Capacitor integral with wiring layers

Industry

CPC
H01L23/5223

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5223Capacitor integral with wiring layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal-insulator-metal capacitors
- Patent number 11,569,343
- Issue date Jan 31, 2023
- SK HYNIX SYSTEM IC INC.
- Kyung Wook Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,569,419
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame-array interconnects for integrated-circuit packages
- Patent number 11,562,954
- Issue date Jan 24, 2023
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits containing vertically-integrated capacitor-aval...
- Patent number 11,558,018
- Issue date Jan 17, 2023
- NXP USA, INC.
- Joseph Gerard Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and metal-oxide-semiconductor capacitor structure
- Patent number 11,557,535
- Issue date Jan 17, 2023
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a field effect transistor
- Patent number 11,557,585
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Jung-Ho Do
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Passive component embedded in an embedded trace substrate (ETS)
- Patent number 11,552,023
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor and thin-film resistor (TFR)...
- Patent number 11,552,011
- Issue date Jan 10, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency capacitor with inductance cancellation
- Patent number 11,552,030
- Issue date Jan 10, 2023
- Intel Corporation
- Daniel Sira
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-insulator-metal (MIM) capacitor
- Patent number 11,545,428
- Issue date Jan 3, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor bank structure and semiconductor package structure
- Patent number 11,545,427
- Issue date Jan 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional metal-insulator-metal (MIM) capacitor
- Patent number 11,545,544
- Issue date Jan 3, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-component placement in multiple-damascene printed wiring bo...
- Patent number 11,540,395
- Issue date Dec 27, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor including multilayer dielectric stack
- Patent number 11,538,901
- Issue date Dec 27, 2022
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with capacitor element
- Patent number 11,538,748
- Issue date Dec 27, 2022
- MediaTek Singapore Pte Ltd.
- Zhigang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor capacitor filter in far back end of line and integration s...
- Patent number 11,538,751
- Issue date Dec 27, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lulu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,755
- Issue date Dec 27, 2022
- SK hynix Inc.
- Nam-Hea Jang
- G11 - INFORMATION STORAGE
Information Patent Grant
Interposer structure, semiconductor package comprising the same, an...
- Patent number 11,538,747
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving integrated circuit for display
- Patent number 11,538,382
- Issue date Dec 27, 2022
- Silicon Works Co., Ltd.
- Hee Joo Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device
- Patent number 11,532,545
- Issue date Dec 20, 2022
- Kabushiki Kaisha Toshiba
- Munenori Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction structure for metal-insulator-metal capacitors
- Patent number 11,532,695
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jin-Mu Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer in top electrode to increase break down vol...
- Patent number 11,532,698
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,532,697
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Jen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fringe capacitor arranged based on metal layers with a selected ori...
- Patent number 11,532,546
- Issue date Dec 20, 2022
- NXP B.V.
- Viet Thanh Dinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including capacitor
- Patent number 11,527,473
- Issue date Dec 13, 2022
- Samsung Electronics Co., Ltd.
- Kyung Hwa Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating metal-oxide-metal capacitor
- Patent number 11,527,605
- Issue date Dec 13, 2022
- United Microelectronics Corp.
- Shu-Ji Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive structure
- Patent number 11,525,851
- Issue date Dec 13, 2022
- STMicroelectronics (Grenoble 2) SAS
- Sebastien Cliquennois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive isolation structure insert for reversed signals
- Patent number 11,526,649
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheok-Kei Lei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Spacer for die-to-die communication in an integrated circuit and me...
- Patent number 11,521,952
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant LC tank package and method of manufacture
- Patent number 11,521,793
- Issue date Dec 6, 2022
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230035580
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND INTEGRATED CHIP
- Publication number 20230030826
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including Backside Capacitors and Methods of...
- Publication number 20230013764
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SRAM DEVICE
- Publication number 20230014829
- Publication date Jan 19, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- G11 - INFORMATION STORAGE
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR AND METHOD OF MAKING SAME
- Publication number 20230011605
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITORS WITH BACK SIDE POWER RAILS
- Publication number 20230010409
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL BODY
- Publication number 20230005663
- Publication date Jan 5, 2023
- Murata Manufacturing Co., Ltd.
- Yasuhiro SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS OF CONTROLLING HYDROGEN SUPPLY IN MEMORY DE...
- Publication number 20230005837
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20220415784
- Publication date Dec 29, 2022
- Changxin Memory Technologies, Inc.
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT CAPACITOR STRUCTURE
- Publication number 20220416094
- Publication date Dec 29, 2022
- REALTEK SEMICONDUCTOR CORPORATION
- Jian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HORIZONTALLY ARRANGED CAPACITOR AND METHO...
- Publication number 20220406706
- Publication date Dec 22, 2022
- NANYA TECHNOLOGY CORPORATION
- YU-HAN HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FLOATING METAL FOR INCREASED CAPACITANCE
- Publication number 20220406717
- Publication date Dec 22, 2022
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR ALIGNED VIAS
- Publication number 20220406654
- Publication date Dec 22, 2022
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...
- Publication number 20220406707
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BASED PASSIVE DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20220392837
- Publication date Dec 8, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Handoko LINEWIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING MULTIPLE SUBSTRATE SEGMENTS
- Publication number 20220392836
- Publication date Dec 8, 2022
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS
- Publication number 20220392835
- Publication date Dec 8, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, PACKAGE STRUCTURE, AND MANUFACTURING METHO...
- Publication number 20220384332
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220384308
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Yen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR
- Publication number 20220384563
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- JIHYUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE CAPACITANCE IN THREE-DIMENSIONAL STACKED DIE ARCHITECTURE
- Publication number 20220375898
- Publication date Nov 24, 2022
- Intel Corporation
- Vishram Shriram Pandit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN AN INTER-LAYER MEDIUM ON AN INTERCONNECT...
- Publication number 20220375851
- Publication date Nov 24, 2022
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION SCHEME TO BUILD RESISTOR, CAPACITOR, EFUSE USING SILICO...
- Publication number 20220375856
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE GRADUATED CAPACITOR STRUCTURE AND METHODS FOR FORMING THE...
- Publication number 20220367340
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367371
- Publication date Nov 17, 2022
- KIOXIA Corporation
- Nobuyuki MOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A STRESS REDUCTION STRUCTURE FOR METAL-INSULATOR-...
- Publication number 20220367605
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Mu YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR METAL INSULATOR METAL CAPACITORS
- Publication number 20220367606
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20220367365
- Publication date Nov 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER IN TOP ELECTRODE TO INCREASE BREAK DOWN VOL...
- Publication number 20220367607
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Forming Integrated High Density Mim Capacitor
- Publication number 20220359642
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Capacitor integral with wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-insulator-metal capacitors

Semiconductor device and manufacturing method thereof

Frame-array interconnects for integrated-circuit packages

Integrated circuits containing vertically-integrated capacitor-aval...

Semiconductor device and metal-oxide-semiconductor capacitor structure

Semiconductor device including a field effect transistor

Passive component embedded in an embedded trace substrate (ETS)

Metal-insulator-metal (MIM) capacitor and thin-film resistor (TFR)...

High frequency capacitor with inductance cancellation

Metal-insulator-metal (MIM) capacitor

Capacitor bank structure and semiconductor package structure

Three-dimensional metal-insulator-metal (MIM) capacitor

Stacked-component placement in multiple-damascene printed wiring bo...

Capacitor including multilayer dielectric stack

Semiconductor device with capacitor element

Inductor capacitor filter in far back end of line and integration s...

Semiconductor device

Interposer structure, semiconductor package comprising the same, an...

Driving integrated circuit for display

Semiconductor device

Stress reduction structure for metal-insulator-metal capacitors

Diffusion barrier layer in top electrode to increase break down vol...

Semiconductor structure and method for forming the same

Fringe capacitor arranged based on metal layers with a selected ori...

Semiconductor memory device including capacitor

Method for fabricating metal-oxide-metal capacitor

Capacitive structure

Capacitive isolation structure insert for reversed signals

Spacer for die-to-die communication in an integrated circuit and me...

Resonant LC tank package and method of manufacture

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

METAL-INSULATOR-METAL CAPACITOR AND INTEGRATED CHIP

Semiconductor Devices Including Backside Capacitors and Methods of...

MANUFACTURING METHOD OF SRAM DEVICE

METAL-INSULATOR-METAL (MIM) CAPACITOR AND METHOD OF MAKING SAME

DECOUPLING CAPACITORS WITH BACK SIDE POWER RAILS

STRUCTURAL BODY

APPARATUSES AND METHODS OF CONTROLLING HYDROGEN SUPPLY IN MEMORY DE...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME

COMPACT CAPACITOR STRUCTURE

SEMICONDUCTOR DEVICE WITH HORIZONTALLY ARRANGED CAPACITOR AND METHO...

BACKSIDE FLOATING METAL FOR INCREASED CAPACITANCE

TECHNOLOGIES FOR ALIGNED VIAS

CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...

THIN FILM BASED PASSIVE DEVICES AND METHODS OF FORMING THE SAME

ELECTRONIC ASSEMBLY HAVING MULTIPLE SUBSTRATE SEGMENTS

INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS

SEMICONDUCTOR STRUCTURE, PACKAGE STRUCTURE, AND MANUFACTURING METHO...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METAL-INSULATOR-METAL CAPACITOR

PROGRAMMABLE CAPACITANCE IN THREE-DIMENSIONAL STACKED DIE ARCHITECTURE

DEEP TRENCH CAPACITORS IN AN INTER-LAYER MEDIUM ON AN INTERCONNECT...

INTEGRATION SCHEME TO BUILD RESISTOR, CAPACITOR, EFUSE USING SILICO...

VARIABLE GRADUATED CAPACITOR STRUCTURE AND METHODS FOR FORMING THE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING A STRESS REDUCTION STRUCTURE FOR METAL-INSULATOR-...

BARRIER LAYER FOR METAL INSULATOR METAL CAPACITORS

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

DIFFUSION BARRIER LAYER IN TOP ELECTRODE TO INCREASE BREAK DOWN VOL...

Structure and Method for Forming Integrated High Density Mim Capacitor