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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/82106
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Patents Grants
last 30 patents
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Patent Grant
Integrated fan-out package and manufacturing method thereof
Patent number
11,894,336
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure and method for manufacturing the same
Patent number
11,837,595
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead between a plurality of encapsulated MOSFETs
Patent number
11,830,792
Issue date
Nov 28, 2023
Rohm Co., Ltd.
Kentaro Nasu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical interconnect structure using metal bridges to interconne...
Patent number
11,810,895
Issue date
Nov 7, 2023
Honeywell Federal Manufacturing & Technologies, LLC
Barbara Diane Young
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC interconnect apparatus and method
Patent number
11,798,916
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensing component encapsulated by an encapsulant with a roughness s...
Patent number
11,764,124
Issue date
Sep 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for testing semiconductor elements
Patent number
11,756,841
Issue date
Sep 12, 2023
UPPER ELEC. CO., LTD.
Shih Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process including a re-etching process for forming a semiconductor...
Patent number
11,742,317
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic-component-embedded substrate and method of making the same
Patent number
11,735,560
Issue date
Aug 22, 2023
Shinko Electric Industries Co., Ltd.
Yoichi Nishihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,710,715
Issue date
Jul 25, 2023
Samsung Electronics Co., Ltd.
Joo Hyung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including thick pad
Patent number
11,652,076
Issue date
May 16, 2023
Samsung Electronics Co., Ltd.
Taeho Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,587,902
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method of making the same
Patent number
11,552,014
Issue date
Jan 10, 2023
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, redistribution structure and method for form...
Patent number
11,545,457
Issue date
Jan 3, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chiang-Hao Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wireless transmission module and manufacturing method
Patent number
11,538,774
Issue date
Dec 27, 2022
Huawei Technologies Co., Ltd.
Qijing He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating package structure
Patent number
11,450,641
Issue date
Sep 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,404,333
Issue date
Aug 2, 2022
Advanced Semiconductor Engineering, Inc.
Yuan-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including thick pad
Patent number
11,355,467
Issue date
Jun 7, 2022
Samsung Electronics Co., Ltd.
Taeho Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure, semiconductor package and method of fabric...
Patent number
11,342,296
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensing component encapsulated by an encapsulation layer with a rou...
Patent number
11,289,396
Issue date
Mar 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package and manufacturing method thereof
Patent number
11,114,407
Issue date
Sep 7, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module
Patent number
11,071,207
Issue date
Jul 20, 2021
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating semiconductor package
Patent number
11,031,371
Issue date
Jun 8, 2021
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer frame over se...
Patent number
RE48408
Issue date
Jan 26, 2021
JCET Semiconductor (Shaoxing) Co., Ltd.
Reza A. Pagaila
Information
Patent Grant
Housing comprising a semiconductor body and a method for producing...
Patent number
10,903,406
Issue date
Jan 26, 2021
OSRAM OLED GmbH
Martin Unterburger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic system having increased coupling by using horizontal and...
Patent number
10,861,842
Issue date
Dec 8, 2020
STMicroelectronics S.r.l.
Alberto Pagani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure, semiconductor device and method of fabricating t...
Patent number
10,854,569
Issue date
Dec 1, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
10,854,527
Issue date
Dec 1, 2020
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out semiconductor package
Patent number
10,833,041
Issue date
Nov 10, 2020
Samsung Electronics Co., Ltd.
Jun Oh Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip fan out package and methods of forming the same
Patent number
10,833,039
Issue date
Nov 10, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240055329
Publication date
Feb 15, 2024
ROHM CO., LTD.
Kentaro NASU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
Publication number
20240014142
Publication date
Jan 11, 2024
Mike Morianz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3DIC Interconnect Apparatus and Method
Publication number
20230378139
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...
Publication number
20230369158
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
Publication number
20230352442
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Co., Ltd.
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY
Publication number
20230326904
Publication date
Oct 12, 2023
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
Publication number
20230290750
Publication date
Sep 14, 2023
Sumitomo Electric Industries, Ltd.
Tatsuya HASHINAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230268288
Publication date
Aug 24, 2023
nD-HI Technologies Lab,Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230230967
Publication date
Jul 20, 2023
SAMSUNG DISPLAY CO., LTD.
In Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
Publication number
20230121991
Publication date
Apr 20, 2023
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
Barbara Diane Young
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES WITH EMBEDDED INTERPOSERS
Publication number
20230094820
Publication date
Mar 30, 2023
Rahul N. Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE
Publication number
20230027391
Publication date
Jan 26, 2023
SAMSUNG DISPLAY CO., LTD.
Na Hyeon CHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20220392922
Publication date
Dec 8, 2022
SAMSUNG DISPLAY CO., LTD.
Se Hyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220367768
Publication date
Nov 17, 2022
SAMSUNG DISPLAY CO., LTD.
Sung Geun BAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME
Publication number
20220367409
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
Publication number
20220359478
Publication date
Nov 10, 2022
SAMSUNG DISPLAY CO., LTD.
Xinxing LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
Publication number
20220262757
Publication date
Aug 18, 2022
Samsung Electronics Co., LTD
Taeho KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...
Publication number
20220238474
Publication date
Jul 28, 2022
TDK Corporation
Toshiyuki ABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20220223490
Publication date
Jul 14, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
Publication number
20220208749
Publication date
Jun 30, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR TESTING SEMICONDUCTOR ELEMENTS
Publication number
20220189834
Publication date
Jun 16, 2022
Upper ELEC. CO., LTD.
Shih Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING ELECTRONIC DEVICE
Publication number
20220173089
Publication date
Jun 2, 2022
Shin-Etsu Handotai Co., Ltd.
Junya ISHIZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC CIRCUIT DEVICE
Publication number
20220084974
Publication date
Mar 17, 2022
RISING TECHNOLOGIES CO., LTD.
Shuzo AKEJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, REDISTRIBUTION STRUCTURE AND METHOD FOR FORM...
Publication number
20220068869
Publication date
Mar 3, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chiang-Hao Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20210398942
Publication date
Dec 23, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20210398884
Publication date
Dec 23, 2021
Kentaro NASU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20210384153
Publication date
Dec 9, 2021
Samsung Electronics Co., Ltd.
Joo Hyung LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
Publication number
20210305203
Publication date
Sep 30, 2021
STMicroelectronics S.r.l
Giovanni GRAZIOSI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMIC...
Publication number
20210288023
Publication date
Sep 16, 2021
OLYMPUS CORPORATION
Keiichi KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
Publication number
20210217720
Publication date
Jul 15, 2021
Samsung Electronics Co., Ltd.
Taeho KO
H01 - BASIC ELECTRIC ELEMENTS