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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/04characterised by the shape of the container or parts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Choked flow cooling
- Patent number 12,266,591
- Issue date Apr 1, 2025
- SK Hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple semiconductor die container load port
- Patent number 12,261,069
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with integrated gate driver and functional components...
- Patent number 12,256,514
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Andre Arens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and manufacturing method therefor
- Patent number 12,237,237
- Issue date Feb 25, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride based depletion mode differential amplifiers and...
- Patent number 12,212,289
- Issue date Jan 28, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protector cap for package with thermal interface material
- Patent number 12,211,761
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with metallic cap
- Patent number 12,205,857
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,866
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,990
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,965
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, resin molded product, and method of molding...
- Patent number 12,165,938
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Kimihiro Ashino
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lidded microelectronic device packages and related systems, apparat...
- Patent number 12,159,811
- Issue date Dec 3, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spaced apart containers
- Patent number 12,154,836
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Hisashi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,148,680
- Issue date Nov 19, 2024
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device
- Patent number 12,142,491
- Issue date Nov 12, 2024
- Ampleon Netherlands B.V.
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,136,575
- Issue date Nov 5, 2024
- Mitsubishi Electric Corporation
- Tomohiro Maegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,131,969
- Issue date Oct 29, 2024
- Mitsubishi Electric Corporation
- Hiroya Sannai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encircling a semiconductor device with stacked frames on a substrate
- Patent number 12,119,296
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Multiple semiconductor die container load port
- Patent number 12,119,251
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20250118615
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION DEVICE
- Publication number 20250105070
- Publication date Mar 27, 2025
- Mitsubishi Heavy Industries, Ltd.
- Masahiko Ezumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105068
- Publication date Mar 27, 2025
- Siliconware Precision Industries Co., Ltd.
- Chuan-Shun LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105067
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Taira Tabakoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105069
- Publication date Mar 27, 2025
- Fuji Electric Co., Ltd.
- Eri KAMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105090
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...
- Publication number 20250105170
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...
- Publication number 20250096062
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096049
- Publication date Mar 20, 2025
- Mitsubishi Electric Corporation
- Tatsuya UDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096080
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Shun HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...
- Publication number 20250098062
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Philipp K. BUCHLING REGO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096068
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Naoki TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087651
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC MICROELECTRONIC MODULE USING A SHEATH
- Publication number 20250087540
- Publication date Mar 13, 2025
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER WITH INTEGRATED CONNECTORS
- Publication number 20250079276
- Publication date Mar 6, 2025
- ADVANCED MICRO DEVICES, INC.
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE
- Publication number 20250079284
- Publication date Mar 6, 2025
- KYOCERA CORPORATION
- Shigenori TAKAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS CHIP PACKAGE STRUCTURES INCLUDING A CONTROLLED UNDERFILL...
- Publication number 20250069977
- Publication date Feb 27, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Kashi Vishwanath Machani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING, SEMICONDUCTOR MODULE INCLUDING A HOUSING, AND METHOD FOR A...
- Publication number 20250069964
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Marco Ludwig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062250
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250054897
- Publication date Feb 13, 2025
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022762
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Masayoshi NAKAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH A SILICON CARBIDE SUBSTRATE
- Publication number 20250022918
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Christian HECHT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022778
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Eri KAMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20250014951
- Publication date Jan 9, 2025
- Fuji Electric Co., Ltd.
- Ryusuke KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC MODULE
- Publication number 20250006565
- Publication date Jan 2, 2025
- Kyocera Corporation
- Tomoya TABUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
- Publication number 20250006583
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK UNIT, IC SOCKET, SEMICONDUCTOR PACKAGE MAKING METHOD, AND...
- Publication number 20240421033
- Publication date Dec 19, 2024
- Yamaichi Electronics Co., Ltd.
- Koichi MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20240421107
- Publication date Dec 19, 2024
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTING DEDICATED TEST PINS
- Publication number 20240421105
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape of the container or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Choked flow cooling

Hermetic package for high CTE mismatch

Semiconductor device package and a method of manufacturing the same

Multiple semiconductor die container load port

Secure semiconductor integration and method for making thereof

Power module with integrated gate driver and functional components...

Semiconductor module and manufacturing method therefor

Radio frequency package implementing a window frame with edge plati...

Group III nitride based depletion mode differential amplifiers and...

Protector cap for package with thermal interface material

Electronic component with metallic cap

Semiconductor device

Semiconductor device including surface pressure absorbing member fo...

Semiconductor device

Semiconductor device

RF amplifier devices including top side contacts and methods of man...

Semiconductor device

Semiconductor package, resin molded product, and method of molding...

Lidded microelectronic device packages and related systems, apparat...

Semiconductor device with spaced apart containers

Embedded chip package and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Packaged electronic device

Electronic package with interposer between integrated circuit dies

Semiconductor package

Semiconductor module

Electronic device packages with internal moisture barriers

Encircling a semiconductor device with stacked frames on a substrate

Chip package positioning and fixing structure

Multiple semiconductor die container load port

Patents Applicationslast 30 patents

PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...

POWER MODULE AND POWER CONVERSION DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

HERMETIC MICROELECTRONIC MODULE USING A SHEATH

STIFFENER WITH INTEGRATED CONNECTORS

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE

PHOTONICS CHIP PACKAGE STRUCTURES INCLUDING A CONTROLLED UNDERFILL...

HOUSING, SEMICONDUCTOR MODULE INCLUDING A HOUSING, AND METHOD FOR A...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DIE WITH A SILICON CARBIDE SUBSTRATE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC MODULE

SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME

HEATSINK UNIT, IC SOCKET, SEMICONDUCTOR PACKAGE MAKING METHOD, AND...

MOUNTING STRUCTURE

INKJET PRINTING DEDICATED TEST PINS