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DUAL CURRENT MAGNETIC FIELD SENSOR
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Publication number 20240133981
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Publication date Apr 25, 2024
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INFINEON TECHNOLOGIES AG
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Stephan LEISENHEIMER
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240112994
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Publication date Apr 4, 2024
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Littelfuse Semiconductor (Wuxi) Co., Ltd
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Lucas Zhang
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240105563
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Publication date Mar 28, 2024
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Kabushiki Kaisha Toshiba
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Toru SUGIYAMA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240087991
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Publication date Mar 14, 2024
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Samsung Electronics Co., Ltd.
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Jae Hyun LIM
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240063097
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Publication date Feb 22, 2024
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Rohm Co., Ltd.
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Katsutoki SHIRAI
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20240047313
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Publication date Feb 8, 2024
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Integrated Silicon Solution Inc.
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Cheng-Fu YU
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240030105
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Publication date Jan 25, 2024
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ROHM CO., LTD.
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Yoshizo OSUMI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240030109
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Publication date Jan 25, 2024
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ROHM CO., LTD.
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Yoshizo OSUMI
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H01 - BASIC ELECTRIC ELEMENTS
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Side-Solderable Leadless Package
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Publication number 20240021504
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Publication date Jan 18, 2024
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SEMTECH CORPORATION
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Henry Descalzo Bathan
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H01 - BASIC ELECTRIC ELEMENTS
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