by printed shielding conductors, ground planes or power plane

Industry

CPC
H05K1/0218

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0218by printed shielding conductors, ground planes or power plane

Industries

Patents Grantslast 30 patents

Information Patent Grant
PCB for heatsink based power delivery
- Patent number 11,963,289
- Issue date Apr 16, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 11,950,361
- Issue date Apr 2, 2024
- VEEA INC.
- Shaun Joseph Greaney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,942,334
- Issue date Mar 26, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and display device
- Patent number 11,930,587
- Issue date Mar 12, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Fan Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board (PCB) including heatsinks
- Patent number 11,924,962
- Issue date Mar 5, 2024
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for galvanic effect reduction
- Patent number 11,924,964
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency module
- Patent number 11,903,120
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board design for high speed application
- Patent number 11,903,121
- Issue date Feb 13, 2024
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of electric field effects in a printed circuit board assemb...
- Patent number 11,877,413
- Issue date Jan 16, 2024
- Sparton DeLeon Springs, LLC
- Lendon L. Bendix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,864,307
- Issue date Jan 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,864,313
- Issue date Jan 2, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kishimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic device including multiple printed circuit boards
- Patent number 11,864,318
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Wanjae Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for printed wiring board
- Patent number 11,856,688
- Issue date Dec 26, 2023
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Masahiro Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrode assembly for mass spectrometer
- Patent number 11,848,185
- Issue date Dec 19, 2023
- Micromass UK Limited
- Boris Kozlov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and display touch apparatus
- Patent number 11,839,018
- Issue date Dec 5, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Wenxiao Niu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board and electronic device
- Patent number 11,818,840
- Issue date Nov 14, 2023
- Mitsubishi Electric Corporation
- Koji Shigeta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,818,841
- Issue date Nov 14, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hae Kyo Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,812,552
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chul Mun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module and manufacturing method of the same
- Patent number 11,799,267
- Issue date Oct 24, 2023
- Sumitomo Electric Industries, Ltd.
- Kosuke Okawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 11,792,914
- Issue date Oct 17, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi-Hong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and optical transceiver
- Patent number 11,792,915
- Issue date Oct 17, 2023
- CIG PHOTONICS JAPAN LIMITED
- Osamu Kagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 11,785,706
- Issue date Oct 10, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless power transmitter and wireless power receiver including mu...
- Patent number 11,777,341
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Chong-Min Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Axial field rotary energy device having PCB stator with non-linear...
- Patent number 11,777,354
- Issue date Oct 3, 2023
- Infinitum Electric, Inc.
- Paulo Guedes-Pinto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and wireless communication terminal
- Patent number 11,778,730
- Issue date Oct 3, 2023
- FCNT LIMITED
- Takahiro Shinojima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit and display device
- Patent number 11,765,830
- Issue date Sep 19, 2023
- Chengdu Boe Optoelectronics Technology Co., Ltd.
- Lianbin Liu
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device comprising printed circuit board with slits
- Patent number 11,765,812
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Namseok Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate
- Patent number 11,751,321
- Issue date Sep 5, 2023
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS
- Publication number 20240147602
- Publication date May 2, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianfeng YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SURGE PROTECTIVE DEVICES
- Publication number 20240127991
- Publication date Apr 18, 2024
- Raycap, S.A.
- Georgios Peppas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240090121
- Publication date Mar 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD
- Publication number 20240074034
- Publication date Feb 29, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR WITH INTEGRATED GROUND PLANE
- Publication number 20240063562
- Publication date Feb 22, 2024
- Neoconix, Inc.
- Woody Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20240064890
- Publication date Feb 22, 2024
- Murata Manufacturing Co., Ltd.
- Keisuke TERANISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240049381
- Publication date Feb 8, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Su Zhi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PHASED ARRAY ANTENNA SYSTEMS AND METHODS
- Publication number 20240030600
- Publication date Jan 25, 2024
- The Boeing Company
- Ted Dabrowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER CIRCUIT
- Publication number 20230422392
- Publication date Dec 28, 2023
- PONTOSENSE INC.
- Yunlong LUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT
- Publication number 20230411832
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Han-Min CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE ABSORBER
- Publication number 20230397324
- Publication date Dec 7, 2023
- SONY GROUP CORPORATION
- TAKASHI KAWAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS
- Publication number 20230371169
- Publication date Nov 16, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION MEMBER AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230363091
- Publication date Nov 9, 2023
- SAMSUNG DISPLAY CO., LTD.
- Kyu Min HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230363086
- Publication date Nov 9, 2023
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT CABLE ASSEMBLY WITH ELECTROMAGNETIC SHIELDING
- Publication number 20230345618
- Publication date Oct 26, 2023
- Microsoft Technology Licensing, LLC
- Jaejin LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Efficient Wave Guide Transition Between Package and PCB Using Solde...
- Publication number 20230345623
- Publication date Oct 26, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESETTING DIFFERENT PAIR SKEW OF PRINTED CIRCUIT BOARD TRACES
- Publication number 20230345626
- Publication date Oct 26, 2023
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Electronic Device
- Publication number 20230345619
- Publication date Oct 26, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qianlin PU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB FOR HEATSINK BASED POWER DELIVERY
- Publication number 20230337356
- Publication date Oct 19, 2023
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMC FILTER FOR A CONTROL DEVICE
- Publication number 20230328874
- Publication date Oct 12, 2023
- ROBERT BOSCH GmbH
- Rupert Fackler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR GALVANIC EFFECT REDUCTION
- Publication number 20230328873
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20230319978
- Publication date Oct 5, 2023
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS
- Publication number 20230309213
- Publication date Sep 28, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Thomas Matthew Selter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD HAVING SIGNAL AND POWER ISOLATION CIRCUIT
- Publication number 20230276567
- Publication date Aug 31, 2023
- Murata Manufacturing Co., Ltd.
- Tarou HIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20230262879
- Publication date Aug 17, 2023
- MURATA MANUFACTURING CO., LTD.
- Masateru HIGASHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Selected Reject Band Non-Radiofrequency-Coupling Tile and Associate...
- Publication number 20230262898
- Publication date Aug 17, 2023
- LAM RESEARCH CORPORATION
- Sunil KAPOOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY MODULE PRINTED CIRCUIT BOARD ASSEMBLY SYSTEM AND METHOD
- Publication number 20230249554
- Publication date Aug 10, 2023
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20230239996
- Publication date Jul 27, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230232527
- Publication date Jul 20, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY MODULE, COMMUNICATION DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20230189433
- Publication date Jun 15, 2023
- MURATA MANUFACTURING CO., LTD.
- Takanori UEJIMA
- H03 - BASIC ELECTRONIC CIRCUITRY

by printed shielding conductors, ground planes or power plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

PCB for heatsink based power delivery

Efficient wave guide transition between package and PCB using solde...

Method and procedure for miniaturing a multi-layer PCB

Microelectronic assemblies having conductive structures with differ...

Flexible printed circuit board and display device

Printed circuit board (PCB) including heatsinks

Printed circuit board for galvanic effect reduction

Radio frequency module

Printed circuit board design for high speed application

Control of electric field effects in a printed circuit board assemb...

Printed circuit board

Multilayer wiring substrate

Electronic device including multiple printed circuit boards

Adhesive film for printed wiring board

Electrode assembly for mass spectrometer

Flexible printed circuit board and display touch apparatus

Printed wiring board and electronic device

Printed circuit board

Printed circuit board

Optical module and manufacturing method of the same

Substrate with buried component and manufacture method thereof

Circuit board assembly and manufacturing method thereof

Printed circuit board and optical transceiver

Interlaced crosstalk controlled traces, vias, and capacitors

Wireless power transmitter and wireless power receiver including mu...

Axial field rotary energy device having PCB stator with non-linear...

Printed circuit board and wireless communication terminal

Flexible printed circuit and display device

Electronic device comprising printed circuit board with slits

Resin multilayer substrate

Patents Applicationslast 30 patents

CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS

SURGE PROTECTIVE DEVICES

PRINTED CIRCUIT BOARD

ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD

ELECTRICAL CONNECTOR WITH INTEGRATED GROUND PLANE

MULTILAYER SUBSTRATE

CIRCUIT BOARD AND ELECTRONIC DEVICE

FLEXIBLE PHASED ARRAY ANTENNA SYSTEMS AND METHODS

FILTER CIRCUIT

ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT

ELECTROMAGNETIC WAVE ABSORBER

INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS

CONNECTION MEMBER AND DISPLAY DEVICE INCLUDING SAME

ELECTRONIC DEVICE

FLEXIBLE PRINTED CIRCUIT CABLE ASSEMBLY WITH ELECTROMAGNETIC SHIELDING

Efficient Wave Guide Transition Between Package and PCB Using Solde...

RESETTING DIFFERENT PAIR SKEW OF PRINTED CIRCUIT BOARD TRACES

Circuit Board and Electronic Device

PCB FOR HEATSINK BASED POWER DELIVERY

EMC FILTER FOR A CONTROL DEVICE

PRINTED CIRCUIT BOARD FOR GALVANIC EFFECT REDUCTION

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS

MULTILAYER CIRCUIT BOARD HAVING SIGNAL AND POWER ISOLATION CIRCUIT

HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

Selected Reject Band Non-Radiofrequency-Coupling Tile and Associate...

BATTERY MODULE PRINTED CIRCUIT BOARD ASSEMBLY SYSTEM AND METHOD

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME

HIGH-FREQUENCY MODULE, COMMUNICATION DEVICE, AND METHOD FOR MANUFAC...