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H01L23/532
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last 30 patents
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Patent Grant
Semiconductor device and methods of forming the same
Patent number
11,973,027
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pei-Yu Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned barrier for metal vias
Patent number
11,972,974
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Sung-Li Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,972,997
Issue date
Apr 30, 2024
Rohm Co., Ltd.
Takukazu Otsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of manufacturing a semiconductor...
Patent number
11,972,973
Issue date
Apr 30, 2024
Chun-Ming Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nanotwin copper materials in semiconductor devices
Patent number
11,973,034
Issue date
Apr 30, 2024
Applied Materials, Inc.
Eric J. Bergman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Semiconductor device structure having air gap and method for formin...
Patent number
11,972,975
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsi-Wen Tien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods for manufacturing the same
Patent number
11,967,554
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Jongjin Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
Patent number
11,967,522
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jyh-Nan Lin
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Methods of manufacturing semiconductor chip
Patent number
11,967,529
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Byung-moon Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
Patent number
11,967,556
Issue date
Apr 23, 2024
Biow Hiem Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inter block for recessed contacts and methods forming same
Patent number
11,967,622
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Te-Chih Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple-stack three-dimensional memory device and fabrication meth...
Patent number
11,968,832
Issue date
Apr 23, 2024
Yangtze Memory Technologies Co., Ltd.
Jun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective tungsten deposition at low temperatures
Patent number
11,967,525
Issue date
Apr 23, 2024
Applied Materials, Inc.
Yi Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
Patent number
11,967,552
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Han Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contacts for highly scaled transistors
Patent number
11,961,892
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Carlos H. Diaz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mitigating pattern collapse
Patent number
11,961,761
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company Limited
Chih-Yuan Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nonvolatile memory device and method for fabricating the same
Patent number
11,963,357
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Kohji Kanamori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip and semiconductor device including a copper pill...
Patent number
11,961,816
Issue date
Apr 16, 2024
Rohm Co., Ltd.
Shoji Takei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned metal gate for multigate device and method of forming...
Patent number
11,961,763
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jia-Chuan You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
Patent number
11,961,767
Issue date
Apr 16, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having high breakdown voltage etch-stop layer
Patent number
11,961,803
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Joung-Wei Liou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for interlevel dielectric layer with regions o...
Patent number
11,955,421
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Anhao Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
Issue date
Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photosensitive resin composition, photosensitive resin sheet, cured...
Patent number
11,953,830
Issue date
Apr 9, 2024
Toray Industries, Inc.
Yusuke Komori
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Reducing loss in stacked quantum devices
Patent number
11,955,465
Issue date
Apr 9, 2024
Google LLC
Theodore Charles White
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
Patent number
11,955,534
Issue date
Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etch damage and ESL free dual damascene metal interconnect
Patent number
11,955,376
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sunil Kumar Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for fabrication of superconducting integrated c...
Patent number
11,957,065
Issue date
Apr 9, 2024
1372934 B.C. LTD
Shuiyuan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with detection conductor
Patent number
11,955,440
Issue date
Apr 9, 2024
Rohm Co., Ltd.
Katsuhiko Yoshihara
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED RING STRUCTURES
Publication number
20240145383
Publication date
May 2, 2024
Intel Corporation
June Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Publication number
20240145384
Publication date
May 2, 2024
Micron Technology, Inc.
Akira Kaneko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
Publication number
20240145391
Publication date
May 2, 2024
Tahoe Research, Ltd.
Christopher J. JEZEWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145295
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jihyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS
Publication number
20240147729
Publication date
May 2, 2024
Lodestar Licensing Group LLC
Haitao Liu
G11 - INFORMATION STORAGE
Information
Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
Publication number
20240145299
Publication date
May 2, 2024
TESSERA LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING M...
Publication number
20240145302
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Shien SHIAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
Publication number
20240145381
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate with Differing Dielectric Constants
Publication number
20240145392
Publication date
May 2, 2024
Avago Technologies International Sales Pte. Limited
Dharmendra Saraswat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
Publication number
20240136243
Publication date
Apr 25, 2024
Intel Corporation
Min Suet Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
Publication number
20240136221
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shao-Kuan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
Publication number
20240136280
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chao-Wen Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
Publication number
20240138268
Publication date
Apr 25, 2024
D-Wave Systems Inc.
Colin C. Enderud
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ru Liner above a Barrier Layer
Publication number
20240136223
Publication date
Apr 25, 2024
Zhaoxuan WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-STRESS PASSIVATION LAYER
Publication number
20240136291
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsiang-Ku SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE
Publication number
20240128214
Publication date
Apr 18, 2024
UNITED MICROELECTRONICS CORP.
Aaron Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL
Publication number
20240128191
Publication date
Apr 18, 2024
International Business Machines Corporation
Tsung-Sheng Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE
Publication number
20240128180
Publication date
Apr 18, 2024
Hyundai Motor Company
Myung Ill You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTIFUSE DEVICE HAVING INTERCONNECT JUMPER
Publication number
20240128189
Publication date
Apr 18, 2024
Micron Technology, Inc.
Christopher G. Wieduwilt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
Publication number
20240128171
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Junwoo Myung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL WIRING OF SEMICONDUCTOR DEVICE
Publication number
20240120275
Publication date
Apr 11, 2024
SK HYNIX INC.
Seong Ho CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20240120332
Publication date
Apr 11, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
Publication number
20240113024
Publication date
Apr 4, 2024
International Business Machines Corporation
Ching-Tzu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
Publication number
20240113026
Publication date
Apr 4, 2024
INFINEON TECHNOLOGIES AG
Edward Fürgut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240114681
Publication date
Apr 4, 2024
SK HYNIX INC.
Sung Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE
Publication number
20240113042
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Jeffrey Alan West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20240112952
Publication date
Apr 4, 2024
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE
Publication number
20240113018
Publication date
Apr 4, 2024
International Business Machines Corporation
Oscar van der Straten
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IN-MOLD ELECTRONICS DEVICE
Publication number
20240112969
Publication date
Apr 4, 2024
Industrial Technology Research Institute
Yu-Ming Peng
H01 - BASIC ELECTRIC ELEMENTS