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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/04characterised by the shape of the container or parts

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure with a protection cap at an end port...
- Patent number 12,347,722
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,327,771
- Issue date Jun 10, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring base and electronic device
- Patent number 12,322,700
- Issue date Jun 3, 2025
- Kyocera Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 12,322,667
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring structure and semiconductor module
- Patent number 12,315,838
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with lid to manage radiation feedback
- Patent number 12,308,326
- Issue date May 20, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,300,637
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Ko Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 12,300,632
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding and method of makin...
- Patent number 12,288,753
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- Changoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and module including the same
- Patent number 12,278,616
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Koichiro Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Choked flow cooling
- Patent number 12,266,591
- Issue date Apr 1, 2025
- SK Hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple semiconductor die container load port
- Patent number 12,261,069
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with integrated gate driver and functional components...
- Patent number 12,256,514
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Andre Arens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and manufacturing method therefor
- Patent number 12,237,237
- Issue date Feb 25, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protector cap for package with thermal interface material
- Patent number 12,211,761
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride based depletion mode differential amplifiers and...
- Patent number 12,212,289
- Issue date Jan 28, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with metallic cap
- Patent number 12,205,857
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,866
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,990
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,965
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, resin molded product, and method of molding...
- Patent number 12,165,938
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Kimihiro Ashino
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lidded microelectronic device packages and related systems, apparat...
- Patent number 12,159,811
- Issue date Dec 3, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250226271
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY
- Publication number 20250218878
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Ankur Shailesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250210420
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bang Li Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH DETACHABLE FUNCTION
- Publication number 20250210421
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Yu-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FOOTPRINT POWER SWITCH
- Publication number 20250212333
- Publication date Jun 26, 2025
- VISIC TECHNOLOGIES LTD
- Guillermo Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRACING STRUCTURE, SEMICONDUCTOR DEVICE WITH THE SAME, AND METHOD F...
- Publication number 20250210419
- Publication date Jun 26, 2025
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20250201728
- Publication date Jun 19, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT
- Publication number 20250191948
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183239
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblage module 3D
- Publication number 20250167057
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Manon PORLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...
- Publication number 20250157862
- Publication date May 15, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250157863
- Publication date May 15, 2025
- Delta Electronics, Inc.
- Jung-Li CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-TEMPERATURE WIDE BANDGAP POWER MODULE AND PREPARATION METHOD T...
- Publication number 20250140623
- Publication date May 1, 2025
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Zhiqiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140636
- Publication date May 1, 2025
- Amkor Technology Japan, Inc.
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125204
- Publication date Apr 17, 2025
- Mitsubishi Electric Corporation
- Yu FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125286
- Publication date Apr 17, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- James Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING
- Publication number 20250125200
- Publication date Apr 17, 2025
- MURATA MANUFACTURING CO., LTD.
- Stephen John ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20250118615
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION DEVICE
- Publication number 20250105070
- Publication date Mar 27, 2025
- Mitsubishi Heavy Industries, Ltd.
- Masahiko Ezumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105068
- Publication date Mar 27, 2025
- Siliconware Precision Industries Co., Ltd.
- Chuan-Shun LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...
- Publication number 20250105170
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105067
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Taira Tabakoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105069
- Publication date Mar 27, 2025
- Fuji Electric Co., Ltd.
- Eri KAMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105090
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...
- Publication number 20250096062
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096049
- Publication date Mar 20, 2025
- Mitsubishi Electric Corporation
- Tatsuya UDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096080
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Shun HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...
- Publication number 20250098062
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Philipp K. BUCHLING REGO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096068
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Naoki TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC MICROELECTRONIC MODULE USING A SHEATH
- Publication number 20250087540
- Publication date Mar 13, 2025
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape of the container or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device structure with a protection cap at an end port...

3D system integration

Semiconductor module

Wiring base and electronic device

Seal for microelectronic assembly

Wiring structure and semiconductor module

Electronic component with lid to manage radiation feedback

Semiconductor apparatus

Chip package with lid

Semiconductor device with partial EMI shielding and method of makin...

Electronic device and module including the same

Choked flow cooling

Hermetic package for high CTE mismatch

Semiconductor device package and a method of manufacturing the same

Multiple semiconductor die container load port

Secure semiconductor integration and method for making thereof

Power module with integrated gate driver and functional components...

Semiconductor module and manufacturing method therefor

Radio frequency package implementing a window frame with edge plati...

Protector cap for package with thermal interface material

Group III nitride based depletion mode differential amplifiers and...

Electronic component with metallic cap

Semiconductor device

Semiconductor device including surface pressure absorbing member fo...

Semiconductor device

Semiconductor device

RF amplifier devices including top side contacts and methods of man...

Semiconductor device

Semiconductor package, resin molded product, and method of molding...

Lidded microelectronic device packages and related systems, apparat...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY

INTEGRATED CIRCUIT PACKAGES AND METHODS

POWER MODULE WITH DETACHABLE FUNCTION

SMALL FOOTPRINT POWER SWITCH

BRACING STRUCTURE, SEMICONDUCTOR DEVICE WITH THE SAME, AND METHOD F...

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Assemblage module 3D

SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...

POWER MODULE

HIGH-TEMPERATURE WIDE BANDGAP POWER MODULE AND PREPARATION METHOD T...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING

PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...

POWER MODULE AND POWER CONVERSION DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...

SEMICONDUCTOR DEVICE

HERMETIC MICROELECTRONIC MODULE USING A SHEATH