characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Industry

CPC
H05K3/4602

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4602characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 11,997,801
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board and manufacturing method therefor
- Patent number 11,956,904
- Issue date Apr 9, 2024
- STEMCO CO., LTD.
- Jae Soo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a substrate structure with high reflectance
- Patent number 11,937,370
- Issue date Mar 19, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite panel comprising an integrated electrical circuit and man...
- Patent number 11,800,641
- Issue date Oct 24, 2023
- HUTCHINSON AERONAUTIQUE & INDUSTRIE LTÉE.
- Martin Levesque
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,737,209
- Issue date Aug 22, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing the same
- Patent number 11,700,685
- Issue date Jul 11, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board with high light reflectivity
- Patent number 11,696,393
- Issue date Jul 4, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Jin-Cheng Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit with interposing functionality and meth...
- Patent number 11,605,569
- Issue date Mar 14, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,570,883
- Issue date Jan 31, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring body and method for manufacturing same
- Patent number 11,564,313
- Issue date Jan 24, 2023
- Nippon Mektron, Ltd.
- Fumihiko Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,527,819
- Issue date Dec 13, 2022
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 11,477,893
- Issue date Oct 18, 2022
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer substrate
- Patent number 11,375,611
- Issue date Jun 28, 2022
- Murata Manufacturing Co., Ltd.
- Masaaki Hanao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing a printed circuit board
- Patent number 11,357,105
- Issue date Jun 7, 2022
- NextGin Technology BV
- J. A. A. M. Tourne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with high light reflectivity and method for manufactu...
- Patent number 11,317,506
- Issue date Apr 26, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Jin-Cheng Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,277,925
- Issue date Mar 15, 2022
- Ibiden Co., Ltd.
- Toshihide Makino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,277,923
- Issue date Mar 15, 2022
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency circuit board and method for manufacturing the same
- Patent number 11,197,368
- Issue date Dec 7, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board
- Patent number 11,184,977
- Issue date Nov 23, 2021
- NextGin Technology BV
- J. A. A. M. Tourne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-planar circuit board having reduced z-height
- Patent number 11,172,581
- Issue date Nov 9, 2021
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with wall-side capacitors
- Patent number 11,158,568
- Issue date Oct 26, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having a multilayered structure with liquid cooled bus...
- Patent number 11,152,340
- Issue date Oct 19, 2021
- Mitsubishi Electric Corporation
- Roberto Mrad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with high reflectance and method for manufactur...
- Patent number 11,147,157
- Issue date Oct 12, 2021
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
- Publication number 20240422899
- Publication date Dec 19, 2024
- Intel Corporation
- Srinivas B REDDY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Continuously Extending Vertical Connection S...
- Publication number 20240422907
- Publication date Dec 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus LEITGEB
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240407099
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSIT...
- Publication number 20240334597
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240258121
- Publication date Aug 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240224420
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Woo KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222250
- Publication date Jul 4, 2024
- Siliconware Precision Industries Co., Ltd.
- Jun-Hao FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20240188227
- Publication date Jun 6, 2024
- DAI NIPPON PRINTING CO., LTD.
- Keita IIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR PHASED ARRAY ANTENNA TRANSCEIVER ASSEMBLY...
- Publication number 20240179852
- Publication date May 30, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Li CHEN
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240138060
- Publication date Apr 25, 2024
- Huawei Technologies Co., Ltd
- Wei TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...
- Publication number 20240090138
- Publication date Mar 14, 2024
- Beji SASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Multilayer Cores, Variable Width Vias, and Offset Vias
- Publication number 20230352383
- Publication date Nov 2, 2023
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230189452
- Publication date Jun 15, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Woo Seok YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD MANUFACTURING METHOD AND PROCESSING SYSTEM
- Publication number 20230145560
- Publication date May 11, 2023
- IBIDEN CO., LTD.
- Katsuo KAWAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230125928
- Publication date Apr 27, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230089856
- Publication date Mar 23, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377873
- Publication date Nov 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD
- Publication number 20220304153
- Publication date Sep 22, 2022
- NextGin Technology BV
- J.A.A.M. Tourne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HIGH LIGHT REFLECTIVITY
- Publication number 20220217839
- Publication date Jul 7, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- JIN-CHENG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING THE SAME
- Publication number 20220053629
- Publication date Feb 17, 2022
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20220053636
- Publication date Feb 17, 2022
- NIPPON MEKTRON, LTD.
- Fumihiko Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH HIGH LIGHT REFLECTIVITY AND METHOD FOR MANUFACTU...
- Publication number 20210410279
- Publication date Dec 30, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- JIN-CHENG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210385939
- Publication date Dec 9, 2021
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
- Publication number 20210329788
- Publication date Oct 21, 2021
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210176870
- Publication date Jun 10, 2021
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20210076507
- Publication date Mar 11, 2021
- STEMCO CO., LTD.
- Jae Soo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP-STACK STRUCTURE
- Publication number 20210057368
- Publication date Feb 25, 2021
- United Microelectronics Corp.
- Ming-Tse Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210059058
- Publication date Feb 25, 2021
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Method of fabricating a substrate with metal reflection layer

Printed circuit board structure including a closed cavity

Multilayer circuit board and manufacturing method therefor

Method for manufacturing a substrate structure with high reflectance

Circuit board preparation method

Method for manufacturing printed wiring board

Composite panel comprising an integrated electrical circuit and man...

Circuit board and manufacturing method thereof and electronic device

Method for manufacturing an electronic module and electronic module

Method for manufacturing the same

Method for manufacturing circuit board with high light reflectivity

Multilayer printed wiring board and method of manufacturing the same

Ultra-thin embedded semiconductor device package and method of manu...

Packaged integrated circuit with interposing functionality and meth...

Method for manufacturing a circuit board

Wiring body and method for manufacturing same

Printed circuit board structure including a closed cavity

Catalytic laminate with conductive traces formed during lamination

Multilayer substrate

Method for producing a printed circuit board

Circuit board with high light reflectivity and method for manufactu...

Wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing printed wiring board

High-frequency circuit board and method for manufacturing the same

Method for producing a printed circuit board

Multi-planar circuit board having reduced z-height

Package with wall-side capacitors

Power module having a multilayered structure with liquid cooled bus...

Substrate structure with high reflectance and method for manufactur...

Patents Applicationslast 30 patents

ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD

Component Carrier With Continuously Extending Vertical Connection S...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSIT...

HEAT SPREADER FOR MODIFIED EDGE COOLING

ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD T...

PRINTED CIRCUIT BOARD

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

PRINTED CIRCUIT BOARD FOR PHASED ARRAY ANTENNA TRANSCEIVER ASSEMBLY...

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...

Multilayer Cores, Variable Width Vias, and Offset Vias

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD MANUFACTURING METHOD AND PROCESSING SYSTEM

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

TRANSPARENT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HIGH LIGHT REFLECTIVITY

METHOD FOR MANUFACTURING THE SAME

WIRING BODY AND METHOD FOR MANUFACTURING SAME

CIRCUIT BOARD WITH HIGH LIGHT REFLECTIVITY AND METHOD FOR MANUFACTU...

HIGH-FREQUENCY CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

MULTILAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

CHIP-STACK STRUCTURE

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME