characterised by the shape of the container or parts

Industry

CPC
H01L23/04

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/04characterised by the shape of the container or parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,972,991
- Issue date Apr 30, 2024
- Mitsubishi Electric Corporation
- Hiroki Shiota
- B32 - LAYERED PRODUCTS
Information Patent Grant
Output-integrated transistor device packages
- Patent number 11,967,936
- Issue date Apr 23, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and measurement method for the package structure
- Patent number 11,965,731
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,948,895
- Issue date Apr 2, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component with lid to manage radiation feedback
- Patent number 11,948,893
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement
- Patent number 11,942,452
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Christian Robert Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap for package of integrated circuit
- Patent number 11,923,256
- Issue date Mar 5, 2024
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor device package with copper tungsten conductiv...
- Patent number 11,915,986
- Issue date Feb 27, 2024
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module and power conversion device
- Patent number 11,916,001
- Issue date Feb 27, 2024
- Mitsubishi Electric Corporation
- Kozo Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement having a housing and an electrically conductive contact...
- Patent number 11,916,329
- Issue date Feb 27, 2024
- Semikron Elektronik GmbH & Co. KG
- André Schlötterer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple semiconductor die container load port
- Patent number 11,915,957
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer chips and enclosures for quantum circuits
- Patent number 11,908,756
- Issue date Feb 20, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,908,755
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Choked flow cooling
- Patent number 11,901,264
- Issue date Feb 13, 2024
- SK hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,901,247
- Issue date Feb 13, 2024
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,902
- Issue date Jan 30, 2024
- Fuji Electric Co., Ltd.
- Satoshi Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrally bonded semiconductor device and power converter includin...
- Patent number 11,887,904
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed housing with a semiconductor component and meth...
- Patent number 11,876,007
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package including conductive crack preventing layer
- Patent number 11,862,581
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Ji Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 11,854,920
- Issue date Dec 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 11,855,009
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module having a moulded plastic body and a multiplicity of load ter...
- Patent number 11,837,525
- Issue date Dec 5, 2023
- Semikron Elektronik GmbH & Co. KG
- Harald Kobolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 11,837,514
- Issue date Dec 5, 2023
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method for forming the same
- Patent number 11,830,859
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR WITH INVERTED SHIELDING ELEMENT
- Publication number 20240145348
- Publication date May 2, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240136202
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
- Publication number 20240136238
- Publication date Apr 25, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128136
- Publication date Apr 18, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240120245
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE WITH LID
- Publication number 20240120294
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096719
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240087972
- Publication date Mar 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063066
- Publication date Feb 22, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240047441
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYGONAL PROFILES FROM THE TOP VIEW AND...
- Publication number 20240047282
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT HAVING A HOUSING AND AN ELECTRICALLY CONDUCTIVE CONTACT...
- Publication number 20240022014
- Publication date Jan 18, 2024
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- André SCHLÖTTERER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...
- Publication number 20240006395
- Publication date Jan 4, 2024
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTROTECHNICAL ARRANGEMENT, ELECTRONIC CO...
- Publication number 20240006255
- Publication date Jan 4, 2024
- ROBERT BOSCH GmbH
- Ingo Fritsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411229
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Yuko NAKAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD
- Publication number 20230411250
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Norihiro DAICHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402432
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compartment Shielding With Metal Frame and Cap
- Publication number 20230402332
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395485
- Publication date Dec 7, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protector Cap for Package with Thermal Interface Material
- Publication number 20230395442
- Publication date Dec 7, 2023
- Infineon Technologies Austria AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230386991
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, METHOD FOR MANUFACTURING TERMINAL STRUCTURE, AN...
- Publication number 20230386966
- Publication date Nov 30, 2023
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR DETERMINING DETERIORATION OF SE...
- Publication number 20230369142
- Publication date Nov 16, 2023
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20230369175
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Arthur Unrau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE PACKAGE PREPARATION METHOD AND OPTICAL DEVICE PACKAGE
- Publication number 20230369169
- Publication date Nov 16, 2023
- Lipac Co., Ltd.
- Seong Wook CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE
- Publication number 20230360982
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Martin Goldammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising Structures Configured to Withstand...
- Publication number 20230360984
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Christoph Bayer
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape of the container or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Output-integrated transistor device packages

Package structure and measurement method for the package structure

3DIC packaging with hot spot thermal management features

Semiconductor device

Semiconductor package structure

Bonded structures

Electronic component with lid to manage radiation feedback

Semiconductor module arrangement

Package for a semiconductor device

Integrated passive device (IPD) components and a package and proces...

Cap for package of integrated circuit

Ceramic semiconductor device package with copper tungsten conductiv...

Semiconductor power module and power conversion device

Arrangement having a housing and an electrically conductive contact...

Multiple semiconductor die container load port

Interposer chips and enclosures for quantum circuits

Semiconductor devices and methods of manufacturing semiconductor de...

Choked flow cooling

Insulating component, semiconductor package, and semiconductor appa...

Semiconductor device

Integrally bonded semiconductor device and power converter includin...

Hermetically sealed housing with a semiconductor component and meth...

Semiconductor package including conductive crack preventing layer

Semiconductor device package and a method of manufacturing the same

Embedded chip package and manufacturing method thereof

Chip package with lid

Module having a moulded plastic body and a multiplicity of load ter...

Semiconductor device and power converter

Package structures and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

CURRENT SENSOR WITH INVERTED SHIELDING ELEMENT

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

BONDED STRUCTURES

CHIP PACKAGE WITH LID

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE WITH POLYGONAL PROFILES FROM THE TOP VIEW AND...

ARRANGEMENT HAVING A HOUSING AND AN ELECTRICALLY CONDUCTIVE CONTACT...

PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...

METHOD FOR PRODUCING AN ELECTROTECHNICAL ARRANGEMENT, ELECTRONIC CO...

SEAL FOR MICROELECTRONIC ASSEMBLY

SEMICONDUCTOR DEVICE

POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

Compartment Shielding With Metal Frame and Cap

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

SEMICONDUCTOR DEVICE

Protector Cap for Package with Thermal Interface Material

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TERMINAL STRUCTURE, METHOD FOR MANUFACTURING TERMINAL STRUCTURE, AN...

SEMICONDUCTOR DEVICE AND METHOD FOR DETERMINING DETERIORATION OF SE...

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

OPTICAL DEVICE PACKAGE PREPARATION METHOD AND OPTICAL DEVICE PACKAGE

METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE

Semiconductor Package Comprising Structures Configured to Withstand...