Ceramics

Industry

CPC
H01L2224/13687

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13687Ceramics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,790,252
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 10,658,279
- Issue date May 19, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,269,747
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 10,204,851
- Issue date Feb 12, 2019
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, solder joint, and method of manufacturing the sold...
- Patent number 10,173,287
- Issue date Jan 8, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 9,922,916
- Issue date Mar 20, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,820,391
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device having plural microstructures disposed proximate t...
- Patent number 9,607,959
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 9,368,437
- Issue date Jun 14, 2016
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermetallic compound layer on a pillar between a chip and substrate
- Patent number 9,293,433
- Issue date Mar 22, 2016
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a conductive pillar bump with non-metal sidewall p...
- Patent number 9,287,171
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnect with non-wettable sidewall pillars and methods...
- Patent number 9,018,760
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process and structure thereof
- Patent number 8,841,767
- Issue date Sep 23, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper pillar bump with non-metal sidewall protection structure and...
- Patent number 8,823,167
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled collapse chip connection (C4) structure and methods of f...
- Patent number 8,765,593
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV pillar as an interconnecting structure
- Patent number 8,691,691
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnect with non-wettable sidewall pillars and methods...
- Patent number 8,637,392
- Issue date Jan 28, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride passivation layer for covering high aspect ratio fe...
- Patent number 8,563,095
- Issue date Oct 22, 2013
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bumping process and structure thereof
- Patent number 8,450,203
- Issue date May 28, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu pillar bump with non-metal sidewall protection structure
- Patent number 8,441,124
- Issue date May 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,435,836
- Issue date May 7, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,410,615
- Issue date Apr 2, 2013
- Hitachi, Ltd.
- Mayu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of through-silicon vias on silicon wafers
- Patent number 8,329,575
- Issue date Dec 11, 2012
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of through-silicon vias on silicon wafers
- Patent number 8,283,237
- Issue date Oct 9, 2012
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20240006360
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...
- Publication number 20220115348
- Publication date Apr 14, 2022
- Raytheon Company
- Sean F. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20180337155
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20180182696
- Publication date Jun 28, 2018
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Material, Solder Joint, and Method of Manufacturing the Sold...
- Publication number 20170252871
- Publication date Sep 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20160284635
- Publication date Sep 29, 2016
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices, Packaged Semiconductor Devices, and Packaging Me...
- Publication number 20160064348
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL P...
- Publication number 20140335687
- Publication date Nov 13, 2014
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20140217579
- Publication date Aug 7, 2014
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR
- Publication number 20140124877
- Publication date May 8, 2014
- QUALCOMM Incorporated
- Yangyang Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20140117533
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...
- Publication number 20140077367
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20140075747
- Publication date Mar 20, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...
- Publication number 20140042630
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
- Publication number 20130213702
- Publication date Aug 22, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
- Publication number 20130022830
- Publication date Jan 24, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE AND...
- Publication number 20120280388
- Publication date Nov 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
- Publication number 20120164827
- Publication date Jun 28, 2012
- Applied Materials, Inc.
- Nagarajan RAJAGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
- Publication number 20120164829
- Publication date Jun 28, 2012
- Applied Materials, Inc.
- Nagarajan RAJAGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120068355
- Publication date Mar 22, 2012
- Hitachi, Ltd.
- Mayu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer...
- Publication number 20120052677
- Publication date Mar 1, 2012
- GLOBALFOUNDRIES INC.
- Soeren Zenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110266667
- Publication date Nov 3, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE PASSIVATION LAYER FOR COVERING HIGH ASPECT RATIO FE...
- Publication number 20110223765
- Publication date Sep 15, 2011
- Applied Materials, Inc.
- Nagarajan RAJAGOPALAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Solder Interconnect with Non-Wettable Sidewall Pillars and Methods...
- Publication number 20110193218
- Publication date Aug 11, 2011
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20110111561
- Publication date May 12, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING ELECTRODE FOR...
- Publication number 20100081269
- Publication date Apr 1, 2010
- Fujitsu Microelectronics Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20100059897
- Publication date Mar 11, 2010
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices, methods of manufacture thereof, and packaged...

High density package interconnects

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Semiconductor devices, methods of manufacture thereof, and packaged...

High density package interconnects

Solder material, solder joint, and method of manufacturing the sold...

Method of producing a hybridized device including microelectronic c...

Bonding structure for semiconductor package and method of manufactu...

High density package interconnects

Wiring board

Packaging device having plural microstructures disposed proximate t...

High density package interconnects

Intermetallic compound layer on a pillar between a chip and substrate

Method of making a conductive pillar bump with non-metal sidewall p...

Interconnect structures for stacked dies, including penetrating str...

Solder interconnect with non-wettable sidewall pillars and methods...

Bumping process and structure thereof

Copper pillar bump with non-metal sidewall protection structure and...

Controlled collapse chip connection (C4) structure and methods of f...

TSV pillar as an interconnecting structure

Interconnect structures for stacked dies, including penetrating str...

Solder interconnect with non-wettable sidewall pillars and methods...

Silicon nitride passivation layer for covering high aspect ratio fe...

Bumping process and structure thereof

Cu pillar bump with non-metal sidewall protection structure

Interconnect structures for stacked dies, including penetrating str...

Semiconductor device and method for manufacturing the same

Fabrication of through-silicon vias on silicon wafers

Fabrication of through-silicon vias on silicon wafers

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...

HIGH DENSITY PACKAGE INTERCONNECTS

Solder Material, Solder Joint, and Method of Manufacturing the Sold...

HIGH DENSITY PACKAGE INTERCONNECTS

Packaging Devices, Packaged Semiconductor Devices, and Packaging Me...

METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL P...

HIGH DENSITY PACKAGE INTERCONNECTS

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...

SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

BUMPING PROCESS AND STRUCTURE THEREOF

TSV PILLAR AS AN INTERCONNECTING STRUCTURE

BUMPING PROCESS AND STRUCTURE THEREOF

COPPER PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE AND...

FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS

FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer...

CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE

SILICON NITRIDE PASSIVATION LAYER FOR COVERING HIGH ASPECT RATIO FE...

Solder Interconnect with Non-Wettable Sidewall Pillars and Methods...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING ELECTRODE FOR...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...