characterized by laminating only or mainly similar double-sided circuit boards

Industry

CPC
H05K3/462

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/462characterized by laminating only or mainly similar double-sided circuit boards

Industries

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Testing substrate and manufacturing method thereof and probe card
- Patent number 12,108,543
- Issue date Oct 1, 2024
- Hermes Testing Solutions Inc.
- Chiao-Pei Chen
- G01 - MEASURING TESTING
Information Patent Grant
Millimeter thick magnetic PCB with high relative permeability and d...
- Patent number 12,094,630
- Issue date Sep 17, 2024
- Winchester Technologies, LLC
- Nian-Xiang Sun
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible circuit board
- Patent number 12,082,352
- Issue date Sep 3, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,058,811
- Issue date Aug 6, 2024
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carriers connected by staggered interconnect elements
- Patent number 12,052,824
- Issue date Jul 30, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,004,292
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for removing undesired metal within vias from p...
- Patent number 11,997,800
- Issue date May 28, 2024
- TTM Technologies, Inc.
- Mace Lehrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,956,897
- Issue date Apr 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 11,950,360
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via bond attachment
- Patent number 11,950,378
- Issue date Apr 2, 2024
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for multilayer printed-wiring board
- Patent number 11,930,594
- Issue date Mar 12, 2024
- Resonac Corporation
- Aya Kasahara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated electronic component
- Patent number 11,887,764
- Issue date Jan 30, 2024
- Murata Manufacturing Co., Ltd.
- Yutaka Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, method of manufacturing same, and prob...
- Patent number 11,852,655
- Issue date Dec 26, 2023
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,785,707
- Issue date Oct 10, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,785,724
- Issue date Oct 10, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for measuring eccentricity of blind via hole f...
- Patent number 11,769,270
- Issue date Sep 26, 2023
- SMART RADAR SYSTEM, INC.
- Jae Yong Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,744,023
- Issue date Aug 29, 2023
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20240393686
- Publication date Nov 28, 2024
- Resonac Corporation
- Hideyuki KATAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240324100
- Publication date Sep 26, 2024
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MA...
- Publication number 20240324105
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kentaro IWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carriers Connected by Staggered Interconnect Elements
- Publication number 20240314931
- Publication date Sep 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Abderrazzaq IFIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING ANTENNA
- Publication number 20240291149
- Publication date Aug 29, 2024
- LG ELECTRONICS INC.
- Seungmin WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20240282687
- Publication date Aug 22, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240260181
- Publication date Aug 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME
- Publication number 20240224421
- Publication date Jul 4, 2024
- TOPPAN Holdings Inc.
- Ryoma TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240138060
- Publication date Apr 25, 2024
- Huawei Technologies Co., Ltd
- Wei TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METH...
- Publication number 20240079303
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240032208
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED WIRING BOARD
- Publication number 20230413452
- Publication date Dec 21, 2023
- Shinko Electric Industries Co., Ltd.
- Shota MIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20230389172
- Publication date Nov 30, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...
- Publication number 20230380056
- Publication date Nov 23, 2023
- Sumitomo Electric Industries, Ltd.
- Taichi MISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL CONNECTION BETWEEN PRINTED CIRCUIT BOARD AND BASE PLATE WIT...
- Publication number 20230352861
- Publication date Nov 2, 2023
- Vitesco Technologies USA, LLC
- Uwe Stephan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
- Publication number 20230328901
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20230309219
- Publication date Sep 28, 2023
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPONENT-CONTAINING SUBSTRATE
- Publication number 20230300990
- Publication date Sep 21, 2023
- Shinko Electric Industries Co., Ltd.
- Takao KOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
- Publication number 20230282406
- Publication date Sep 7, 2023
- Murata Manufacturing Co., Ltd.
- Kouhei MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MEASURING ECCENTRICITY OF BLIND VIA HOLE F...
- Publication number 20230252665
- Publication date Aug 10, 2023
- SMART RADAR SYSTEM, INC.
- Jae Yong LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20230238197
- Publication date Jul 27, 2023
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PROBE CARD
- Publication number 20230217600
- Publication date Jul 6, 2023
- HERMES TESTING SOLUTIONS INC.
- Chiao-Pei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT
- Publication number 20230209727
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chang Ho SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20230189440
- Publication date Jun 15, 2023
- Nitto Denko Corporation
- Kanayo SAWASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230141412
- Publication date May 11, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

characterized by laminating only or mainly similar double-sided circuit boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin composition, resin sheet, multilayer printed wiring board, an...

Semi-flex component carrier with dielectric material surrounding an...

Resin multilayer substrate and method for manufacturing resin multi...

Testing substrate and manufacturing method thereof and probe card

Millimeter thick magnetic PCB with high relative permeability and d...

Flexible circuit board

Multilayer board and manufacturing method thereof

Circuit board having laminated build-up layers

Devices and methods related to metallization of ceramic substrates...

Component carriers connected by staggered interconnect elements

Manufacturing method of circuit board

Resin multilayer substrate and method for manufacturing resin multi...

Methods of forming flexible interconnect circuits

Printed circuit board

Systems and methods for removing undesired metal within vias from p...

Laminated circuit board

Methods of forming interconnect circuits

Semiconductor package device and method of manufacturing the same

Method for manufacturing ceramic substrate and ceramic substrate

Via bond attachment

Circuit board preparation method

Adhesive film for multilayer printed-wiring board

Method for manufacturing printed wiring board

Laminated electronic component

Multilayer wiring substrate, method of manufacturing same, and prob...

Circuit board and manufacturing method thereof and electronic device

Planar coil element and method for producing planar coil element

Method and apparatus for measuring eccentricity of blind via hole f...

Dual conductor laminated substrate

Multilayer printed wiring board and method of manufacturing the same

Patents Applicationslast 30 patents

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MA...

Component Carriers Connected by Staggered Interconnect Elements

ELECTRONIC DEVICE HAVING ANTENNA

MANUFACTURING METHOD OF CIRCUIT BOARD

Interconnect Circuit Methods And Devices

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

INTERCONNECT CIRCUIT METHODS AND DEVICES

SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METH...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

LAMINATED WIRING BOARD

MANUFACTURING METHOD OF CIRCUIT BOARD

OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...

THERMAL CONNECTION BETWEEN PRINTED CIRCUIT BOARD AND BASE PLATE WIT...

METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

COMPONENT-CONTAINING SUBSTRATE

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

METHOD AND APPARATUS FOR MEASURING ECCENTRICITY OF BLIND VIA HOLE F...

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

TESTING SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PROBE CARD

METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

PRINTED CIRCUIT BOARD