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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/532characterised by the materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques, methods, and structures for rapid and efficient interca...
- Patent number 12,368,102
- Issue date Jul 22, 2025
- Destination 2D Inc.
- Kaustav Banerjee
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Diffusion barrier layer for conductive via to decrease contact resi...
- Patent number 12,368,103
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including interconnect structures including dielectric...
- Patent number 12,368,101
- Issue date Jul 22, 2025
- Battelle Energy Alliance, LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside power rail and method thereof
- Patent number 12,369,365
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects, inductors, transformers, and power architectures for...
- Patent number 12,368,100
- Issue date Jul 22, 2025
- Synopsys, Inc.
- Jamil Kawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous filling of variable aspect ratio single damascene cont...
- Patent number 12,368,095
- Issue date Jul 22, 2025
- Intel Corporation
- AKM Shaestagir Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
- Patent number 12,368,097
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group VI metal deposition process
- Patent number 12,359,309
- Issue date Jul 15, 2025
- Entegris, Inc.
- Philip S. H. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,362,229
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM structure
- Patent number 12,362,271
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun huan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and methods of fabrication thereof
- Patent number 12,362,273
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Nan Nian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming embedded diffusion barriers
- Patent number RE50494
- Issue date Jul 15, 2025
- TESSERA LLC
- Cyril Cabral
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,362,234
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconducting devices, back end of line portions for semiconductin...
- Patent number 12,362,279
- Issue date Jul 15, 2025
- The Research Foundation for the State University of New York
- Patrick Lenahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of performing chemical-mechanical polishing process in semi...
- Patent number 12,362,233
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of embedded memory devices utilizing a self assembled m...
- Patent number 12,363,913
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-doped trenches for memory
- Patent number 12,354,912
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures
- Patent number 12,354,953
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,356,611
- Issue date Jul 8, 2025
- SK Hynix Inc.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 12,354,910
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu3Sn via metallization in electrical devices for low-temperature 3...
- Patent number 12,354,911
- Issue date Jul 8, 2025
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination control of dielectric layers of integrated circuit chips
- Patent number 12,354,946
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with different metal materials
- Patent number 12,354,957
- Issue date Jul 8, 2025
- Intel Corporation
- Carl H. Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching metals in semiconductor devices
- Patent number 12,354,881
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron migration control in interconnect structures
- Patent number 12,354,907
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...
- Publication number 20250239519
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250239526
- Publication date Jul 24, 2025
- KIOXIA Corporation
- Hikaru ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239525
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Se Ra HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE SEMICONDUCTOR FERROELECTRIC FIELD EFFECT TRANSISTOR
- Publication number 20250241015
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS
- Publication number 20250239487
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250240945
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jinseong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250234599
- Publication date Jul 17, 2025
- Fuji Electric Co., Ltd.
- Motoyoshi KUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE
- Publication number 20250234511
- Publication date Jul 17, 2025
- NANYA TECHNOLOGY CORPORATION
- YI-JEN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME
- Publication number 20250233020
- Publication date Jul 17, 2025
- Intel Corporation
- Abhijit Jayant PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
- Publication number 20250233018
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250233075
- Publication date Jul 17, 2025
- WINBOND ELECTRONICS CORP.
- Yoshinori TANAKA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20250233068
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY TUNGSTEN INTERCONNECT STRUCTURES
- Publication number 20250233073
- Publication date Jul 17, 2025
- VEECO INSTRUMENTS INC.
- Rutvik J. MEHTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVE METAL CAP FORMATION
- Publication number 20250233074
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20250226342
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250226314
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- JEEWOONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRANSISTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250227979
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226374
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20250226311
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Taehun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCA...
- Publication number 20250226320
- Publication date Jul 10, 2025
- Destination 2D Inc.
- Kaustav BANERJEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS
- Publication number 20250226322
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ren Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226010
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Olivier WEBER
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
- Publication number 20250226313
- Publication date Jul 10, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH TOPVIA
- Publication number 20250226319
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Gideon Oyibo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCA...
- Publication number 20250226321
- Publication date Jul 10, 2025
- Destination 2D Inc.
- Kaustav BANERJEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT PLUG WITH THIN HERMETIC LINER AND LOW-K FILL FOR REDUCED C...
- Publication number 20250220990
- Publication date Jul 3, 2025
- Intel Corporation
- Swapnadip Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTOR, ELECTRONIC APPARATUS INCLUDING THE INTERCONNECTOR,...
- Publication number 20250218947
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Youngchul LEEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250218948
- Publication date Jul 3, 2025
- AMAZING COOL TECHNOLOGY CORPORATION
- Hsien-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...
- Publication number 20250218949
- Publication date Jul 3, 2025
- Intel Corporation
- Sriharsha Karumuri
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure comprising a gap an...

Techniques, methods, and structures for rapid and efficient interca...

Diffusion barrier layer for conductive via to decrease contact resi...

Methods of forming semiconductor device

Apparatuses including interconnect structures including dielectric...

Semiconductor devices with backside power rail and method thereof

Interconnects, inductors, transformers, and power architectures for...

Simultaneous filling of variable aspect ratio single damascene cont...

Contact structures for reducing electrical shorts and methods of fo...

Partial barrier free vias for cobalt-based interconnects and method...

Group VI metal deposition process

Semiconductor device and method of manufacturing the same

Semiconductor device structures

MIM structure

Conductive structures and methods of fabrication thereof

Self-forming embedded diffusion barriers

Contact structure for semiconductor device

Semiconducting devices, back end of line portions for semiconductin...

Methods of performing chemical-mechanical polishing process in semi...

Fabrication of embedded memory devices utilizing a self assembled m...

Plasma-doped trenches for memory

Via structures

Cobalt based interconnects and methods of fabrication thereof

Semiconductor device and method for fabricating the same

Bi-layer alloy liner for interconnect metallization and methods of...

Cu3Sn via metallization in electrical devices for low-temperature 3...

Delamination control of dielectric layers of integrated circuit chips

Interconnect structures with different metal materials

Methods of etching metals in semiconductor devices

Electron migration control in interconnect structures

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

OXIDE SEMICONDUCTOR FERROELECTRIC FIELD EFFECT TRANSISTOR

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE

GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME

CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...

LOW RESISTIVITY TUNGSTEN INTERCONNECT STRUCTURES

METHODS FOR SELECTIVE METAL CAP FORMATION

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR TRANSISTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

POWER SEMICONDUCTOR DEVICES

TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCA...

INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS

ELECTRONIC DEVICE

INTERCONNECT LINES WITH LINE WIDTH PROFILE

INTERCONNECT WITH TOPVIA

TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCA...

GATE CUT PLUG WITH THIN HERMETIC LINER AND LOW-K FILL FOR REDUCED C...

INTERCONNECTOR, ELECTRONIC APPARATUS INCLUDING THE INTERCONNECTOR,...

SEMICONDUCTOR DEVICE

TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...