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H01L2224/82106

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82106by subtractive methods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having air cavity in R...
- Patent number 12,148,731
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 12,100,665
- Issue date Sep 24, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing die encapsulated by an encapsulant with a roughness surface...
- Patent number 12,087,654
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 12,074,130
- Issue date Aug 27, 2024
- RISING TECHNOLOGIES CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, endoscope, and method for manufacturing semic...
- Patent number 12,033,975
- Issue date Jul 9, 2024
- Olympus Corporation
- Keiichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device comprising solar cell struct...
- Patent number 11,990,459
- Issue date May 21, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junya Ishizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,894,336
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for manufacturing the same
- Patent number 11,837,595
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 11,798,916
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing component encapsulated by an encapsulant with a roughness s...
- Patent number 11,764,124
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing semiconductor elements
- Patent number 11,756,841
- Issue date Sep 12, 2023
- UPPER ELEC. CO., LTD.
- Shih Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process including a re-etching process for forming a semiconductor...
- Patent number 11,742,317
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component-embedded substrate and method of making the same
- Patent number 11,735,560
- Issue date Aug 22, 2023
- Shinko Electric Industries Co., Ltd.
- Yoichi Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,710,715
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Joo Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,652,076
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,587,902
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of making the same
- Patent number 11,552,014
- Issue date Jan 10, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, redistribution structure and method for form...
- Patent number 11,545,457
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless transmission module and manufacturing method
- Patent number 11,538,774
- Issue date Dec 27, 2022
- Huawei Technologies Co., Ltd.
- Qijing He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 11,450,641
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,404,333
- Issue date Aug 2, 2022
- Advanced Semiconductor Engineering, Inc.
- Yuan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,355,467
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, semiconductor package and method of fabric...
- Patent number 11,342,296
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing component encapsulated by an encapsulation layer with a rou...
- Patent number 11,289,396
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,114,407
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
- Publication number 20240355698
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS
- Publication number 20240332155
- Publication date Oct 3, 2024
- Intel Corporation
- Jianyong Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240321594
- Publication date Sep 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...
- Publication number 20240282740
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY
- Publication number 20240222317
- Publication date Jul 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
- Publication number 20240213135
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING A BARE DIE IN A CARRIER LAMINATE
- Publication number 20240203935
- Publication date Jun 20, 2024
- INFINEON TECHNOLOGIES AG
- Toni SALMINEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186283
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178120
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
- Publication number 20240014142
- Publication date Jan 11, 2024
- Mike Morianz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20230378139
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...
- Publication number 20230369158
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY
- Publication number 20230326904
- Publication date Oct 12, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
- Publication number 20230290750
- Publication date Sep 14, 2023
- Sumitomo Electric Industries, Ltd.
- Tatsuya HASHINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268288
- Publication date Aug 24, 2023
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230967
- Publication date Jul 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- In Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
- Publication number 20230121991
- Publication date Apr 20, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH EMBEDDED INTERPOSERS
- Publication number 20230094820
- Publication date Mar 30, 2023
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230027391
- Publication date Jan 26, 2023
- SAMSUNG DISPLAY CO., LTD.
- Na Hyeon CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220392922
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Se Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367768
- Publication date Nov 17, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sung Geun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME
- Publication number 20220367409
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220359478
- Publication date Nov 10, 2022
- SAMSUNG DISPLAY CO., LTD.
- Xinxing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
- Publication number 20220262757
- Publication date Aug 18, 2022
- Samsung Electronics Co., LTD
- Taeho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...
- Publication number 20220238474
- Publication date Jul 28, 2022
- TDK Corporation
- Toshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS

by subtractive methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with lead between a plurality of encapsulated...

Package structure and method of fabrcating the same

Method of manufacturing semiconductor device having air cavity in R...

Semiconductor package structure and manufacturing method thereof

Sensing die encapsulated by an encapsulant with a roughness surface...

Electronic circuit device

Semiconductor device and corresponding method of manufacture

Semiconductor device, endoscope, and method for manufacturing semic...

Method for producing electronic device comprising solar cell struct...

Integrated fan-out package and manufacturing method thereof

Semiconductor device structure and method for manufacturing the same

Lead between a plurality of encapsulated MOSFETs

Electrical interconnect structure using metal bridges to interconne...

3DIC interconnect apparatus and method

Sensing component encapsulated by an encapsulant with a roughness s...

Method for testing semiconductor elements

Process including a re-etching process for forming a semiconductor...

Electronic-component-embedded substrate and method of making the same

Semiconductor package

Semiconductor devices including thick pad

Semiconductor structure and method of forming the same

Semiconductor package structure and method of making the same

Semiconductor package, redistribution structure and method for form...

Wireless transmission module and manufacturing method

Method of fabricating package structure

Semiconductor device and method for manufacturing the same

Semiconductor devices including thick pad

Semiconductor structure, semiconductor package and method of fabric...

Sensing component encapsulated by an encapsulation layer with a rou...

Integrated fan-out package and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...

SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS

EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...

METHOD OF EMBEDDING A BARE DIE IN A CARRIER LAMINATE

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Component Carrier With Electronic Components and Thermally Conducti...

3DIC Interconnect Apparatus and Method

SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...

Process Including a Re-etching Process for Forming a Semiconductor...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY

METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...

MICROELECTRONIC PACKAGES WITH EMBEDDED INTERPOSERS

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICES INCLUDING THICK PAD

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...