Ltd.
- Osamu Kakutani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic horn and manufacturing apparatus of semiconductor device
- Patent number 12,046,574
- Issue date Jul 23, 2024
- Shinkawa Ltd.
- Yuhei Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding tools and methods of using the same
- Patent number 11,978,718
- Issue date May 7, 2024
- Kulicke and Soffa Industries, Inc,.
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic material and wire bonding capillary
- Patent number 11,964,915
- Issue date Apr 23, 2024
- Industrial Technology Research Institute
- Tien-Heng Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-segment wire-bond
- Patent number 11,869,868
- Issue date Jan 9, 2024
- Semiconductor Components Industries, LLC
- Elmer Cunanan Bayron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 11,824,038
- Issue date Nov 21, 2023
- Shinkawa Ltd.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force sensor in an ultrasonic wire bonding device
- Patent number 11,798,911
- Issue date Oct 24, 2023
- ASMPT SINGAPORE PTE. LTD.
- Hing Leung Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge tool, bonding device, and bonding inspection method
- Patent number 11,756,919
- Issue date Sep 12, 2023
- Mitsubishi Electric Corporation
- Daisuke Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary guide device and wire bonding apparatus
- Patent number 11,717,912
- Issue date Aug 8, 2023
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for calibrating an ultrasonic bonding machine
- Patent number 11,646,291
- Issue date May 9, 2023
- Infineon Technologies AG
- Florian Eacock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method for semiconductor package
- Patent number 11,594,503
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Hosoo Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-segment wire-bond
- Patent number 11,515,284
- Issue date Nov 29, 2022
- Semiconductor Components Industries, LLC
- Elmer Cunanan Bayron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic transducer systems including tuned resonators, equipment...
- Patent number 11,462,506
- Issue date Oct 4, 2022
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
- Patent number 11,450,640
- Issue date Sep 20, 2022
- Shinkawa Ltd.
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 11,417,625
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding device
- Patent number 11,404,393
- Issue date Aug 2, 2022
- Kaijo Corporation
- Eiji Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 11,398,449
- Issue date Jul 26, 2022
- Kabushiki Kaisha Toshiba
- Kazuya Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number RE49045
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding process with rotating bonding stage
- Patent number 11,273,515
- Issue date Mar 15, 2022
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus with rotating bonding stage
- Patent number 11,173,567
- Issue date Nov 16, 2021
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240335901
- Publication date Oct 10, 2024
- Mitsubishi Electric Corporation
- Erubi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL BONDING FOR SEMICONDUCTOR DEVICES
- Publication number 20240290746
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR STITCH BOND
- Publication number 20240250060
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...
- Publication number 20240203933
- Publication date Jun 20, 2024
- SHINKAWA LTD.
- Hikaru MIURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...
- Publication number 20240079375
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hiroaki HOKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20230343742
- Publication date Oct 26, 2023
- SHINKAWA LTD.
- Yuhei ITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING CAPILLARY
- Publication number 20230311239
- Publication date Oct 5, 2023
- CRAFTSTECH, INC.
- Jeffrey C. Roberts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298981
- Publication date Sep 21, 2023
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20230282613
- Publication date Sep 7, 2023
- SHINKAWA LTD.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230178510
- Publication date Jun 8, 2023
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
- Publication number 20230163097
- Publication date May 25, 2023
- SHINKAWA LTD.
- Hiroaki YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230125756
- Publication date Apr 27, 2023
- SHINKAWA LTD.
- Osamu KAKUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-SEGMENT WIRE-BOND
- Publication number 20230098210
- Publication date Mar 30, 2023
- Semiconductor Components Industries, LLC
- Elmer Cunanan BAYRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...
- Publication number 20220320040
- Publication date Oct 6, 2022
- Yamaha Robotics Holdings Co., Ltd.
- Hiroshi MUNAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...
- Publication number 20220310552
- Publication date Sep 29, 2022
- SHINKAWA LTD.
- Toshihiko TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING SHEAR STRENGTH OF BONDED FREE AIR BALLS ON W...
- Publication number 20220270937
- Publication date Aug 25, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- G01 - MEASURING TESTING
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic material and wire bonding capillary
- Publication number 20220204409
- Publication date Jun 30, 2022
- Industrial Technology Research Institute
- Tien-Heng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220199567
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- JUNGSEOK RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20220199570
- Publication date Jun 23, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SEGMENT WIRE-BOND
- Publication number 20220020720
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- Elmer Cunanan BAYRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
- Publication number 20210366869
- Publication date Nov 25, 2021
- KAIJO CORPORATION
- Eiji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20210358873
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hosoo HAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20210288019
- Publication date Sep 16, 2021
- Kabushiki Kaisha Toshiba
- Kazuya MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS

by means of pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of calibrating an ultrasonic characteristic on a wire bondi...

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus, method for measuring opening amount of clam...

Methods of forming wire interconnect structures and related wire bo...

Wire bonding apparatus

Ultrasonic horn and manufacturing apparatus of semiconductor device

Ribbon bonding tools and methods of using the same

Ceramic material and wire bonding capillary

Multi-segment wire-bond

Wire bonding apparatus

Force sensor in an ultrasonic wire bonding device

Method for bonding insulated coating wire, connection structure, me...

Wedge tool, bonding device, and bonding inspection method

Package-on-package assembly with wire bond vias

Capillary guide device and wire bonding apparatus

Semiconductor device

Method for calibrating an ultrasonic bonding machine

Wire bonding method for semiconductor package

Multi-segment wire-bond

Ultrasonic transducer systems including tuned resonators, equipment...

Wire bonding apparatus and manufacturing method for semiconductor a...

Semiconductor device having an electrical connection between semico...

Wire bonding method and wire bonding device

Semiconductor device and wire bonding method

Package on package devices and methods of packaging semiconductor dies

Method of vertically vibrating a bonding arm

Bonding process with rotating bonding stage

Method for calibrating wire clamp device

Package-on-package assembly with wire bond vias

Bonding apparatus with rotating bonding stage

Patents Applicationslast 30 patents

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BALL BONDING FOR SEMICONDUCTOR DEVICES

CAPILLARY FOR STITCH BOND

ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...

ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

WIRE BONDING CAPILLARY

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

WIRE BONDING APPARATUS

WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

WIRE BONDING APPARATUS

MULTI-SEGMENT WIRE-BOND

WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...

WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...

METHODS OF DETERMINING SHEAR STRENGTH OF BONDED FREE AIR BALLS ON W...

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

Ceramic material and wire bonding capillary

SEMICONDUCTOR PACKAGE

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

MULTI-SEGMENT WIRE-BOND

WIRE BONDING METHOD AND WIRE BONDING DEVICE

WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD