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SUBSTRATE CONTACT IN WAFER BACKSIDE
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Publication number 20240145498
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Publication date May 2, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hao-Lin Yang
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH COUNT RATE PASSIVE QUENCHING SPAD
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Publication number 20240145500
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Publication date May 2, 2024
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STMicroelectronics (Research and Development) Limited
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Mohammed AL-RAWHANI
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H01 - BASIC ELECTRIC ELEMENTS
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IMAGE SENSOR
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Publication number 20240136374
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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Jung Wook LIM
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H01 - BASIC ELECTRIC ELEMENTS
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IMAGE SENSOR
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Publication number 20240136375
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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Masato FUJITA
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H01 - BASIC ELECTRIC ELEMENTS
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IMAGING DEVICE
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Publication number 20240136373
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Publication date Apr 25, 2024
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Tianma Japan, Ltd.
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Shuhei NARA
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H01 - BASIC ELECTRIC ELEMENTS
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PINNED PHOTODIODE PIXEL
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Publication number 20240136372
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Publication date Apr 25, 2024
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ams-OSRAM Asia Pacific Pte. Ltd.
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Benjamin Joseph SHEAHAN
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H01 - BASIC ELECTRIC ELEMENTS
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IMAGING DEVICE
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Publication number 20240137669
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Publication date Apr 25, 2024
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Panasonic Intellectual Property Management Co., Ltd.
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SANSHIRO SHISHIDO
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H01 - BASIC ELECTRIC ELEMENTS
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IMAGE SENSOR
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Publication number 20240128289
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Publication date Apr 18, 2024
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STMicroelectronics (Crolles 2) SAS
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Francois ROY
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H01 - BASIC ELECTRIC ELEMENTS
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DEPTH SENSOR
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Publication number 20240128290
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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Seung Hyun LEE
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H01 - BASIC ELECTRIC ELEMENTS