Capillary

Industry

CPC
H01L2224/78301

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78301Capillary

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic horn and manufacturing apparatus of semiconductor device
- Patent number 12,046,574
- Issue date Jul 23, 2024
- Shinkawa Ltd.
- Yuhei Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary guide device and wire bonding apparatus
- Patent number 11,717,912
- Issue date Aug 8, 2023
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method for semiconductor package
- Patent number 11,594,503
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Hosoo Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic transducer systems including tuned resonators, equipment...
- Patent number 11,462,506
- Issue date Oct 4, 2022
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 11,417,625
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding device
- Patent number 11,404,393
- Issue date Aug 2, 2022
- Kaijo Corporation
- Eiji Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number RE49045
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames electrically connected to inductor chip
- Patent number 11,177,198
- Issue date Nov 16, 2021
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of bonding wire vertical interconnects
- Patent number 11,145,620
- Issue date Oct 12, 2021
- ASM Technology Singapore Pte. Ltd.
- Mow Huat Goh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary transport device, capillary mounting device, capillary re...
- Patent number 11,127,709
- Issue date Sep 21, 2021
- Kaijo Corporation
- Go Takemoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,024,569
- Issue date Jun 1, 2021
- ADVANCED SEMICONDUCOR ENGINEERING, INC.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic transducer systems including tuned resonators, equipment...
- Patent number 11,011,492
- Issue date May 18, 2021
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire clamp apparatus calibration method and wire bonding apparatus
- Patent number 11,004,822
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 11,004,821
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,903,129
- Issue date Jan 26, 2021
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact wirebonding in stacked-chip system in package, and methods...
- Patent number 10,847,450
- Issue date Nov 24, 2020
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,825,758
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,818,581
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 10,804,238
- Issue date Oct 13, 2020
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with supported stacked die
- Patent number 10,796,975
- Issue date Oct 6, 2020
- Intel Corporation
- Guo Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
BALL BONDING FOR SEMICONDUCTOR DEVICES
- Publication number 20240290746
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20230343742
- Publication date Oct 26, 2023
- SHINKAWA LTD.
- Yuhei ITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298981
- Publication date Sep 21, 2023
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20230282613
- Publication date Sep 7, 2023
- SHINKAWA LTD.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...
- Publication number 20220320040
- Publication date Oct 6, 2022
- Yamaha Robotics Holdings Co., Ltd.
- Hiroshi MUNAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220199567
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- JUNGSEOK RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
- Publication number 20210366869
- Publication date Nov 25, 2021
- KAIJO CORPORATION
- Eiji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20210358873
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hosoo HAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...
- Publication number 20200411465
- Publication date Dec 31, 2020
- MURATA MANUFACTURING CO., LTD.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS
- Publication number 20200286855
- Publication date Sep 10, 2020
- ASM Technology Singapore Pte Ltd
- Mow Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...
- Publication number 20200091107
- Publication date Mar 19, 2020
- KAIJO CORPORATION
- Go TAKEMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190378787
- Publication date Dec 12, 2019
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BOND ATTACHMENT FOR A SEMICONDUCTOR DIE
- Publication number 20190378814
- Publication date Dec 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING APPARATUS
- Publication number 20190287941
- Publication date Sep 19, 2019
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CALIBRATING WIRE CLAMP DEVICE, AND WIRE BONDING APPARATUS
- Publication number 20190237428
- Publication date Aug 1, 2019
- SHINKAWA LTD.
- Noboru FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT WIREBONDING IN STACKED-CHIP SYSTEM IN PACKAGE, AND METHODS...
- Publication number 20190181072
- Publication date Jun 13, 2019
- Saeed SHOJAIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180366397
- Publication date Dec 20, 2018
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...
- Publication number 20180331064
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Hyosung KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BALL BONDER
- Publication number 20180294243
- Publication date Oct 11, 2018
- SII Semiconductor Corporation
- Tomomitsu RISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261568
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261567
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20180151532
- Publication date May 31, 2018
- KAIJO CORPORATION
- Riki JINDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180108629
- Publication date Apr 19, 2018
- RENESAS ELECTRONICS CORPORATION
- Kentaro YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180096908
- Publication date Apr 5, 2018
- ROHM CO., LTD.
- Kensuke MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BALL IN BONDING WIRE
- Publication number 20180096965
- Publication date Apr 5, 2018
- NIPPON MICROMETAL CORPORATION
- Noritoshi ARAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20180068972
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20180061803
- Publication date Mar 1, 2018
- KAIJO CORPORATION
- Akio Sugito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ultrasonic horn and manufacturing apparatus of semiconductor device

Method for bonding insulated coating wire, connection structure, me...

Package-on-package assembly with wire bond vias

Capillary guide device and wire bonding apparatus

Semiconductor device

Wire bonding method for semiconductor package

Ultrasonic transducer systems including tuned resonators, equipment...

Semiconductor device having an electrical connection between semico...

Wire bonding method and wire bonding device

Package on package devices and methods of packaging semiconductor dies

Method of vertically vibrating a bonding arm

Method for calibrating wire clamp device

Package-on-package assembly with wire bond vias

Plurality of lead frames electrically connected to inductor chip

Formation of bonding wire vertical interconnects

Capillary transport device, capillary mounting device, capillary re...

Semiconductor package device and method of manufacturing the same

Ultrasonic transducer systems including tuned resonators, equipment...

Wire clamp apparatus calibration method and wire bonding apparatus

Wire bonding method and wire bonding apparatus

Electronic device

Compact wirebonding in stacked-chip system in package, and methods...

Bonding wire for semiconductor device

Semiconductor device

Semiconductor integrated circuit device

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device having an electrical connection between semico...

Semiconductor package with supported stacked die

Package-on-package assembly with wire bond vias

Curtain airbag device mounting structure and curtain airbag deploym...

Patents Applicationslast 30 patents

BALL BONDING FOR SEMICONDUCTOR DEVICES

ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...

SEMICONDUCTOR PACKAGE

WIRE BONDING METHOD AND WIRE BONDING DEVICE

WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...

FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS

CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...

SEMICONDUCTOR DEVICE

BALL BOND ATTACHMENT FOR A SEMICONDUCTOR DIE

WIRE BONDING METHOD AND WIRE BONDING APPARATUS

METHOD FOR CALIBRATING WIRE CLAMP DEVICE, AND WIRE BONDING APPARATUS

COMPACT WIREBONDING IN STACKED-CHIP SYSTEM IN PACKAGE, AND METHODS...

SEMICONDUCTOR DEVICE

ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...

SEMICONDUCTOR DEVICE AND BALL BONDER

Window Clamp

Window Clamp

WIRE BONDING APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METHOD FOR FORMING BALL IN BONDING WIRE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

BONDING DEVICE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR DEVICE