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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/532characterised by the materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device and same
- Patent number 12,237,222
- Issue date Feb 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Fan Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,237,342
- Issue date Feb 25, 2025
- Japan Display Inc.
- Akihiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,237,013
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution str...
- Patent number 12,237,318
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin structure
- Patent number 12,237,322
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shun-Li Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact structure
- Patent number 12,237,261
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with bronze material to mitigate undercut
- Patent number 12,237,219
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising multilevel bitlines, and related meth...
- Patent number 12,237,259
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures using directed self-assembly fo...
- Patent number 12,237,223
- Issue date Feb 25, 2025
- Intel Corporation
- Paul A. Nyhus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 12,237,368
- Issue date Feb 25, 2025
- Adeia Semiconductor Solutions LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices
- Patent number 12,232,323
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Euntaek Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with buried power rail and methods of manufactur...
- Patent number 12,230,570
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Joon Goo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,230,538
- Issue date Feb 18, 2025
- Kioxia Corporation
- Shinya Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packaging with ball attach before repassivation
- Patent number 12,230,539
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed package and method of making the same
- Patent number 12,230,594
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap spacer formation for nano-scale semiconductor devices
- Patent number 12,224,203
- Issue date Feb 11, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with doped semiconductor bridge str...
- Patent number 12,225,720
- Issue date Feb 11, 2025
- SanDisk Technologies LLC
- Ryousuke Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,204
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Nan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 12,224,205
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including active contacts and support conta...
- Patent number 12,224,240
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising wiring layer over driver circuit
- Patent number 12,225,711
- Issue date Feb 11, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 12,224,179
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing a via and a metal wiring for a semiconducto...
- Patent number 12,224,237
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,218,001
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,218,005
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...
- Publication number 20250070028
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...
- Publication number 20250069947
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070002
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kyungtae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING RESISTANCE OF CONTACT
- Publication number 20250069949
- Publication date Feb 27, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zhaoqin ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20250069951
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...
- Publication number 20250072001
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hanbyeol LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...
- Publication number 20250070014
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...
- Publication number 20250070017
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20250070020
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070023
- Publication date Feb 27, 2025
- KIOXIA Corporation
- Hisashi KATO
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...
- Publication number 20250070015
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS
- Publication number 20250070026
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PO...
- Publication number 20250068074
- Publication date Feb 27, 2025
- Asahi Kasei Kabushiki Kaisha
- Takeki SHIMIZU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...
- Publication number 20250062236
- Publication date Feb 20, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES
- Publication number 20250063733
- Publication date Feb 20, 2025
- Lodestar Licensing Group LLC
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING GATE STRUCTURE
- Publication number 20250063759
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...
- Publication number 20250062193
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062228
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Sanghyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250062231
- Publication date Feb 20, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250062233
- Publication date Feb 20, 2025
- SK HYNIX INC.
- So Young YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250063913
- Publication date Feb 20, 2025
- Japan Display Inc.
- Nobuto Managaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRENCH LINER FUSE
- Publication number 20250062225
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250062234
- Publication date Feb 20, 2025
- CXMT CORPORATION
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...
- Publication number 20250056813
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Seulji Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VERTICAL INTERCONNECT ELEVATOR BASED ON THROUGH SILICON VIAS
- Publication number 20250054860
- Publication date Feb 13, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor device and same

Semiconductor device and method for manufacturing semiconductor device

Integrated assemblies and methods of forming integrated assemblies

Method for fabricating semiconductor device with redistribution str...

Semiconductor device having fin structure

Semiconductor device having a contact structure

Contact with bronze material to mitigate undercut

Electronic devices comprising multilevel bitlines, and related meth...

Contact over active gate structures using directed self-assembly fo...

Semiconductor structures including middle-of-line (MOL) capacitance...

Word line structure of three-dimensional memory device

Three-dimensional semiconductor memory devices

Integrated circuit with buried power rail and methods of manufactur...

Reducing RC delay in semiconductor devices

Semiconductor device and method of manufacturing the same

Wafer chip scale packaging with ball attach before repassivation

Printed package and method of making the same

Air gap spacer formation for nano-scale semiconductor devices

Three-dimensional memory device with doped semiconductor bridge str...

Semiconductor device and method

Semiconductor memory device and manufacturing method thereof

Microelectronic devices including active contacts and support conta...

Semiconductor device comprising wiring layer over driver circuit

Dual metal silicide structures for advanced integrated circuit stru...

Metal heterojunction structure with capping metal layer

Method of manufacturing a via and a metal wiring for a semiconducto...

Semiconductor package and method of fabricating semiconductor package

Backside contact to improve thermal dissipation away from semicondu...

Method of forming an integrated circuit device having an etch-stop...

Integrated circuit device

Patents Applicationslast 30 patents

INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...

SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...

SEMICONDUCTOR PACKAGE

METHOD FOR REDUCING RESISTANCE OF CONTACT

Method of Fabricating Redistribution Circuit Structure

SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...

SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

SEMICONDUCTOR DEVICE

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...

SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PO...

Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...

MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES

METHOD OF FORMING GATE STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...

SEMICONDUCTOR DEVICE

WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

DISPLAY DEVICE

TRENCH LINER FUSE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...

VERTICAL INTERCONNECT ELEVATOR BASED ON THROUGH SILICON VIAS

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

FORMING LARGE CHIPS THROUGH STITCHING