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Capacitor integral with wiring layers
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Semiconductor device and manufacturing method thereof
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11,961,944
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Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-En Yen
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IC including capacitor having segmented bottom plate
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11,961,879
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Apr 16, 2024
Texas Instruments Incorporated
Jeffrey West
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Metal-insulator-metal structure
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11,961,880
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Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yuan-Yang Hsiao
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Semiconductor device
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11,961,882
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Apr 16, 2024
Samsung Electronics Co., Ltd.
Shaofeng Ding
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Structure and method for interlevel dielectric layer with regions o...
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11,955,421
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Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Anhao Cheng
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Metal-insulator-metal capacitor
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11,955,509
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Apr 9, 2024
Samsung Electronics Co., Ltd.
Jihyung Kim
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On-chip capacitors in semiconductor devices and methods for forming...
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11,955,422
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Apr 9, 2024
Yangtze Memory Technologies Co., Ltd.
Lei Xue
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Systems and methods for fabrication of superconducting integrated c...
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11,957,065
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1372934 B.C. LTD
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Decoupling capacitors with back side power rails
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11,942,413
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Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kam-Tou Sio
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Integrated circuits (ICs) employing directly coupled metal lines be...
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11,942,414
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Mar 26, 2024
QUALCOMM Incorporated
John Jianhong Zhu
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Semiconductor device and manufacturing method thereof
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11,942,431
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Mar 26, 2024
Kioxia Corporation
Nobuyuki Momo
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Thin film based passive devices and methods of forming the same
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11,942,415
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Mar 26, 2024
GLOBALFOUNDRIES Singapore Pte. Ltd.
Handoko Linewih
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Capacitor between two passivation layers with different etching rates
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11,935,826
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Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Ming Huang
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Package structure having thermal dissipation structure therein and...
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11,935,760
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Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
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Catalysts with modified active phase dispersion and method to prepa...
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11,935,827
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Mar 19, 2024
Saudi Arabian Oil Company
Omer Refa Koseoglu
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Integrated filler capacitor cell device and corresponding manufactu...
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11,935,828
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STMicroelectronics (Rousset) SAS
Abderrezak Marzaki
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Capacitor networks for harmonic control in power devices
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11,929,317
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Mar 12, 2024
MACOM Technology Solutions Holdings, Inc.
Prity Kirit Patel
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Decoupling capacitors based on dummy through-silicon-vias
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11,923,150
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Mar 5, 2024
Intel Corporation
Changyok Park
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Semiconductor device
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11,923,406
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Mar 5, 2024
SK hynix Inc.
Dae Sung Eom
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Manufacturing method of SRAM device
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11,917,804
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Feb 27, 2024
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
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Interconnect including integrally formed capacitor
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11,908,738
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Feb 20, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
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3D IC decoupling capacitor structure and method for manufacturing t...
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11,908,788
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Feb 20, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Wen-Shiang Liao
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Multilayer power, converter with devices having reduced lateral cur...
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11,908,844
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Feb 20, 2024
pSemi Corporation
David Giuliano
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Bonded structures with integrated passive component
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11,901,281
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Feb 13, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
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Device isolators
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11,901,282
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Feb 13, 2024
Texas Instruments Incorporated
Kumar Anurag Shrivastava
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Capacitor and method for forming the same
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11,901,283
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Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wan-Te Chen
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Method for fabricating semiconductor structure having alignment mar...
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11,901,305
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Feb 13, 2024
Taiwan Semiconductor Manufacturing Co. Ltd.
Kuo-Hung Lee
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Integrated voltage regulator and passive components
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11,894,345
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Feb 6, 2024
Adeia Semiconductor Inc.
Javier A. Delacruz
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Metal-insulator-metal capacitor having electrodes with increasing t...
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11,894,297
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Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
I-Che Lee
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Capacitor integrated in FinFET device and method for fabricating th...
Patent number
11,887,983
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Jan 30, 2024
Shanghai Huali Integrated Circuit Corporation
Rui Pan
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SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR
Publication number
20240136276
Publication date
Apr 25, 2024
KEY FOUNDRY CO., LTD.
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SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
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20240138268
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Apr 25, 2024
D-Wave Systems Inc.
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DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS
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20240128023
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Apr 18, 2024
Intel Corporation
Changyok Park
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Devices and Methods for Improving Voltage Handling and/or Bi-Direct...
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20240128968
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Apr 18, 2024
pSemi Corporation
Tero Tapio Ranta
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BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
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20240128186
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Apr 18, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
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HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS
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20240120270
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Apr 11, 2024
TEXAS INSTRUMENTS INCORPORATED
Jeffrey Alan West
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SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
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20240113159
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Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Hui SU
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Structures And Methods Of Forming The Same
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20240113011
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Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Chiung Tu
H01 - BASIC ELECTRIC ELEMENTS
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INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE
Publication number
20240105583
Publication date
Mar 28, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
G06 - COMPUTING CALCULATING COUNTING
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BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WI...
Publication number
20240105584
Publication date
Mar 28, 2024
Intel Corporation
Abhishek Anil Sharma
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SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS
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20240105585
Publication date
Mar 28, 2024
Intel Corporation
Abhishek Anil Sharma
H01 - BASIC ELECTRIC ELEMENTS
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METAL-INSULATOR-METAL CAPACITOR DEVICE WITH INTEGRATED WIRE BONDING...
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20240105763
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Mar 28, 2024
Wolfspeed, Inc.
Jeremy Fisher
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INTEGRATED PASSIVE DEVICE WITH VIA FORMED IN ISOLATION TRENCH
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20240105586
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Mar 28, 2024
Saras Mirco Devices, Inc.
Courtney Timms
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METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING METAL INSULATOR MET...
Publication number
20240096929
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yan-Jhih HUANG
H01 - BASIC ELECTRIC ELEMENTS
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FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
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20240096783
Publication date
Mar 21, 2024
International Business Machines Corporation
Tao Li
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EXTENDED VIA CONNECT FOR PIXEL ARRAY
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20240096784
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Hsien Lin
H01 - BASIC ELECTRIC ELEMENTS
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DECOUPLING CAPACITOR ARCHITECTURE
Publication number
20240088014
Publication date
Mar 14, 2024
QUALCOMM Incorporated
Keyurkumar Karsanbhai KANSAGRA
H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT DEVICES INCLUDING VIA CAPACITORS
Publication number
20240088015
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Jeewoong KIM
H01 - BASIC ELECTRIC ELEMENTS
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FULL WAFER DEVICE WITH BACK SIDE PASSIVE ELECTRONIC COMPONENTS
Publication number
20240088035
Publication date
Mar 14, 2024
Intel Corporation
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
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A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY
Publication number
20240088036
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Mar 14, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE
Publication number
20240088206
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
YI JEN TSAI
H01 - BASIC ELECTRIC ELEMENTS
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Metal-Insulator-Metal Structure
Publication number
20240088016
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yuan-Yang Hsiao
H01 - BASIC ELECTRIC ELEMENTS
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FULL WAFER DEVICE WITH FRONT SIDE PASSIVE ELECTRONIC COMPONENTS
Publication number
20240088017
Publication date
Mar 14, 2024
Intel Corporation
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
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MULTILAYER CAPACITORS WITH INTERDIGITATED FINGERS
Publication number
20240079314
Publication date
Mar 7, 2024
Skyworks Solutions, Inc.
Hailing Wang
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MEMORIES INCLUDING EDGE MATS HAVING FOLDED DIGIT LINES
Publication number
20240071426
Publication date
Feb 29, 2024
Micron Technology, Inc.
Hirokazu Ato
G11 - INFORMATION STORAGE
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CAPACITOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
Publication number
20240071901
Publication date
Feb 29, 2024
Powerchip Semiconductor Manufacturing Corporation
Wei-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD...
Publication number
20240063111
Publication date
Feb 22, 2024
KEY FOUNDRY CO., LTD.
Jong Yeul JEONG
H01 - BASIC ELECTRIC ELEMENTS
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METAL-INSULATOR-METAL CAPACITORS AND METHODS OF FORMING THE SAME
Publication number
20240063253
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company Limited
Po-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
Publication number
20240063202
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE HAVING HIGH-VOLTAGE ISOLATION CAPACITOR
Publication number
20240063112
Publication date
Feb 22, 2024
KEY FOUNDRY CO., LTD.
Jong Yeul JEONG
H01 - BASIC ELECTRIC ELEMENTS