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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/82106
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Patents Grants
last 30 patents
Information
Patent Grant
Method of processing a semiconductor wafer, semiconductor die, and...
Patent number
12,205,919
Issue date
Jan 21, 2025
Infineon Technologies AG
Chuan Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assembly comprising a 3D block and method of making t...
Patent number
12,205,881
Issue date
Jan 21, 2025
Deca Technologies USA, Inc.
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
Patent number
12,159,816
Issue date
Dec 3, 2024
Rohm Co., Ltd.
Kentaro Nasu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabrcating the same
Patent number
12,148,732
Issue date
Nov 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device having air cavity in R...
Patent number
12,148,731
Issue date
Nov 19, 2024
NANYA TECHNOLOGY CORPORATION
Hsih-Yang Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and manufacturing method thereof
Patent number
12,100,665
Issue date
Sep 24, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensing die encapsulated by an encapsulant with a roughness surface...
Patent number
12,087,654
Issue date
Sep 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic circuit device
Patent number
12,074,130
Issue date
Aug 27, 2024
RISING TECHNOLOGIES CO., LTD.
Shuzo Akejima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and corresponding method of manufacture
Patent number
12,068,276
Issue date
Aug 20, 2024
STMicroelectronics S.R.L.
Giovanni Graziosi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, endoscope, and method for manufacturing semic...
Patent number
12,033,975
Issue date
Jul 9, 2024
Olympus Corporation
Keiichi Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing electronic device comprising solar cell struct...
Patent number
11,990,459
Issue date
May 21, 2024
Shin-Etsu Handotai Co., Ltd.
Junya Ishizaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package and manufacturing method thereof
Patent number
11,894,336
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure and method for manufacturing the same
Patent number
11,837,595
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead between a plurality of encapsulated MOSFETs
Patent number
11,830,792
Issue date
Nov 28, 2023
Rohm Co., Ltd.
Kentaro Nasu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical interconnect structure using metal bridges to interconne...
Patent number
11,810,895
Issue date
Nov 7, 2023
Honeywell Federal Manufacturing & Technologies, LLC
Barbara Diane Young
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC interconnect apparatus and method
Patent number
11,798,916
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensing component encapsulated by an encapsulant with a roughness s...
Patent number
11,764,124
Issue date
Sep 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for testing semiconductor elements
Patent number
11,756,841
Issue date
Sep 12, 2023
UPPER ELEC. CO., LTD.
Shih Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process including a re-etching process for forming a semiconductor...
Patent number
11,742,317
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic-component-embedded substrate and method of making the same
Patent number
11,735,560
Issue date
Aug 22, 2023
Shinko Electric Industries Co., Ltd.
Yoichi Nishihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,710,715
Issue date
Jul 25, 2023
Samsung Electronics Co., Ltd.
Joo Hyung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including thick pad
Patent number
11,652,076
Issue date
May 16, 2023
Samsung Electronics Co., Ltd.
Taeho Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,587,902
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method of making the same
Patent number
11,552,014
Issue date
Jan 10, 2023
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, redistribution structure and method for form...
Patent number
11,545,457
Issue date
Jan 3, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chiang-Hao Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wireless transmission module and manufacturing method
Patent number
11,538,774
Issue date
Dec 27, 2022
Huawei Technologies Co., Ltd.
Qijing He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating package structure
Patent number
11,450,641
Issue date
Sep 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,404,333
Issue date
Aug 2, 2022
Advanced Semiconductor Engineering, Inc.
Yuan-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including thick pad
Patent number
11,355,467
Issue date
Jun 7, 2022
Samsung Electronics Co., Ltd.
Taeho Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure, semiconductor package and method of fabric...
Patent number
11,342,296
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
Publication number
20240413120
Publication date
Dec 12, 2024
STMicroelectronics S.r.l
Giovanni GRAZIOSI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240387450
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
Publication number
20240363575
Publication date
Oct 31, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jihwan KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
Publication number
20240355698
Publication date
Oct 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS
Publication number
20240332155
Publication date
Oct 3, 2024
Intel Corporation
Jianyong Mo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD
Publication number
20240321594
Publication date
Sep 26, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...
Publication number
20240282740
Publication date
Aug 22, 2024
MICROCHIP TECHNOLOGY INCORPORATED
Matthew Martin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY
Publication number
20240222317
Publication date
Jul 4, 2024
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
Publication number
20240213135
Publication date
Jun 27, 2024
Deca Technologies USA, Inc.
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF EMBEDDING A BARE DIE IN A CARRIER LAMINATE
Publication number
20240203935
Publication date
Jun 20, 2024
INFINEON TECHNOLOGIES AG
Toni SALMINEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240186283
Publication date
Jun 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240178120
Publication date
May 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Ming Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240055329
Publication date
Feb 15, 2024
ROHM CO., LTD.
Kentaro NASU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
Publication number
20240014142
Publication date
Jan 11, 2024
Mike Morianz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3DIC Interconnect Apparatus and Method
Publication number
20230378139
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...
Publication number
20230369158
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
Publication number
20230352442
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Co., Ltd.
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY
Publication number
20230326904
Publication date
Oct 12, 2023
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
Publication number
20230290750
Publication date
Sep 14, 2023
Sumitomo Electric Industries, Ltd.
Tatsuya HASHINAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230268288
Publication date
Aug 24, 2023
nD-HI Technologies Lab,Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230230967
Publication date
Jul 20, 2023
SAMSUNG DISPLAY CO., LTD.
In Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
Publication number
20230121991
Publication date
Apr 20, 2023
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
Barbara Diane Young
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES WITH EMBEDDED INTERPOSERS
Publication number
20230094820
Publication date
Mar 30, 2023
Rahul N. Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE
Publication number
20230027391
Publication date
Jan 26, 2023
SAMSUNG DISPLAY CO., LTD.
Na Hyeon CHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20220392922
Publication date
Dec 8, 2022
SAMSUNG DISPLAY CO., LTD.
Se Hyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220367768
Publication date
Nov 17, 2022
SAMSUNG DISPLAY CO., LTD.
Sung Geun BAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME
Publication number
20220367409
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
Publication number
20220359478
Publication date
Nov 10, 2022
SAMSUNG DISPLAY CO., LTD.
Xinxing LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
Publication number
20220262757
Publication date
Aug 18, 2022
Samsung Electronics Co., LTD
Taeho KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...
Publication number
20220238474
Publication date
Jul 28, 2022
TDK Corporation
Toshiyuki ABE
H01 - BASIC ELECTRIC ELEMENTS