Chemical mechanical polishing [CMP]

Industry

CPC
H01L2224/11616

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11616Chemical mechanical polishing [CMP]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,862,587
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Mark Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming of bump structure
- Patent number 11,329,018
- Issue date May 10, 2022
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias using silicon on insulator substrate
- Patent number 11,257,744
- Issue date Feb 22, 2022
- Micron Technology, Inc.
- Toshiyuki Maenosono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on package structure and method
- Patent number 10,964,666
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with pillar-shaped components
- Patent number 10,957,638
- Issue date Mar 23, 2021
- Lapis Semiconductor Co., Ltd.
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,796,958
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,777,454
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,651,086
- Issue date May 12, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical gallium nitride Schottky diode
- Patent number 10,573,762
- Issue date Feb 25, 2020
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on package structure and method
- Patent number 10,510,717
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,446,514
- Issue date Oct 15, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with pillar-shaped components
- Patent number 10,424,537
- Issue date Sep 24, 2019
- Lapis Semiconductor Co., Ltd.
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 10,340,226
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Termination structure for gallium nitride Schottky diode including...
- Patent number 10,333,006
- Issue date Jun 25, 2019
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,068,865
- Issue date Sep 4, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Termination structure for gallium nitride Schottky diode
- Patent number 10,038,106
- Issue date Jul 31, 2018
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,020,236
- Issue date Jul 10, 2018
- Taiwan Semiconductar Manufacturing Campany
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure for metal pillars
- Patent number 9,972,604
- Issue date May 15, 2018
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 9,953,948
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with pillar-shaped components
- Patent number 9,721,879
- Issue date Aug 1, 2017
- LAPIS SEMICONDUCTOR CO., LTD.
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on package structure and method
- Patent number 9,704,826
- Issue date Jul 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,673,147
- Issue date Jun 6, 2017
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal-to-metal direct bonding
- Patent number 9,640,509
- Issue date May 2, 2017
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 9,496,235
- Issue date Nov 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,355,974
- Issue date May 31, 2016
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICRO BUMP, METHOD FOR FORMING MICRO BUMP, CHIP INTERCONNECTION STR...
- Publication number 20230005869
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING OF BUMP STRUCTURE
- Publication number 20210125950
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DETERMINING ENDPOINTS FOR CHEMICAL MECHAN...
- Publication number 20210057292
- Publication date Feb 25, 2021
- Applied Materials, Inc.
- PRAYUDI LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210028134
- Publication date Jan 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Mark GERBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH PILLAR-SHAPED COMPONENTS
- Publication number 20190363041
- Publication date Nov 28, 2019
- LAPIS Semiconductor Co., Ltd.
- OSAMU KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20190109108
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20180374751
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Package Structure and Method
- Publication number 20180374822
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337154
- Publication date Nov 22, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180337091
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dam for Three-Dimensional Integrated Circuit
- Publication number 20180323118
- Publication date Nov 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINATION STRUCTURE FOR GALLIUM NITRIDE SCHOTTKY DIODE INCLUDING...
- Publication number 20180323315
- Publication date Nov 8, 2018
- ALPHA & OMEGA SEMICONDUCTOR, INC
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180315655
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Package Structure and Method
- Publication number 20170309596
- Publication date Oct 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINATION STRUCTURE FOR GALLIUM NITRIDE SCHOTTKY DIODE
- Publication number 20170301800
- Publication date Oct 19, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH PILLAR-SHAPED COMPONENTS
- Publication number 20170287824
- Publication date Oct 5, 2017
- LAPIS Semiconductor Co., Ltd.
- OSAMU KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTING MISSHAPED SOLDER BALLS
- Publication number 20160043048
- Publication date Feb 11, 2016
- GLOBALFOUNDRIES INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH PILLAR-SHAPED COMPONENTS
- Publication number 20160013145
- Publication date Jan 14, 2016
- OSAMU KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Design for Conductive Bump
- Publication number 20140361432
- Publication date Dec 11, 2014
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Fabricating Fine-Pitch Micro-Bumps
- Publication number 20140342545
- Publication date Nov 20, 2014
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH PILLAR-SHAPED COMPONENTS
- Publication number 20130270697
- Publication date Oct 17, 2013
- LAPIS SEMICONDUTOR CO., LTD.
- OSAMU KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20130207239
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130026649
- Publication date Jan 31, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Design for Conductive Bump
- Publication number 20130020698
- Publication date Jan 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120256311
- Publication date Oct 11, 2012
- Hitachi, Ltd.
- Kenichi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20120193752
- Publication date Aug 2, 2012
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS

Chemical mechanical polishing [CMP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure and method of manufacturing the same

Forming of bump structure

Method of forming vias using silicon on insulator substrate

Interconnect crack arrestor structure and methods

Chip on package structure and method

Device with pillar-shaped components

Dam for three-dimensional integrated circuit

Metal bonding pads for packaging applications

3D integration method using SOI substrates and structures produced...

3D integration method using SOI substrates and structures produced...

3D integration method using SOI substrates and structures produced...

Expanded head pillar for bump bonds

Vertical gallium nitride Schottky diode

Chip on package structure and method

Combing bump structure and manufacturing method thereof

Device with pillar-shaped components

Metal bonding pads for packaging applications

Interconnect crack arrestor structure and methods

Termination structure for gallium nitride Schottky diode including...

Combing bump structure and manufacturing method thereof

Termination structure for gallium nitride Schottky diode

Dam for three-dimensional integrated circuit

Joint structure for metal pillars

Pillar design for conductive bump

Device with pillar-shaped components

Chip on package structure and method

Semiconductor device and manufacturing method thereof

Advanced metal-to-metal direct bonding

Pillar design for conductive bump

Semiconductor device and manufacturing method therefor

Patents Applicationslast 30 patents

MICRO BUMP, METHOD FOR FORMING MICRO BUMP, CHIP INTERCONNECTION STR...

FORMING OF BUMP STRUCTURE

METHODS AND APPARATUS FOR DETERMINING ENDPOINTS FOR CHEMICAL MECHAN...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

EXPANDED HEAD PILLAR FOR BUMP BONDS

DEVICE WITH PILLAR-SHAPED COMPONENTS

Interconnect Crack Arrestor Structure and Methods

METAL BONDING PADS FOR PACKAGING APPLICATIONS

EXPANDED HEAD PILLAR FOR BUMP BONDS

Novel 3D Integration Method Using SOI Substrates and Structures Pro...

Chip on Package Structure and Method

COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

Dam for Three-Dimensional Integrated Circuit

TERMINATION STRUCTURE FOR GALLIUM NITRIDE SCHOTTKY DIODE INCLUDING...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

Chip on Package Structure and Method

TERMINATION STRUCTURE FOR GALLIUM NITRIDE SCHOTTKY DIODE

DEVICE WITH PILLAR-SHAPED COMPONENTS

PREVENTING MISSHAPED SOLDER BALLS

DEVICE WITH PILLAR-SHAPED COMPONENTS

Pillar Design for Conductive Bump

Techniques for Fabricating Fine-Pitch Micro-Bumps

DEVICE WITH PILLAR-SHAPED COMPONENTS

Interconnect Crack Arrestor Structure and Methods

TSV PILLAR AS AN INTERCONNECTING STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Pillar Design for Conductive Bump

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Novel 3D Integration Method Using SOI Substrates and Structures Pro...