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characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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H05K3/4602
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Parent Industries
H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00
Apparatus or processes for manufacturing printed circuits
Current Industry
H05K3/4602
characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
Industries
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Organizations
People
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Patents Grants
last 30 patents
Information
Patent Grant
Method of fabricating a substrate with metal reflection layer
Patent number
11,979,980
Issue date
May 7, 2024
UNIFLEX Technology Inc.
Cheng-I Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board structure including a closed cavity
Patent number
11,967,758
Issue date
Apr 23, 2024
Skyworks Solutions, Inc.
Ki Wook Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer circuit board and manufacturing method therefor
Patent number
11,956,904
Issue date
Apr 9, 2024
STEMCO CO., LTD.
Jae Soo Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing a substrate structure with high reflectance
Patent number
11,937,370
Issue date
Mar 19, 2024
UNIFLEX Technology Inc.
Cheng-I Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board preparation method
Patent number
11,937,377
Issue date
Mar 19, 2024
SHENNAN CIRCUITS CO., LTD.
Changsheng Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing printed wiring board
Patent number
11,930,601
Issue date
Mar 12, 2024
Ibiden Co., Ltd.
Yuji Kadowaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Composite panel comprising an integrated electrical circuit and man...
Patent number
11,800,641
Issue date
Oct 24, 2023
HUTCHINSON AERONAUTIQUE & INDUSTRIE LTÉE.
Martin Levesque
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Circuit board and manufacturing method thereof and electronic device
Patent number
11,737,209
Issue date
Aug 22, 2023
Unimicron Technology Corp.
Chih-Chiang Lu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing an electronic module and electronic module
Patent number
11,716,816
Issue date
Aug 1, 2023
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing the same
Patent number
11,700,685
Issue date
Jul 11, 2023
Avary Holding (Shenzhen) Co., Limited.
Fu-Yun Shen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing circuit board with high light reflectivity
Patent number
11,696,393
Issue date
Jul 4, 2023
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
Jin-Cheng Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer printed wiring board and method of manufacturing the same
Patent number
11,690,178
Issue date
Jun 27, 2023
Toppan Printing Co., Ltd.
Hiroshi Matsumoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
Patent number
11,605,609
Issue date
Mar 14, 2023
General Electric Company
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit with interposing functionality and meth...
Patent number
11,605,569
Issue date
Mar 14, 2023
AT&SAustria Technologie & Systemtechnik AG
Mikael Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a circuit board
Patent number
11,570,883
Issue date
Jan 31, 2023
Avary Holding (Shenzhen) Co., Limited.
Ying Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring body and method for manufacturing same
Patent number
11,564,313
Issue date
Jan 24, 2023
Nippon Mektron, Ltd.
Fumihiko Matsuda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board structure including a closed cavity
Patent number
11,527,819
Issue date
Dec 13, 2022
Skyworks Solutions, Inc.
Ki Wook Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Catalytic laminate with conductive traces formed during lamination
Patent number
11,477,893
Issue date
Oct 18, 2022
CATLAM, LLC
Kenneth S Bahl
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Multilayer substrate
Patent number
11,375,611
Issue date
Jun 28, 2022
Murata Manufacturing Co., Ltd.
Masaaki Hanao
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method for producing a printed circuit board
Patent number
11,357,105
Issue date
Jun 7, 2022
NextGin Technology BV
J. A. A. M. Tourne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board with high light reflectivity and method for manufactu...
Patent number
11,317,506
Issue date
Apr 26, 2022
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
Jin-Cheng Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method for manufacturing the same
Patent number
11,277,925
Issue date
Mar 15, 2022
Ibiden Co., Ltd.
Toshihide Makino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed wiring board and method for manufacturing printed wiring board
Patent number
11,277,923
Issue date
Mar 15, 2022
Ibiden Co., Ltd.
Yukinobu Mikado
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High-frequency circuit board and method for manufacturing the same
Patent number
11,197,368
Issue date
Dec 7, 2021
Avary Holding (Shenzhen) Co., Limited.
Fu-Yun Shen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing a printed circuit board
Patent number
11,184,977
Issue date
Nov 23, 2021
NextGin Technology BV
J. A. A. M. Tourne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-planar circuit board having reduced z-height
Patent number
11,172,581
Issue date
Nov 9, 2021
Intel Corporation
Eng Huat Goh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package with wall-side capacitors
Patent number
11,158,568
Issue date
Oct 26, 2021
Intel Corporation
Jenny Shio Yin Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module having a multilayered structure with liquid cooled bus...
Patent number
11,152,340
Issue date
Oct 19, 2021
Mitsubishi Electric Corporation
Roberto Mrad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure with high reflectance and method for manufactur...
Patent number
11,147,157
Issue date
Oct 12, 2021
UNIFLEX Technology Inc.
Cheng-I Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure with high reflectance and method for manufactur...
Patent number
11,140,773
Issue date
Oct 5, 2021
UNIFLEX Technology Inc.
Cheng-I Tu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
Publication number
20240138060
Publication date
Apr 25, 2024
Huawei Technologies Co., Ltd
Wei TAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...
Publication number
20240090138
Publication date
Mar 14, 2024
Beji SASAKI
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Multilayer Cores, Variable Width Vias, and Offset Vias
Publication number
20230352383
Publication date
Nov 2, 2023
Avago Technologies International Sales Pte. Limited
Dharmendra Saraswat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20230189452
Publication date
Jun 15, 2023
Samsung Electro-Mechanics Co., Ltd.
Woo Seok YANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED WIRING BOARD MANUFACTURING METHOD AND PROCESSING SYSTEM
Publication number
20230145560
Publication date
May 11, 2023
IBIDEN CO., LTD.
Katsuo KAWAGUCHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230125928
Publication date
Apr 27, 2023
Avary Holding (Shenzhen) Co., Limited.
YING WANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
TRANSPARENT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230089856
Publication date
Mar 23, 2023
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
CHENG-JIA LI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220377873
Publication date
Nov 24, 2022
Avary Holding (Shenzhen) Co., Limited.
YING WANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD
Publication number
20220304153
Publication date
Sep 22, 2022
NextGin Technology BV
J.A.A.M. Tourne
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HIGH LIGHT REFLECTIVITY
Publication number
20220217839
Publication date
Jul 7, 2022
QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
JIN-CHENG WU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING THE SAME
Publication number
20220053629
Publication date
Feb 17, 2022
Avary Holding (Shenzhen) Co., Limited.
FU-YUN SHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BODY AND METHOD FOR MANUFACTURING SAME
Publication number
20220053636
Publication date
Feb 17, 2022
NIPPON MEKTRON, LTD.
Fumihiko Matsuda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD WITH HIGH LIGHT REFLECTIVITY AND METHOD FOR MANUFACTU...
Publication number
20210410279
Publication date
Dec 30, 2021
QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
JIN-CHENG WU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HIGH-FREQUENCY CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20210385939
Publication date
Dec 9, 2021
Avary Holding (Shenzhen) Co., Limited.
FU-YUN SHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
Publication number
20210329788
Publication date
Oct 21, 2021
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Publication number
20210176870
Publication date
Jun 10, 2021
IBIDEN CO., LTD.
Yukinobu MIKADO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Publication number
20210076507
Publication date
Mar 11, 2021
STEMCO CO., LTD.
Jae Soo LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP-STACK STRUCTURE
Publication number
20210057368
Publication date
Feb 25, 2021
United Microelectronics Corp.
Ming-Tse Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20210059058
Publication date
Feb 25, 2021
Avary Holding (Shenzhen) Co., Limited.
HSIAO-TING HSU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
Publication number
20210022252
Publication date
Jan 21, 2021
CATLAM LLC
Kenneth S BAHL
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
HYBRID CARRIER BOARD AND MANUFACTURING METHOD, ASSEMBLY, AND OPTICA...
Publication number
20210014965
Publication date
Jan 14, 2021
InnoLight Technology (Suzhou) Ltd.
Xigui FANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20200413544
Publication date
Dec 31, 2020
Avary Holding (Shenzhen) Co., Limited.
LIN-JIE GAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20200365500
Publication date
Nov 19, 2020
Advanced Semiconductor Engineering, Inc.
Wen Hung HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROBOT APPARATUS AND METHOD OF MANUFACTURINGG ELECTRONIC APPARATUS
Publication number
20200352037
Publication date
Nov 5, 2020
SONY CORPORATION
YUJI KOBORI
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20200337156
Publication date
Oct 22, 2020
Toppan Printing Co., Ltd.
Hiroshi MATSUMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for Embedding a Component in a Printed Circuit Board
Publication number
20200323081
Publication date
Oct 8, 2020
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Timo Schwarz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20200296841
Publication date
Sep 17, 2020
IBIDEN CO., LTD.
Toshihide MAKINO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit Board with Improved Thermal, Moisture Resistance, and Elect...
Publication number
20200288569
Publication date
Sep 10, 2020
OSI Electronics, Inc.
Robert Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
Publication number
20200187358
Publication date
Jun 11, 2020
IMBERATEK, LLC
Antti Iihola
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
Publication number
20200185349
Publication date
Jun 11, 2020
GENERAL ELECTRIC COMPANY
Arun Virupaksha Gowda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR