characterized by methods of formation other than PVD, CVD or deposition from a liquids

Industry

CPC
H01L21/76867

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76867characterized by methods of formation other than PVD, CVD or deposition from a liquids

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 12,211,794
- Issue date Jan 28, 2025
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing recessed gate structure with protection layer
- Patent number 12,211,905
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed gate strcutre with protection layer
- Patent number 12,080,773
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zincating and doping of metal liner for liner passivation and adhes...
- Patent number 11,984,354
- Issue date May 14, 2024
- Lam Research Corporation
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating pattern collapse
- Patent number 11,961,761
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion layers in metal interconnects
- Patent number 11,901,225
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure manufacturing method
- Patent number 11,862,516
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Huiwen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for interconnect structure
- Patent number 11,854,870
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with chamfered capacitor connection line ad...
- Patent number 11,800,699
- Issue date Oct 24, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,728,298
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping control of metal nitride films
- Patent number 11,587,829
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 11,569,362
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ming Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses having an interconnect extending from an upper conducti...
- Patent number 11,502,006
- Issue date Nov 15, 2022
- Micron Technology, Inc.
- Nanae Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and formation thereof
- Patent number 11,444,028
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hong-Mao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with self-aligned conductiv...
- Patent number 11,404,367
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid dielectric scheme for varying liner thickness and manganese...
- Patent number 11,348,872
- Issue date May 31, 2022
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure without barrier layer on bottom surface of via
- Patent number 11,322,391
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tz-Jun Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 11,276,644
- Issue date Mar 15, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices employing a barrier layer
- Patent number 11,264,321
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Hsueh Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of forming the semiconductor device
- Patent number 11,171,049
- Issue date Nov 9, 2021
- Infineon Technologies AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,133,248
- Issue date Sep 28, 2021
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Hyunyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,133,276
- Issue date Sep 28, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,081,454
- Issue date Aug 3, 2021
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of metallic films on metallic surfaces
- Patent number 11,056,385
- Issue date Jul 6, 2021
- ASM International N.V.
- Suvi P. Haukka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hybrid dielectric scheme for varying liner thickness and manganese...
- Patent number 10,978,393
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating pattern collapse
- Patent number 10,950,495
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Schemes for forming barrier layers for copper in interconnect struc...
- Patent number 10,943,867
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping control of metal nitride films
- Patent number 10,910,263
- Issue date Feb 2, 2021
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free metallic interconnect structures with self-formed diffusi...
- Patent number 10,903,116
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL IMPLANTATION TO BARRIER OR LINER FOR INTERCONNECT
- Publication number 20250062160
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379425
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Method, Apparatus, and System
- Publication number 20240363405
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Masato SAKAMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240282800
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Takekazu Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYER
- Publication number 20240258381
- Publication date Aug 1, 2024
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING PATTERN COLLAPSE
- Publication number 20240258163
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20240203786
- Publication date Jun 20, 2024
- Tahoe Research, Ltd.
- Hui Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
- Publication number 20240113024
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MAT...
- Publication number 20240112951
- Publication date Apr 4, 2024
- Intel Corporation
- Philip Yashar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH
- Publication number 20230386915
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD FOR INTERCONNECT STRUCTURE
- Publication number 20230386898
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343735
- Publication date Oct 26, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYER
- Publication number 20230261061
- Publication date Aug 17, 2023
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20230170397
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM...
- Publication number 20230092242
- Publication date Mar 23, 2023
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION LAYERS IN METAL INTERCONNECTS
- Publication number 20230077737
- Publication date Mar 16, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD FOR INTERCONNECT STRUCTURE
- Publication number 20230067300
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES
- Publication number 20220359380
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20220310624
- Publication date Sep 29, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jingwen LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20220277994
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure without Barrier Layer on Bottom Surface of Via
- Publication number 20220262675
- Publication date Aug 18, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tz-Jun Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF STRAY RUTHENIUM METAL NUCLEI FOR SELECTIVE RUTHENIUM MET...
- Publication number 20220254683
- Publication date Aug 11, 2022
- TOKYO ELECTRON LIMITED
- Omid Zandi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20220246534
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD
- Publication number 20220122882
- Publication date Apr 21, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Huiwen TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SEAM REDUCTION OR ELIMINATION
- Publication number 20220108916
- Publication date Apr 7, 2022
- Applied Materials, Inc.
- Yixiong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210391287
- Publication date Dec 16, 2021
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING PATTERN COLLAPSE
- Publication number 20210202306
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZINCATING AND DOPING OF METAL LINER FOR LINER PASSIVATION AND ADHES...
- Publication number 20210166971
- Publication date Jun 3, 2021
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS

characterized by methods of formation other than PVD, CVD or deposition from a liquids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuits and methods for forming thin film crystal layers

Method for preparing recessed gate structure with protection layer

Recessed gate strcutre with protection layer

Zincating and doping of metal liner for liner passivation and adhes...

Mitigating pattern collapse

Diffusion layers in metal interconnects

Rework for metal interconnects using etch and thermal anneal

Semiconductor structure manufacturing method

Etch method for interconnect structure

Semiconductor structure with chamfered capacitor connection line ad...

Semiconductor device and method for manufacturing the same

Doping control of metal nitride films

Semiconductor device and a method for fabricating the same

Apparatuses having an interconnect extending from an upper conducti...

Contact structure and formation thereof

Method for forming semiconductor device with self-aligned conductiv...

Hybrid dielectric scheme for varying liner thickness and manganese...

Interconnect structure without barrier layer on bottom surface of via

Integrated circuits and methods for forming thin film crystal layers

Semiconductor devices employing a barrier layer

Semiconductor device and a method of forming the semiconductor device

Semiconductor structure and method for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Selective formation of metallic films on metallic surfaces

Hybrid dielectric scheme for varying liner thickness and manganese...

Mitigating pattern collapse

Schemes for forming barrier layers for copper in interconnect struc...

Doping control of metal nitride films

Void-free metallic interconnect structures with self-formed diffusi...

Patents Applicationslast 30 patents

METAL IMPLANTATION TO BARRIER OR LINER FOR INTERCONNECT

LOW-RESISTANCE COPPER INTERCONNECTS

CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

Substrate Processing Method, Apparatus, and System

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYER

MITIGATING PATTERN COLLAPSE

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MAT...

METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH

ETCH METHOD FOR INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PREPARING RECESSED GATE STRUCTURE WITH PROTECTION LAYER

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM...

DIFFUSION LAYERS IN METAL INTERCONNECTS

ETCH METHOD FOR INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

Interconnect Structure without Barrier Layer on Bottom Surface of Via

REMOVAL OF STRAY RUTHENIUM METAL NUCLEI FOR SELECTIVE RUTHENIUM MET...

LOW-RESISTANCE COPPER INTERCONNECTS

SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD

METHODS AND APPARATUS FOR SEAM REDUCTION OR ELIMINATION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MITIGATING PATTERN COLLAPSE

ZINCATING AND DOPING OF METAL LINER FOR LINER PASSIVATION AND ADHES...