by selective deposition of conductive material in the vias

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H01L21/76879

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76879by selective deposition of conductive material in the vias

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,117
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of rigid close-pitch interconnects
- Patent number 11,972,977
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via of integrated circuitry, memory array comprising str...
- Patent number 11,972,978
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 11,967,560
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten deposition at low temperatures
- Patent number 11,967,525
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and manufacturing method thereof
- Patent number 11,967,526
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
- Patent number 11,948,874
- Issue date Apr 2, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch barrier for microelectronic packaging conductive structures
- Patent number 11,948,898
- Issue date Apr 2, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having alternating selective metal and diel...
- Patent number 11,942,426
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die modules for semiconductor device assemblies and methods...
- Patent number 11,942,430
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having at least one via including concave port...
- Patent number 11,942,398
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,935,783
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact window structure and method for forming contact window stru...
- Patent number 11,929,280
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming via structure having low interface resistance
- Patent number 11,929,321
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive metals and subtractive metal semiconductor structures
- Patent number 11,923,244
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of conductor nanowires
- Patent number 11,908,789
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect including integrally formed capacitor
- Patent number 11,908,738
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device and method of forming the same
- Patent number 11,901,183
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 11,901,227
- Issue date Feb 13, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 11,887,929
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupled interconnect structures
- Patent number 11,876,047
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Saumya Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for electrochemical deposition of isolated seed layer areas
- Patent number 11,875,996
- Issue date Jan 16, 2024
- Applied Materials, Inc.
- Marvin Louis Bernt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite dielectric structures for semiconductor die assemblies an...
- Patent number 11,862,607
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Hung Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
- Publication number 20240145436
- Publication date May 2, 2024
- Micron Technology, Inc.
- Hung Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240136191
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN...
- Publication number 20240136225
- Publication date Apr 25, 2024
- IMEC vzw
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE OF LINE DIELECTRIC LAYER ENGINEERING FOR VIA VOID PREVENTION
- Publication number 20240105509
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE STRUCTURES AND METHODS OF FABRICATING THE SAME
- Publication number 20240099149
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Yin
- G11 - INFORMATION STORAGE
Information Patent Application
SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS
- Publication number 20240096698
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ELECTRONIC DEVICES INCLUDING RECESSED CONDUCTIVE...
- Publication number 20240099006
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- Sidhartha Gupta
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...
- Publication number 20240087952
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL
- Publication number 20240087955
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240079255
- Publication date Mar 7, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- Ji He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL POWER LINES WITH ALIGNED SIGNAL WIRES
- Publication number 20240079295
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Via With Improved Gap Filling Performance
- Publication number 20240071813
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240071869
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS
- Publication number 20240071927
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Shinjae Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Improving Copper Alloy Electroplating Filling Process
- Publication number 20240060205
- Publication date Feb 22, 2024
- Shanghai Huali Integrated Circuit Corporation
- Yu Bao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TRENCH CAPACITOR
- Publication number 20240063251
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tao-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Power Distribution Network and Signal Line Integration
- Publication number 20240063283
- Publication date Feb 22, 2024
- Intemational Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF LINER AND BARRIER FILMS FOR RESISTANCE REDU...
- Publication number 20240047342
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING COMPOSITE SEED-BARRIER LAYER AND METHO...
- Publication number 20240047308
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM DEPOSITION IN FEATURES
- Publication number 20240047269
- Publication date Feb 8, 2024
- LAM RESEARCH CORPORATION
- Jeong-Seok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240021474
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Lid.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION BARRIERS WITH CVD SOAK PROCESSES
- Publication number 20240018647
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20240021526
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CAPPING OF CONTACT LAYER FOR CMOS DEVICES
- Publication number 20240014076
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH
- Publication number 20240014072
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deposition of Metal Barrier in Damascene Processes
- Publication number 20240006234
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE PULSED CVD TUNGSTEN
- Publication number 20240006180
- Publication date Jan 4, 2024
- LAM RESEARCH CORPORATION
- Yu PAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS

by selective deposition of conductive material in the vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Semiconductor device

Fabrication of rigid close-pitch interconnects

Conductive via of integrated circuitry, memory array comprising str...

Integrated circuit

Selective tungsten deposition at low temperatures

Integrated circuit structure and manufacturing method thereof

Etch damage and ESL free dual damascene metal interconnect

Vertically spaced intra-level interconnect line metallization for i...

Methods and apparatus for forming dual metal interconnects

Etch barrier for microelectronic packaging conductive structures

Semiconductor structure having alternating selective metal and diel...

Stacked die modules for semiconductor device assemblies and methods...

Semiconductor device having at least one via including concave port...

Semiconductor package and method

Selective deposition for integrated circuit interconnect structures

Contact window structure and method for forming contact window stru...

Method for forming via structure having low interface resistance

Subtractive metals and subtractive metal semiconductor structures

Selective formation of conductor nanowires

Interconnect including integrally formed capacitor

Flat metal features for microelectronics applications

Fin field-effect transistor device and method of forming the same

Feature fill with nucleation inhibition

Top via with damascene line and via

Techniques to inhibit delamination from flowable gap-fill dielectric

Decoupled interconnect structures

Methods for electrochemical deposition of isolated seed layer areas

Top via process with damascene metal

Composite dielectric structures for semiconductor die assemblies an...

Patents Applicationslast 30 patents

COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN...

MIDDLE OF LINE DIELECTRIC LAYER ENGINEERING FOR VIA VOID PREVENTION

MRAM DEVICE STRUCTURES AND METHODS OF FABRICATING THE SAME

SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS

METHODS OF FORMING ELECTRONIC DEVICES INCLUDING RECESSED CONDUCTIVE...

SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...

INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

TALL POWER LINES WITH ALIGNED SIGNAL WIRES

Conductive Via With Improved Gap Filling Performance

SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING

TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS

Method for Improving Copper Alloy Electroplating Filling Process

TRENCH CAPACITOR

Backside Power Distribution Network and Signal Line Integration

SELECTIVE DEPOSITION OF LINER AND BARRIER FILMS FOR RESISTANCE REDU...

SEMICONDUCTOR PACKAGE HAVING COMPOSITE SEED-BARRIER LAYER AND METHO...

MOLYBDENUM DEPOSITION IN FEATURES

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

OXIDATION BARRIERS WITH CVD SOAK PROCESSES

INTEGRATED CIRCUIT

SELECTIVE CAPPING OF CONTACT LAYER FOR CMOS DEVICES

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH

Selective Deposition of Metal Barrier in Damascene Processes

LOW RESISTANCE PULSED CVD TUNGSTEN

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...