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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/04characterised by the shape of the container or parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,148,680
- Issue date Nov 19, 2024
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device
- Patent number 12,142,491
- Issue date Nov 12, 2024
- Ampleon Netherlands B.V.
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,136,575
- Issue date Nov 5, 2024
- Mitsubishi Electric Corporation
- Tomohiro Maegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,131,969
- Issue date Oct 29, 2024
- Mitsubishi Electric Corporation
- Hiroya Sannai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encircling a semiconductor device with stacked frames on a substrate
- Patent number 12,119,296
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Multiple semiconductor die container load port
- Patent number 12,119,251
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged RF power device with PCB routing outside protective member
- Patent number 12,100,630
- Issue date Sep 24, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency heat dissipation using thermal interface material film
- Patent number 12,100,640
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound closed-type metal lid for semiconductor chip package
- Patent number 12,087,647
- Issue date Sep 10, 2024
- HOJET TECHNOLOGY CO., LTD.
- Ying-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring base and electronic device
- Patent number 12,087,649
- Issue date Sep 10, 2024
- Kyocera Corporation
- Shigenori Takaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an insulating sheet and a conductive fi...
- Patent number 12,080,612
- Issue date Sep 3, 2024
- Fuji Electric Co., Ltd.
- Katsumi Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,068,259
- Issue date Aug 20, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei Da Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,533
- Issue date Jul 23, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with lid and method for forming the same
- Patent number 12,033,913
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,033,905
- Issue date Jul 9, 2024
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 12,027,433
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure and electrical junction box
- Patent number 12,027,500
- Issue date Jul 2, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency crossover with high isolation in microelectronics H...
- Patent number 12,022,608
- Issue date Jun 25, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package with semiconductive thermal pedestal
- Patent number 12,021,003
- Issue date Jun 25, 2024
- Marvell Asia Pte, Ltd.
- Han Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,021,096
- Issue date Jun 25, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Dennis Fernandez Tresnado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,015,014
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 12,002,721
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a semiconductor device
- Patent number 11,996,299
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, and method for manufacturing power semiconductor module
- Patent number 11,978,682
- Issue date May 7, 2024
- NGK Electronics Devices, Inc.
- Yoshio Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
- Publication number 20240387436
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND...
- Publication number 20240379473
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Peng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379474
- Publication date Nov 14, 2024
- NXP USA, Inc.
- Ankur Shailesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM
- Publication number 20240371725
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371743
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURI...
- Publication number 20240363456
- Publication date Oct 31, 2024
- Industrial Technology Research Institute
- Lung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH LID
- Publication number 20240347410
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347508
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jihyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT C...
- Publication number 20240332117
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Changsun YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332271
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321675
- Publication date Sep 26, 2024
- Fuji Electric Co., Ltd.
- Satoshi KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312959
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240312851
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGING ENCLOSURE AND METHOD FOR MANUFAC...
- Publication number 20240312794
- Publication date Sep 19, 2024
- Hubei Yangtze Pilot-Line Services Co., Ltd.
- Yiqun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT
- Publication number 20240304518
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
- Publication number 20240263938
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20240250041
- Publication date Jul 25, 2024
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240234166
- Publication date Jul 11, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
- Publication number 20240234222
- Publication date Jul 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT
- Publication number 20240203820
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Youmin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HOUSING
- Publication number 20240203802
- Publication date Jun 20, 2024
- HUNAN SAN'AN SEMICONDUCTOR CO., LTD.
- Ning YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240194544
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACT...
- Publication number 20240178081
- Publication date May 30, 2024
- Fuji Electric Co., Ltd.
- Kazuo ENOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHOKED FLOW COOLING
- Publication number 20240170368
- Publication date May 23, 2024
- SK hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240162102
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT
- Publication number 20240162071
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240153887
- Publication date May 9, 2024
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape of the container or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded chip package and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Packaged electronic device

Electronic package with interposer between integrated circuit dies

Semiconductor package

Semiconductor module

Electronic device packages with internal moisture barriers

Encircling a semiconductor device with stacked frames on a substrate

Chip package positioning and fixing structure

Multiple semiconductor die container load port

Hermetic package for high CTE mismatch

Packaged RF power device with PCB routing outside protective member

High efficiency heat dissipation using thermal interface material film

Compound closed-type metal lid for semiconductor chip package

Wiring base and electronic device

Semiconductor device having an insulating sheet and a conductive fi...

3D integrations and methods of making thereof

Semiconductor device package and method of manufacturing the same

Semiconductor device

Chip package structure with lid and method for forming the same

Semiconductor device and method for manufacturing the same

Semiconductor package and method for making the same

Circuit structure and electrical junction box

Radio frequency crossover with high isolation in microelectronics H...

Semiconductor device package with semiconductive thermal pedestal

Reliable semiconductor packages

Semiconductor package

Method of fabricating semiconductor structure

Methods for manufacturing a semiconductor device

Package, and method for manufacturing power semiconductor module

Patents Applicationslast 30 patents

HERMETIC PACKAGE DEVICE, AND DEVICE MODULE

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND...

A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURI...

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

CHIP PACKAGE STRUCTURE WITH LID

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT C...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

METHOD FOR MANUFACTURING PACKAGING ENCLOSURE AND METHOD FOR MANUFAC...

SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT

PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT

PACKAGE HOUSING

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACT...

CHOKED FLOW COOLING

BONDED STRUCTURES

MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME