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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/532characterised by the materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with self-aligned conductive features
- Patent number 12,300,600
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multilayer insulating layer in recess and...
- Patent number 12,300,614
- Issue date May 13, 2025
- Kioxia Corporation
- Kosuke Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFET) device structure with protecti...
- Patent number 12,300,538
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,551
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a porous low-k structure
- Patent number 12,300,486
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,300,537
- Issue date May 13, 2025
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,300,601
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,599
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect conductive structure comprising two conductive materials
- Patent number 12,300,611
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including conductive layers contacting trench
- Patent number 12,300,612
- Issue date May 13, 2025
- Winbond Electronics Corp.
- Yoshinori Tanaka
- G11 - INFORMATION STORAGE
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 12,300,622
- Issue date May 13, 2025
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature of semiconductor device and method of forming same
- Patent number 12,300,540
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with carbon-...
- Patent number 12,300,541
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and formation method thereof
- Patent number 12,293,971
- Issue date May 6, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhongdi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned vias
- Patent number 12,293,944
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directed self-assembly enabled subtractive metal patterning
- Patent number 12,293,913
- Issue date May 6, 2025
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing tsemiconductor device having bonding structure
- Patent number 12,295,137
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,293,925
- Issue date May 6, 2025
- Renesas Electronics Corporation
- Yuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with silicide portion between conduc...
- Patent number 12,288,748
- Issue date Apr 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase control in contact formation
- Patent number 12,288,716
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,283,523
- Issue date Apr 22, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tiantian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method for semiconductor structure and semiconductor structure
- Patent number 12,283,519
- Issue date Apr 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chuxian Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,283,557
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Aaron Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming spacers for semiconductor devices including back...
- Patent number 12,283,521
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symbiotic network on layers
- Patent number 12,283,572
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gate contact structure over active gate and method to fabricate same
- Patent number 12,278,144
- Issue date Apr 15, 2025
- Intel Corporation
- Abhijit Jayant Pethe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157963
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...
- Publication number 20250157916
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING CONTACT...
- Publication number 20250157931
- Publication date May 15, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Bernhard KÖNIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE IN DIE SEMICONDUCTOR DEVICE AND METHOD THEREFOR
- Publication number 20250157986
- Publication date May 15, 2025
- NXP B.V.
- Yen-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL
- Publication number 20250157935
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESHED TRANSMISSION LINE
- Publication number 20250157920
- Publication date May 15, 2025
- Northrop Grumman Systems Corporation
- NYLE LEE KENDRICK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE LINER
- Publication number 20250157932
- Publication date May 15, 2025
- TOKYO ELECTRON LIMITED
- Tek Po Rinus Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250157933
- Publication date May 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi KOEZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING RAISED VIA CONTACTS
- Publication number 20250157938
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Loss Prevention In Conductive Structures
- Publication number 20250157919
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE SIGNAL TRANSDUCTION ENABLED BY HIGH EFFICIENCY COPPE...
- Publication number 20250157927
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250157934
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Suhyun BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157964
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250157537
- Publication date May 15, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149446
- Publication date May 8, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shoki MIYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149450
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...
- Publication number 20250149382
- Publication date May 8, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS
- Publication number 20250151281
- Publication date May 8, 2025
- Lodestar Licensing Group LLC
- Haitao Liu
- G11 - INFORMATION STORAGE
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
- Publication number 20250149529
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250149408
- Publication date May 8, 2025
- InnoLux Corporation
- Jui-Jen YUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF HIGH-DENSITY THREE-DIMENSIONAL (3D)-ST...
- Publication number 20250149445
- Publication date May 8, 2025
- CHENGDU PBM TECHNOLOGY LTD.
- JACK ZEZHONG PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149449
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...
- Publication number 20250149451
- Publication date May 8, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING MIM CAPACITOR AND RESISTOR
- Publication number 20250151376
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hsiang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
- Publication number 20250149397
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Seonhaeng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149452
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- JINSUB KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DOT ARRAY DEVICES WITH SHARED GATES
- Publication number 20250151355
- Publication date May 8, 2025
- Intel Corporation
- Hubert C. George
- B82 - NANO-TECHNOLOGY
Information Patent Application
SUBSTRATE ASSEMBLY AND DISPLAY DEVICE
- Publication number 20250140715
- Publication date May 1, 2025
- Red Oak Innovations Limited
- Tsung-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250142958
- Publication date May 1, 2025
- UNITED MICROELECTRONICS CORP.
- Tai-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with self-aligned conductive features

Semiconductor device with multilayer insulating layer in recess and...

Backside contact for thermal displacement in a multi-wafer stacked...

Package structure and method of fabricating the same

Fin field effect transistor (FinFET) device structure with protecti...

Method for forming semiconductor structure

System and method of forming a porous low-k structure

Conformal low temperature hermetic dielectric diffusion barriers

Interconnect structure

Method for forming semiconductor structure

Interconnect conductive structure comprising two conductive materials

Semiconductor structure including conductive layers contacting trench

Die interconnect substrate, an electrical device and a method for f...

Device packages including redistribution layers with carbon-based c...

Conductive feature of semiconductor device and method of forming same

Structure and formation method of semiconductor device with carbon-...

Semiconductor structure and formation method thereof

Semiconductor device with self-aligned vias

Directed self-assembly enabled subtractive metal patterning

Method of manufacturing tsemiconductor device having bonding structure

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device structure with silicide portion between conduc...

Phase control in contact formation

Semiconductor device and fabrication method thereof

Forming method for semiconductor structure and semiconductor structure

Integrated circuit structure

Methods of forming spacers for semiconductor devices including back...

Symbiotic network on layers

Gate contact structure over active gate and method to fabricate same

Patents Applicationslast 30 patents

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...

METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING CONTACT...

DIE IN DIE SEMICONDUCTOR DEVICE AND METHOD THEREFOR

ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL

MESHED TRANSMISSION LINE

LOW RESISTANCE LINER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR STRUCTURE HAVING RAISED VIA CONTACTS

Metal Loss Prevention In Conductive Structures

LOW RESISTANCE SIGNAL TRANSDUCTION ENABLED BY HIGH EFFICIENCY COPPE...

SEMICONDUCTOR DEVICES

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

Integrated Assemblies and Methods of Forming Integrated Assemblies

SEMICONDUCTOR DEVICE

THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...

DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

ELECTRONIC DEVICE

INTERCONNECTION STRUCTURE OF HIGH-DENSITY THREE-DIMENSIONAL (3D)-ST...

THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...

DEVICE INCLUDING MIM CAPACITOR AND RESISTOR

SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE

SEMICONDUCTOR DEVICE

QUANTUM DOT ARRAY DEVICES WITH SHARED GATES

SUBSTRATE ASSEMBLY AND DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF