Capacitive arrangements or effects of, or between wiring layers

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H01L23/5222

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5222Capacitive arrangements or effects of, or between wiring layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 11,961,798
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,948,879
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 11,948,880
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning for integrated circuits
- Patent number 11,942,424
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and methods of manufacturing the same
- Patent number 11,929,393
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor array structure and method for forming the same
- Patent number 11,925,012
- Issue date Mar 5, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chaojun Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of connection structure of semiconductor device
- Patent number 11,916,018
- Issue date Feb 27, 2024
- United Microelectronics Corp.
- Chen-Yi Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having a bit line and a main insulating s...
- Patent number 11,908,797
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Jiyoung Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a capacitor
- Patent number 11,887,925
- Issue date Jan 30, 2024
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,854,958
- Issue date Dec 26, 2023
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including metal insulator metal capacitor and...
- Patent number 11,855,126
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Jhih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,837,545
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Jungwoo Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power receiver including Faraday cage for extracting power from ele...
- Patent number 11,837,970
- Issue date Dec 5, 2023
- EARTH ENERGIES, INC.
- John Dinwiddie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with capacitors having...
- Patent number 11,824,082
- Issue date Nov 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistor, method of manufacturing the same, and radi...
- Patent number 11,810,861
- Issue date Nov 7, 2023
- Sony Group Corporation
- Naoki Saka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated decoupling capacitors
- Patent number 11,810,877
- Issue date Nov 7, 2023
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with redistribution substrate having embedded...
- Patent number 11,810,915
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 11,804,439
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device on ceramic substrate
- Patent number 11,791,226
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 11,791,335
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising planar waveguide transmission lines
- Patent number 11,784,144
- Issue date Oct 10, 2023
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit components with dummy structures
- Patent number 11,784,121
- Issue date Oct 10, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including low-k dielectric layer
- Patent number 11,776,894
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,776,909
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Eunjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,776,895
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device having an air spacer
- Patent number 11,769,770
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing contact areas of contacts for MIM capacitors
- Patent number 11,764,143
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for protecting transistor in a memory circuit
- Patent number 11,742,281
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Takashi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20240113080
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES
- Publication number 20240105574
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- M. Ataul Karim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS
- Publication number 20240105582
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES
- Publication number 20240079318
- Publication date Mar 7, 2024
- Western Digital Technologies, Inc.
- Md. Sayed Mobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240063126
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Chen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH REDUCED CAPACITANCES
- Publication number 20240021468
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED...
- Publication number 20240021608
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTION STRUCTURE
- Publication number 20240014068
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Yanghee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR
- Publication number 20240006303
- Publication date Jan 4, 2024
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND MEDICAL DEVICE INCLUDING SAME
- Publication number 20230420383
- Publication date Dec 28, 2023
- Medtronic, Inc.
- Randolph E. Crutchfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR STRUCTURE
- Publication number 20230411276
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jing Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230387108
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Te LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230387125
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230378048
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for a Low-K Dielectric With Pillar-Type Air-Gaps
- Publication number 20230369228
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...
- Publication number 20230352427
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) SWITCH WITH DRAIN/SOURCE CONTACTS
- Publication number 20230335515
- Publication date Oct 19, 2023
- STMicroelectronics (Crolles 2) SAS
- Siddhartha DHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CUT OPTIMIZATION FOR STANDARD CELLS
- Publication number 20230334208
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheok-Kei LEI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION
- Publication number 20230335438
- Publication date Oct 19, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20230326846
- Publication date Oct 12, 2023
- Rohm Co., Ltd.
- Minoru AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...
- Publication number 20230307355
- Publication date Sep 28, 2023
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIA STRUCTURES FOR FAR-END CROSSTALK CANCELLATION
- Publication number 20230290723
- Publication date Sep 14, 2023
- T-Head (Shanghai) Semiconductor Co., Ltd.
- YANBIN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20230275025
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
- Publication number 20230260833
- Publication date Aug 17, 2023
- Intel Corporation
- Sean KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
- Publication number 20230230915
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230223401
- Publication date Jul 13, 2023
- Fuji Electric Co., Ltd.
- Masaharu Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES HAVING AIR GAP STRUCTURES INTEGRATED WITH I...
- Publication number 20230207446
- Publication date Jun 29, 2023
- Tahoe Research, Ltd.
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED DECOUPLING AND ALIGNMENT FEATURES
- Publication number 20230197625
- Publication date Jun 22, 2023
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED VERTICALLY SPACED INTEGRATED CIRCUIT LINE METALLIZATION W...
- Publication number 20230197602
- Publication date Jun 22, 2023
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230187391
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Capacitive arrangements or effects of, or between wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method for manufacturing semiconductor...

Etch damage and ESL free dual damascene metal interconnect

Semiconductor device structure and methods of forming the same

SOI substrate and related methods

Via patterning for integrated circuits

Integrated circuit devices and methods of manufacturing the same

Capacitor array structure and method for forming the same

Manufacturing method of connection structure of semiconductor device

Integrated circuit device having a bit line and a main insulating s...

Semiconductor device comprising a capacitor

Semiconductor device with discrete blocks

Wafer level stacked structures having integrated passive features

Semiconductor device including metal insulator metal capacitor and...

Semiconductor memory device

Power receiver including Faraday cage for extracting power from ele...

Method for fabricating semiconductor device with capacitors having...

Field-effect transistor, method of manufacturing the same, and radi...

Integrated decoupling capacitors

Semiconductor package with redistribution substrate having embedded...

Reducing RC delay in semiconductor devices

Device on ceramic substrate

Method for forming semiconductor device

Semiconductor devices comprising planar waveguide transmission lines

Integrated circuit components with dummy structures

Semiconductor chip including low-k dielectric layer

Semiconductor memory device

Semiconductor structure and method for manufacturing the same

Methods of forming a semiconductor device having an air spacer

Increasing contact areas of contacts for MIM capacitors

Apparatuses and methods for protecting transistor in a memory circuit

Patents Applicationslast 30 patents

Semiconductor Device with Discrete Blocks

REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES

LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS

NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

DEVICES WITH REDUCED CAPACITANCES

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED...

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTION STRUCTURE

SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR

INTEGRATED CIRCUIT PACKAGE AND MEDICAL DEVICE INCLUDING SAME

METAL INSULATOR METAL CAPACITOR STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Structure and Method for a Low-K Dielectric With Pillar-Type Air-Gaps

SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...

RADIO FREQUENCY (RF) SWITCH WITH DRAIN/SOURCE CONTACTS

METAL CUT OPTIMIZATION FOR STANDARD CELLS

SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...

CONDUCTIVE VIA STRUCTURES FOR FAR-END CROSSTALK CANCELLATION

Method of Forming an Interconnect Structure Having an Air Gap and S...

CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER

SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICES HAVING AIR GAP STRUCTURES INTEGRATED WITH I...

SEMICONDUCTOR DEVICE WITH INTEGRATED DECOUPLING AND ALIGNMENT FEATURES

STAGGERED VERTICALLY SPACED INTEGRATED CIRCUIT LINE METALLIZATION W...

PACKAGE AND METHOD OF FABRICATING THE SAME