Cavity coating

Industry

CPC
H01L2924/1617

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1617Cavity coating

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Chip on film package and heat-dissipation structure for a chip package
- Patent number 10,770,368
- Issue date Sep 8, 2020
- Novatek Microelectronics Corp.
- Wen-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader having electromagnetically-formed features
- Patent number 10,763,188
- Issue date Sep 1, 2020
- Intel Corporation
- Aravindha R. Antoniswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 10,510,668
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,090,257
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 10,056,308
- Issue date Aug 21, 2018
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,032,727
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,887,166
- Issue date Feb 6, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,640,518
- Issue date May 2, 2017
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 9,601,475
- Issue date Mar 21, 2017
- INTEL DEUTSCHLAND GMBH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric power semiconductor device
- Patent number 9,433,075
- Issue date Aug 30, 2016
- Mitsubishi Electric Corporation
- Junji Fujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power line filter for multidimensional integrated circuits
- Patent number 9,391,010
- Issue date Jul 12, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jr Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package
- Patent number 9,362,235
- Issue date Jun 7, 2016
- Samsung Electronics Co., Ltd.
- Yong-hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,355,997
- Issue date May 31, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,318,411
- Issue date Apr 19, 2016
- BRODGE SEMICONDUCTOR CORPORATION
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 9,293,423
- Issue date Mar 22, 2016
- INTEL DEUTSCHLAND GMBH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for three-dimensional die stacks
- Patent number 9,252,101
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless module
- Patent number 9,245,859
- Issue date Jan 26, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Suguru Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 9,245,854
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency semiconductor package and high-frequency semiconduct...
- Patent number 9,177,881
- Issue date Nov 3, 2015
- Kabushiki Kaisha Toshiba
- Yoshiyuki Ikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus, method of making the same, and transceiving d...
- Patent number 8,952,846
- Issue date Feb 10, 2015
- Fujitsu Limited
- Akihiko Akasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 8,952,503
- Issue date Feb 10, 2015
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 8,940,584
- Issue date Jan 27, 2015
- Samsung Electronics Co., Ltd.
- Tongsuk Kim
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
8917205
- Patent number 8,917,205
- Issue date Dec 23, 2014
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple chips and substrate in metal cap
- Patent number 8,916,958
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Chong Yee Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece with semiconductor chips, semiconductor device and method...
- Patent number 8,779,563
- Issue date Jul 15, 2014
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 8,748,228
- Issue date Jun 10, 2014
- Samsung Electronics Co., Ltd.
- Tongsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,664,751
- Issue date Mar 4, 2014
- Samsung Electronics Co., Ltd.
- Yong-hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package module
- Patent number 8,558,377
- Issue date Oct 15, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin O Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic thermal joint for high power density chips
- Patent number 8,368,205
- Issue date Feb 5, 2013
- Oracle America, Inc.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for electrostatic discharge in embedded wafer level packages
- Patent number 8,309,454
- Issue date Nov 13, 2012
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE EXPOSED DIE PACKAGE STRUCTURE WITH ADHESIVE
- Publication number 20240014099
- Publication date Jan 11, 2024
- Marvell Asia Pte Ltd.
- Choong Kooi Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170170085
- Publication date Jun 15, 2017
- Intel Corporation
- Paul J. Gwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...
- Publication number 20140332937
- Publication date Nov 13, 2014
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE AND HIGH-FREQUENCY SEMICONDUCT...
- Publication number 20140252569
- Publication date Sep 11, 2014
- KABUSHIKI KAISHA TOSHIBA
- Yoshiyuki Ikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20140239477
- Publication date Aug 28, 2014
- Samsung Electronics Co., Ltd.
- Tongsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
- Publication number 20140210059
- Publication date Jul 31, 2014
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140151859
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Yong-hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE
- Publication number 20140145316
- Publication date May 29, 2014
- Suguru Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LINE FILTER FOR MULTIDIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20130257564
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Bo-Jr HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece with Semiconductor Chips, Semiconductor Device and Method...
- Publication number 20130228904
- Publication date Sep 5, 2013
- Intel Mobile Communications GmbH
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE
- Publication number 20130187286
- Publication date Jul 25, 2013
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING PAD PRODUCING METHOD
- Publication number 20130130493
- Publication date May 23, 2013
- Naoto Kuratani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20130052775
- Publication date Feb 28, 2013
- Samsung Electronics Co., Ltd.
- Tongsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20120104572
- Publication date May 3, 2012
- Samsung Electro-Mechanics CO., LTD.
- Jin O. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS, METHOD OF MAKING THE SAME, AND TRANSCEIVING D...
- Publication number 20120092218
- Publication date Apr 19, 2012
- Fujitsu Limited
- Akihiko Akasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110304015
- Publication date Dec 15, 2011
- Samsung Electronics Co., Ltd.
- Yong-hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FORMING SUCH PA...
- Publication number 20110223692
- Publication date Sep 15, 2011
- Raytheon Company
- Michael G. Adlerstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING PAD PRODUCING METHOD
- Publication number 20110217837
- Publication date Sep 8, 2011
- Omron Corporation
- Naoto Kuratani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Producing Covers for Electronics
- Publication number 20110018160
- Publication date Jan 27, 2011
- Frank J. ZIBERNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE CHIPS AND SUBSTRATE IN METAL CAP
- Publication number 20100270667
- Publication date Oct 28, 2010
- INFINEON TECHNOLOGIES AG
- Chong Yee Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, A...
- Publication number 20090301749
- Publication date Dec 10, 2009
- Neomax Materials Co., Ltd.
- Tsuyoshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded die system and method
- Publication number 20090200648
- Publication date Aug 13, 2009
- Apple Inc.
- Irvin W. Graves, JR.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND SUBSTRATE MOUNTING METHOD
- Publication number 20090168386
- Publication date Jul 2, 2009
- Kabushiki Kaisha Toshiba
- Daigo Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE AND METHOD
- Publication number 20090127638
- Publication date May 21, 2009
- INFINEON TECHNOLOGIES AG
- Thomas Kilger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microwave communication package
- Publication number 20090085808
- Publication date Apr 2, 2009
- Matthew R. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method for Producing Wick Structures of a Vapor Chamb...
- Publication number 20090017218
- Publication date Jan 15, 2009
- Ming-Chen Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROWAVE INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FORMING SUCH PA...
- Publication number 20080311682
- Publication date Dec 18, 2008
- Michael G. Adlerstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for Electrostatic Discharge in Embedded Wafer Level Packages
- Publication number 20080265421
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modular board device, high frequency module, and method of manufact...
- Publication number 20080178463
- Publication date Jul 31, 2008
- Sony Corporation
- Akihiko Okubora
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Cavity coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip on film package and heat-dissipation structure for a chip package

Integrated heat spreader having electromagnetically-formed features

Method of fabricating semiconductor device

Electrical package including bimetal lid

Molded composite enclosure for integrated circuit assembly

Electrical package including bimetal lid

Integrated circuit assemblies with reinforcement frames, and method...

Semiconductor package with package-on-package stacking capability a...

Workpiece with semiconductor chips, semiconductor device and method...

Electric power semiconductor device

Power line filter for multidimensional integrated circuits

Semiconductor package

Integrated circuit assemblies with reinforcement frames, and method...

Semiconductor package with package-on-package stacking capability a...

Workpiece with semiconductor chips, semiconductor device and method...

Packages for three-dimensional die stacks

Wireless module

Organic module EMI shielding structures and methods

High-frequency semiconductor package and high-frequency semiconduct...

Electronic apparatus, method of making the same, and transceiving d...

Organic module EMI shielding structures and methods

Semiconductor packages and methods of forming the same

8917205

Semiconductor package with multiple chips and substrate in metal cap

Workpiece with semiconductor chips, semiconductor device and method...

Semiconductor packages and methods of forming the same

Semiconductor package

Semiconductor package module

Metallic thermal joint for high power density chips

Structure for electrostatic discharge in embedded wafer level packages

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE EXPOSED DIE PACKAGE STRUCTURE WITH ADHESIVE

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD...

HIGH-FREQUENCY SEMICONDUCTOR PACKAGE AND HIGH-FREQUENCY SEMICONDUCT...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS

SEMICONDUCTOR PACKAGE

WIRELESS MODULE

POWER LINE FILTER FOR MULTIDIMENSIONAL INTEGRATED CIRCUITS

Workpiece with Semiconductor Chips, Semiconductor Device and Method...

LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE

CONNECTING PAD PRODUCING METHOD

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS

SEMICONDUCTOR PACKAGE MODULE

ELECTRONIC APPARATUS, METHOD OF MAKING THE SAME, AND TRANSCEIVING D...

SEMICONDUCTOR PACKAGE

MICROWAVE INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FORMING SUCH PA...

CONNECTING PAD PRODUCING METHOD

Method of Producing Covers for Electronics

SEMICONDUCTOR PACKAGE WITH MULTIPLE CHIPS AND SUBSTRATE IN METAL CAP

HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, A...

Embedded die system and method

ELECTRONIC APPARATUS AND SUBSTRATE MOUNTING METHOD

ELECTRICAL DEVICE AND METHOD

Microwave communication package

Manufacturing Method for Producing Wick Structures of a Vapor Chamb...

MICROWAVE INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FORMING SUCH PA...

Structure for Electrostatic Discharge in Embedded Wafer Level Packages

Modular board device, high frequency module, and method of manufact...