characterised by bent parts

Industry

CPC
H01L23/49551

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49551characterised by bent parts

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge bend for isolation packages
- Patent number 12,293,953
- Issue date May 6, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a plurality of offsets in leads suppor...
- Patent number 12,087,676
- Issue date Sep 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Min Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,074,097
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Akihisa Fukumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip packaged semiconductor device
- Patent number 12,057,377
- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus mounted electrically connected to a plurali...
- Patent number 12,040,258
- Issue date Jul 16, 2024
- Shindengen Electric Manufacturing Co., Ltd.
- Naoto Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die-package and method
- Patent number 12,014,973
- Issue date Jun 18, 2024
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 11,915,998
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,881,444
- Issue date Jan 23, 2024
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold flow balancing for a matrix leadframe
- Patent number 11,862,540
- Issue date Jan 2, 2024
- STMicroelectronics Sdn Bhd
- Yh Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module apparatus, cooling structure, and electric vehicle or...
- Patent number 11,854,937
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Double side heat dissipation for silicon chip package
- Patent number 11,842,952
- Issue date Dec 12, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 11,830,784
- Issue date Nov 28, 2023
- Semiconductor Components Industries, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with exposed tie bar
- Patent number 11,817,374
- Issue date Nov 14, 2023
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,764,135
- Issue date Sep 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 11,742,263
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with pad anchoring members and method of forming the same
- Patent number 11,699,667
- Issue date Jul 11, 2023
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a plurality of offsets in leads suppor...
- Patent number 11,694,946
- Issue date Jul 4, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Min Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing same
- Patent number 11,655,143
- Issue date May 23, 2023
- Infineon Technologies AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,658,100
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising substrate, semiconductor chip...
- Patent number 11,631,628
- Issue date Apr 18, 2023
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,600,556
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140658
- Publication date May 1, 2025
- Fuji Electric Co., Ltd.
- Masanori TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD STRUCTURE FOR AN INDUCTIVE COIL
- Publication number 20250111985
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann M. CAMENFORTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250112129
- Publication date Apr 3, 2025
- Fuji Electric Co., Ltd.
- Naoyuki KANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20250079272
- Publication date Mar 6, 2025
- Fuji Electric Co., Ltd.
- Yuta SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED LEADFRAME AND METHOD THEREFOR
- Publication number 20250069903
- Publication date Feb 27, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT
- Publication number 20250062198
- Publication date Feb 20, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Matthew Hein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...
- Publication number 20250054844
- Publication date Feb 13, 2025
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371817
- Publication date Nov 7, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240332140
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Kesayuki SONEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240332139
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Taketo NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL AG SINTER DISCRETE PREMIUM PACKAGE
- Publication number 20240312855
- Publication date Sep 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- XiaoYing YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20240274512
- Publication date Aug 15, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...
- Publication number 20240145353
- Publication date May 2, 2024
- Fuji Electric Co., Ltd.
- Tsubasa NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240112988
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Kaori UEBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240112991
- Publication date Apr 4, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240105560
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Yasuhiro TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20240096734
- Publication date Mar 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR...
- Publication number 20240079293
- Publication date Mar 7, 2024
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20240038637
- Publication date Feb 1, 2024
- NEXPERIA B.V.
- Jia Yunn Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...
- Publication number 20240021436
- Publication date Jan 18, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014106
- Publication date Jan 11, 2024
- Power Master Semiconductor Co., Ltd.
- Jooyaung EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH PAD ANCHORING MEMBERS AND METHOD OF FORMING THE SAME
- Publication number 20230420390
- Publication date Dec 28, 2023
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD
- Publication number 20230411250
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Norihiro DAICHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230411257
- Publication date Dec 21, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Siang Miang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230395470
- Publication date Dec 7, 2023
- Mitsubishi Electric Corporation
- Akihisa FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charging Base Lead Frame, Charging Base Lead Frame Assembly and Cha...
- Publication number 20230386982
- Publication date Nov 30, 2023
- Tyco Electronics (Suzhou) Ltd.
- Fangyue (Jason) Zhu
- H01 - BASIC ELECTRIC ELEMENTS

characterised by bent parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including heat sink with exposed side from enc...

Edge bend for isolation packages

Leadframe spacer for double-sided power module

Chip package positioning and fixing structure

Package with electrically insulated carrier and at least one step o...

Semiconductor devices having a plurality of offsets in leads suppor...

Power module

Multichip packaged semiconductor device

Packaging of a semiconductor device with a plurality of leads

Leadframe package with adjustable clip

Mechanical couplings designed to resolve process constraints

Semiconductor apparatus mounted electrically connected to a plurali...

Multi-die-package and method

Semiconductor device and a method of manufacturing a semiconductor...

Power semiconductor device with dual heat dissipation structures

Semiconductor device

Package with electrically insulated carrier and at least one step o...

Mold flow balancing for a matrix leadframe

Power module apparatus, cooling structure, and electric vehicle or...

Double side heat dissipation for silicon chip package

Leadframe spacer for double-sided power module

Electronic device with exposed tie bar

Method of manufacturing a semiconductor device

Flippable leadframe for packaged electronic system having verticall...

Leadframe with pad anchoring members and method of forming the same

Semiconductor devices having a plurality of offsets in leads suppor...

Semiconductor component and method for producing same

Packaging of a semiconductor device with a plurality of leads

Semiconductor chip package comprising substrate, semiconductor chip...

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

LEAD STRUCTURE FOR AN INDUCTIVE COIL

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE WITH EMBEDDED LEADFRAME AND METHOD THEREFOR

DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT

LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

LEAD FRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

FULL AG SINTER DISCRETE PREMIUM PACKAGE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...

SEMICONDUCTOR DEVICE

LEADFRAME WITH PAD ANCHORING MEMBERS AND METHOD OF FORMING THE SAME

POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

POWER MODULE

Charging Base Lead Frame, Charging Base Lead Frame Assembly and Cha...